Patents by Inventor Yuan Yang

Yuan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11993950
    Abstract: Example embodiments provide mechanical dampers. The mechanical dampers may be applied to dissipate energy in a structure that arises for example from a dynamic load such as seismic activity, vehicle impact, vibration of the structure, wind forces, an explosion, etc. The damper comprises a pair of clamping plates. A shear plate is held between the clamping plates. The shear plate is movable in transverse directions relative to the clamping plates. The damper also comprises a conical wedge coupled between one of the clamping plates and the shear plate. The conical wedge comprises a female conical element and a male conical element that projects into a conical indentation of the female conical element.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: May 28, 2024
    Assignee: The University of British Columbia
    Inventors: Tsung Yuan Yang, Hengchao Xu, Lisa Tobber
  • Patent number: 11990401
    Abstract: A device structure according to the present disclosure includes a passivation layer, a first conductor plate layer disposed on the passivation layer, a second conductor plate layer disposed over the first conductor layer, a third conductor plate layer disposed over the second conductor layer, and a fourth conductor plate layer disposed over the third conductor layer. The second conductor plate layer encloses the first conductor plate layer and the fourth conductor plate layer encloses the third conductor plate layer. The device structure, when used in a back-end-of-line passive device, reduces leakage and breakdown due to corner discharge effect.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Chen-Chiu Huang, Dian-Hau Chen
  • Publication number: 20240148788
    Abstract: The present invention relates to a method for treatment of sepsis in a subject comprising administering a pharmaceutical composition comprising an effective amount of allogeneic Natural Killer cells to said subject, and to methods for predicting a subject's susceptibility to such method of treatment.
    Type: Application
    Filed: March 23, 2022
    Publication date: May 9, 2024
    Inventors: Yuan Yang, Jingling Tang, Pingsheng Hu, Xiaoyang Li, Liyun Wu
  • Publication number: 20240154367
    Abstract: A connector assembly includes a guiding shield cage and a heat sink module. The guiding shield cage has an inserting passageway. The heat sink module includes a heat sink, a force applying spring, a rotating member and a supporting spring. The heat sink has a thermal coupling portion which is positioned to a bottom portion of the heat sink and a force applying spring acting portion. The force applying spring has an elastic arm and a bottom arm, the elastic arm is used to downwardly act to the bottom arm, the bottom arm is used to downwardly act to the force applying spring acting portion. The rotating member has a first rod and a second rod, the first rod is used to extend into the inserting passageway, the second rod is used to act to the elastic arm of the force applying spring.
    Type: Application
    Filed: October 20, 2023
    Publication date: May 9, 2024
    Inventor: Che-Yuan Yang
  • Publication number: 20240143050
    Abstract: A portable electronic device includes a housing, a heat-dissipation component, a bracket, a door structure, a driving mechanism, and a driven linkage. The housing includes a heat-dissipation opening disposed in the housing. The bracket is disposed in the housing and surrounds the heat-dissipation component. The door structure is configured to move between a closed position covering the heat-dissipation opening and an open position exposing the heat-dissipation opening. The driving mechanism is coupled between the bracket and the door structure to drive the door structure to rotate and move. The driven linkage is coupled between the bracket and the door structure. When the door structure is driven to rotate and move, the door structure drives the driven linkage to rotate and move, so that the driven linkage and the driving mechanism jointly drive the door structure to move between the closed position and the open position.
    Type: Application
    Filed: June 13, 2023
    Publication date: May 2, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Cheng-Han Chung, Hung-Yueh Chen, Ching-Yuan Yang
  • Publication number: 20240142339
    Abstract: The present disclosure relates to metrology measurement systems, and related methods. In one or more embodiments a system, includes a substrate support, and an optical arm. The optical arm includes a light source operable to project a first beam on a first light path. The optical arm also includes a first lens, a first beam splitter, a second lens, a first detector, and an aperture. The first lens is disposed on the first light path and between the substrate support and the light source. The first beam splitter is disposed on the first light path. The first beam splitter is positioned between the substrate support and the light source. The first detector is disposed on the second light path. The second lens focuses the second beam to a second beam diameter. The aperture is disposed between the second lens and the first detector.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: Yangyang SUN, Jinxin FU, Ravi KOMANDURI, Chi-Yuan YANG
  • Publication number: 20240138018
    Abstract: A user equipment assistance information (UAI) negotiation method, for a user equipment (UE) of mobile communication includes receiving a first OtherConfig element of an RRC reconfiguration message comprising a plurality of configuration parameters with SETUP values from a network terminal; sending a first UAI including a first value of a first configuration parameter of the configuration parameters to the network terminal; and receiving a first RRC reconfiguration message corresponding to the first UAI from the network terminal.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 25, 2024
    Applicant: MediaTek Singapore Pte. Ltd.
