Patents by Inventor Yuan Yang
Yuan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250115728Abstract: The present disclosure discloses a method for preparing a polyurethane foam using an extract of cotton spinning black liquor, including the following steps: step (1): extracting biomass in cotton spinning black liquor by acid precipitation to obtain the extract of cotton spinning black liquor; step (2): pretreating the extract of cotton spinning black liquor, and uniformly mixing the pretreated extract of cotton spinning black liquor with a polyether polyol to obtain a mixed raw material; and step (3): preparing the polyurethane foam from the mixed raw material, dibutyltin dilaurate, distilled water, a foam stabilizer, aluminum hypophosphite and an isocyanate by one-step foaming. The present disclosure can solve the problems of high treatment cost and low utilization rate of the existing cotton spinning black liquor.Type: ApplicationFiled: December 21, 2023Publication date: April 10, 2025Inventors: Jianbo Zhao, Xiumin Li, Cuiping Yang, Xuejiao Wang, Yuan Zhang, Chunhui Shi, Lili Huang
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Patent number: 12272679Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a circuit substrate and a plurality of micro light-emitting diode structures. The micro light-emitting diode structures each include a micro light-emitting chip and a molding structure. The micro light-emitting chip is electrically bonded to the circuit substrate, and includes a first surface, a second surface, and a peripheral surface. The first surface is located on a side of the micro light-emitting chip facing the circuit substrate. The second surface is disposed opposite to the first surface. The peripheral surface connects the first surface and the second surface. The molding structure surrounds the peripheral surface and encloses the second surface of the micro light-emitting chip. The molding structure extends in a direction away from the circuit substrate and forms an inner side wall. The inner side wall and the second surface constitute an accommodating portion.Type: GrantFiled: January 6, 2022Date of Patent: April 8, 2025Assignee: PlayNitride Display Co., Ltd.Inventors: Shiang-Ning Yang, Sheng-Yuan Sun, Loganathan Murugan, Yu-Yun Lo, Bo-Wei Wu
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Patent number: 12272715Abstract: Various embodiments of the present disclosure are directed towards an image sensor having a semiconductor substrate comprising a front-side surface opposite a back-side surface. A plurality of photodetectors is disposed in the semiconductor substrate. An isolation structure extends into the back-side surface of the semiconductor substrate and is disposed between adjacent photodetectors. The isolation structure includes a metal core, a conductive liner disposed between the semiconductor substrate and the metal core, and a first dielectric liner disposed between the conductive liner and the semiconductor substrate. The metal core comprises a first metal material and the conductive liner comprises the first metal material and a second metal material different from the first metal material.Type: GrantFiled: June 21, 2021Date of Patent: April 8, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sheng-Chan Li, Hau-Yi Hsiao, Che Wei Yang, Sheng-Chau Chen, Cheng-Yuan Tsai
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Patent number: 12272896Abstract: An example connector assembly includes a guide shielding cage with a cage body and an upper heat sink bracket. The cage body includes upper window. A lower wall of the upper heat sink bracket is formed with a window corresponding to the upper window. The connector assembly also includes an upper heat sink module including a heat dissipating member. The heat dissipating member is capable of moving between a releasing position which is higher and an acting position which is lower relative to the upper insertion space. The cage body further includes fixing pieces positioned at two sides of the top wall and extend upwardly. The lower wall of the upper heat sink bracket engages with the fixing pieces of the cage body, and the upper heat sink bracket further comprises a latching piece which extends from the lower wall and latches into the top wall of the cage body.Type: GrantFiled: September 6, 2023Date of Patent: April 8, 2025Assignee: Molex, LLCInventor: Che-Yuan Yang
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Publication number: 20250111650Abstract: A deep learning method of an artificial intelligence model for medical image recognition is provided. The method includes the following steps: obtaining a first image set, where the first image set includes at least two images captured with different parameters; performing image pre-processing on each image of the first image set to obtain a second image set; performing image augmentation on the second image set to obtain a third image set; adding the third image set to a training image data set; and training the artificial intelligence model using the training image data set.Type: ApplicationFiled: February 15, 2024Publication date: April 3, 2025Inventors: Chia-Yuan CHANG, Chen-Hwa SUNG, Gigin LIN, Tzu-Hsiang YANG, Tzu-Yun WANG, Chien-Yu HUANG
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Patent number: 12268023Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers connected to the source/drain feature, a gate structure between adjacent channel layers and wrapping the channel layers, and an inner spacer between the source/drain feature and the gate structure and between adjacent channel layers. The source/drain feature has a first interface with a first channel layer of the channel layer. The first interface has a convex profile protruding towards the first channel layer.Type: GrantFiled: August 31, 2021Date of Patent: April 1, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Po-Yu Lin, Tzu-Hua Chiu, Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng
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Patent number: 12265774Abstract: Boundary cells may be provided. A boundary of a first functional cell of a circuit is determined. A first plurality of a first type of dummy cells are placed along a first portion of the determined boundary. The first portion extends in a first direction. Each of the first type of dummy cells comprises first pre-defined dimensions. A second plurality of a second type of dummy cells are placed along a second portion of the determined boundary. The second portion extends in a second direction. Each of the second type of dummy cells comprises second pre-defined dimensions. The second pre-defined dimensions is different than the first pre-defined dimensions.Type: GrantFiled: June 8, 2023Date of Patent: April 1, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Jung Chang, Min-Yuan Tsai, Wen-Ju Yang
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Patent number: 12266592Abstract: A semiconductor structure includes a semiconductor substrate and an interconnect structure on the semiconductor structure. The interconnect structure includes a first layer, a second layer over the first layer, a third layer over the second layer, and a fourth layer over the third layer. A first through via extends through the semiconductor substrate, the first layer, and the second layer. A second through via extends through the third layer and the fourth layer. A bottom surface of the second through via contacts a top surface of the first through via.Type: GrantFiled: May 26, 2023Date of Patent: April 1, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yuan-Yang Hsiao, Dian-Hau Chen, Yen-Ming Chen
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Publication number: 20250105238Abstract: A multi-chip package includes a first IC chip; a first sealing layer at a same first horizontal level as the first IC chip; a first silicon-oxide-containing layer over the first IC chip and first sealing layer and across an edge of the first IC chip; a first bonding pad in a first opening in the first silicon-oxide-containing layer, wherein the first bonding pad has a copper layer in the first opening; a second IC chip over the first IC chip; a second sealing layer at a same second horizontal level as the second IC chip; a second silicon-oxide-containing layer under the second IC chip and having a bottom surface bonded to and in contact with a top surface of the first silicon-oxide-containing layer; a second bonding pad under the second IC chip, in a second opening in the second silicon-oxide-containing layer and coupling to the second IC chip, wherein the second bonding pad has a copper layer in the second opening and having a bottom surface bonded to and in contact with a top surface of the copper layer ofType: ApplicationFiled: September 24, 2024Publication date: March 27, 2025Inventors: Mou-Shiung Lin, Jin-Yuan Lee, Ping-Jung Yang