    Inventors: Hung-Yueh Chen, Yu-Lun Chang, Byeng Hyun Kim, JUNG SHUP SHIN, Hung-Yuan Yang, Jun-Jie Su, Kyung Hyun Ahn
  • Patent number: 11961880
    Abstract: A semiconductor device includes first and second metal-insulator-metal structures. The first metal-insulator-metal structure includes a first bottom conductor plate, a first portion of a first dielectric layer, a first middle conductor plate, a first portion of a second dielectric layer, and a first top conductor plate stacked up one over another. The second metal-insulator-metal structure includes a second bottom conductor plate, a second portion of the first dielectric layer, a second middle conductor plate, a second portion of the second dielectric layer, and a second top conductor plate stacked up one over another. In a cross-sectional view, the first bottom conductor plate is wider than the first middle conductor plate that is wider than the first top conductor plate, and the second bottom conductor plate is narrower than the second middle conductor plate that is narrower than the first top conductor plate.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yuan-Yang Hsiao, Hsiang-Ku Shen, Tsung-Chieh Hsiao, Ying-Yao Lai, Dian-Hau Chen
  • Patent number: 11952230
    Abstract: A thick document conveying device includes a paper pickup mechanism. The paper pickup mechanism has a pick roller base, a pick roller axle, a pick roller, a switching assembly, a first universal coupling, a driving mechanism, a second universal coupling, a bearing and a gear. The pick roller axle and the pick roller are located in the pick roller base. The switching assembly is located under the pick roller base. The first universal coupling is connected to the pick roller axle. The driving mechanism is sleeved on the first universal coupling. The second universal coupling is connected to the driving mechanism. The bearing is connected to the driving mechanism. The gear is connected to the bearing. As described above, both a thick document and a thin document can be adapted.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: April 9, 2024
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventors: Wei Fong Lin, Yuan Yi Lin, Chih Yuan Yang
  • Patent number: 11943191
    Abstract: Techniques for live location sharing are described. A first mobile device and a second mobile device can communicate with one another using an IM program. The first mobile device can receive a user input to share a location of the first mobile device in the IM program. Sharing the location can include causing the second mobile device to display a location of the first mobile device in an IM program user interface on the second mobile device. Duration of sharing the location can be user-configurable. The second mobile device may or may not share a location of the second device for display in the IM program executing on the first mobile device.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: March 26, 2024
    Assignee: Apple Inc.
    Inventors: Roberto Garcia, Eugene M. Bistolas, Justin Wood, Lawrence Yuan Yang, Scott Lopatin, Richard R. Dellinger
  • Patent number: 11940616
    Abstract: A switchable light transmission module is disclosed that includes a substrate having a first surface defining at least part of an enclosed volume, a porous layer disposed on the first surface and in fluid communication with the enclosed volume, and a reservoir in fluid communication with the enclosed volume. The reservoir is configured to supply a fluid to the sealed volume such that the fluid contacts the porous layer. The fluid has a refractive index that is close to the refractive index of the porous layer, has a high wettability for the porous layer, and does not dissolve the porous layer. When in a dry state, voids in the porous layer are filled with air which has a much different refractive index than the porous layer itself, resulting in a surface that is reflective and not very transmissive.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: March 26, 2024
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Jyotirmoy Mandal, Yuan Yang, Nanfang Yu
  • Publication number: 20240093149
    Abstract: The present invention relates to population of T cells with reduced expression of SIGLEC15, wherein the T cells are derived from sentinel lymph nodes in a subject having a cancer. The invention also relates to methods for obtaining such T cells, as well as to their use in therapy and pharmaceutical compositions comprising such T cells.
    Type: Application
    Filed: December 1, 2021
    Publication date: March 21, 2024
    Inventors: Yuan Yang, Hang Du, Jingling Tang, Pingsheng Hu
  • Publication number: 20240087932
    Abstract: An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Chung TSAI, Ping-Cheng KO, Fang-yu LIU, Jhih-Yuan YANG
  • Publication number: 20240088016
    Abstract: Semiconductor devices, integrated circuits and methods of forming the same are provided. In one embodiment, a semiconductor device includes a metal-insulator-metal structure which includes a bottom conductor plate layer including a first opening and a second opening, a first dielectric layer over the bottom conductor plate layer, a middle conductor plate layer over the first dielectric layer and including a third opening, a first dummy plate disposed within the third opening, and a fourth opening, a second dielectric layer over the middle conductor plate layer, and a top conductor plate layer over the second dielectric layer and including a fifth opening, a second dummy plate disposed within the fifth opening, a sixth opening, and a third dummy plate disposed within the sixth opening. The first opening, the first dummy plate, and the second dummy plate are vertically aligned.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yuan-Yang Hsiao, Hsiang-Ku Shen, Dian-Hau Chen
  • Publication number: 20240085690
    Abstract: A structured material is provided that includes a substrate and a porous structured polymer layer disposed thereon. The porous structured polymer layer includes a plurality of voids, and has a high hemispherical reflectance a high a hemispherical thermal emittance. The structured material is thus particularly advantageous for cool-roof coatings, enabling surfaces coated by the material to stay cool, even under strong sunlight. The material can be produced via structuring of polymers in a mixture including a solvent and a non-solvent. Sequential evaporation of the solvent and the non-solvent provide a polymer layer with the plurality of voids.
    Type: Application
    Filed: August 8, 2023
    Publication date: March 14, 2024
    Applicant: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
    Inventors: Jyotirmoy MANDAL, Yuan YANG, Nanfang YU
  • Patent number: 11923405
    Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen
  • Publication number: 20240064938
    Abstract: A handheld electronic device is provided. The handheld electronic device includes a screen, a back cover, a frame, a main board, and a heat conduction structure. The frame is arranged between the screen and the back cover. The frame and the back cover define a space. The main board is arranged in the space, and includes a front surface and a back surface. The front surface faces the screen and includes a heat source. The heat conduction structure extends from the front surface to the back surface, and includes a first end and a second end opposite to each other. The first end is arranged at the heat source, and the second end extends to the back cover.
    Type: Application
    Filed: February 27, 2023
    Publication date: February 22, 2024
    Inventors: Chien-Feng CHUNG, Ching-Yuan YANG, Chih-Yao KUO, Cheng-Han CHUNG
  • Publication number: 20240060657
    Abstract: A wall-mounted air conditioner includes a housing and a heat exchanger. A front surface of the housing is provided with a first air inlet; the heat exchanger is arranged in the housing and opposite the first air inlet; and the heat exchanger is curved or bent towards the first air inlet.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 22, 2024
    Inventors: Baisong ZHOU, Duode WU, Yuan YANG, Bo LI, Yongqiang WAN, Qiqin SU, Yunchong TU
  • Publication number: 20240060658
    Abstract: A wall-mounted air conditioner includes: a housing, a fan wheel, and a heat exchanger. A first air inlet is formed on the front of the housing, the fan wheel and the heat exchanger are disposed within the housing, at least a portion of the heat exchange is located between the first air inlet and the fan wheel, and the distance between either of upper and lower ends of the heat exchanger and the fan wheel is less than the distance between a middle portion of the heat exchanger and the fan wheel and.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 22, 2024
    Inventors: Baisong ZHOU, Duode WU, Yuan YANG, Bo LI, Yongqiang WAN, Qiqin SU, Yunchong TU
  • Patent number: 11903169
    Abstract: The disclosure provides a portable electronic device, including: a housing, a heat dissipation component, a bracket, a cover structure, and a plurality of pivotal linkage rods. The housing includes a heat dissipation opening. The heat dissipation component is disposed in the housing and corresponds to the heat dissipation opening. The bracket is disposed in the housing and encloses the heat dissipation component. The cover structure is configured to move between a close position covering the heat dissipation opening and an open position exposing the heat dissipation opening. Each of the plurality of pivotal linkage rods is pivotally connected between the bracket and the cover structure, and is configured to be driven to rotate, to drive the cover structure to move between the close position and the open position.
    Type: Grant
    Filed: October 6, 2022
    Date of Patent: February 13, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Cheng-Han Chung, Ching-Yuan Yang, Chui-Hung Chen