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Publication number: 20250099525Abstract: The present disclosure relates to the technical field of traditional Chinese herbal composition, and in particular to a traditional Chinese herbal composition for the treatment of bacterial vaginosis and a preparation method thereof. The traditional Chinese herbal composition for the treatment of bacterial vaginosis provided by the present disclosure is prepared from the following components in parts by weight: 40-50 parts of Zingiberis Rhizoma Recens, 35-45 parts of Schisandrae Chinensis Fructus, 30-40 parts of Cinnamomi Cortex, 30-40 parts of Artemisiae Argyi Folium, 25-35 parts of Codonopsis Radix, 25-35 parts of a compound traditional Chinese herbal fermentation broth, 20-30 parts of Pulsatillae Radix, 20-25 parts of Lonicerae Japonicae Flos, 15-20 parts of Taraxaci Herba, 15-20 parts of Akebiae Caulis, 10-15 parts of Polygoni Cuspidati Rhizoma et Radix, and 5-10 parts of Atractylodis Macrocephalae Rhizoma.Type: ApplicationFiled: December 6, 2024Publication date: March 27, 2025Applicant: The third people’s hospital of chengduInventors: Jun HOU, Xudong WEN, Tian YUE, Yuan YUAN, Xiao LIU, Jiali YANG, Jian HE, Yue TANG
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Patent number: 12262642Abstract: A method for fabricating magnetoresistive random-access memory cells (MRAM) on a substrate is provided. The substrate is formed with a magnetic tunneling junction (MTJ) layer thereon. When the MTJ layer is etched to form the MRAM cells, there may be metal components deposited on a surface of the MRAM cells and between the MRAM cells. The metal components are then removed by chemical reaction. However, the removal of the metal components may form extra substances on the substrate. A further etching process is then performed to remove the extra substances by physical etching.Type: GrantFiled: November 17, 2023Date of Patent: March 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chang-Lin Yang, Chung-Te Lin, Sheng-Yuan Chang, Han-Ting Lin, Chien-Hua Huang
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Patent number: 12257279Abstract: The present disclosure relates to the technical field of traditional Chinese herbal composition, and in particular to a traditional Chinese herbal composition for the treatment of bacterial vaginosis and a preparation method thereof. The traditional Chinese herbal composition for the treatment of bacterial vaginosis provided by the present disclosure is prepared from the following components in parts by weight: 40-50 parts of Zingiberis Rhizoma Recens, 35-45 parts of Schisandrae Chinensis Fructus, 30-40 parts of Cinnamomi Cortex, 30-40 parts of Artemisiae Argyi Folium, 25-35 parts of Codonopsis Radix, 25-35 parts of a compound traditional Chinese herbal fermentation broth, 20-30 parts of Pulsatillae Radix, 20-25 parts of Lonicerae Japonicae Flos, 15-20 parts of Taraxaci Herba, 15-20 parts of Akebiae Caulis, 10-15 parts of Polygoni Cuspidati Rhizoma et Radix, and 5-10 parts of Atractylodis Macrocephalae Rhizoma.Type: GrantFiled: December 6, 2024Date of Patent: March 25, 2025Assignee: The third people's hospital of chengduInventors: Jun Hou, Xudong Wen, Tian Yue, Yuan Yuan, Xiao Liu, Jiali Yang, Jian He, Yue Tang
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Publication number: 20250094673Abstract: The present disclosure provides a real-time dynamic prediction system and method of a three-dimensional shape of a high-pressure jet grouting pile.Type: ApplicationFiled: June 6, 2023Publication date: March 20, 2025Inventors: Ruixue CAO, Leilei GUO, Zaixing XU, Jinhua HE, Yixian WANG, Bao XU, Panpan GUO, Yuan GAO, Yongli LIU, Jun NIE, Feifei WU, Ruowang YANG, Lianbiao HOU, Dongfang YAO
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Publication number: 20250094887Abstract: The present disclosure provides a method for optimizing parameters of a ladder-type carbon trading mechanism based on an improved particle swarm optimization (IPSO) algorithm. The method first obtains information and operating data of a park-level integrated energy system, establishes equipment models and constraints of the park-level integrated energy system, and establishes a ladder-type carbon trading model; then encapsulates a process of optimized low-carbon dispatching of the park-level integrated energy system as a fitness function whose input is parameters of a carbon trading mechanism and output is a carbon emission of the system; and finally, introduces an IPSO algorithm to optimize the fitness function, and outputs optimization result information of the algorithm. The present disclosure verifies effectiveness and rationality of the model and the method that give full play to a role of the ladder-type carbon trading mechanism in the park-level integrated energy system through example analysis.Type: ApplicationFiled: October 20, 2022Publication date: March 20, 2025Inventors: Quan Chen, Xuanjun Zong, Sheng Zou, Hongwei Zhou, Tao Peng, Weiliang Wang, Wenjia Zhang, Chen Wu, Qun Zhang, Yuan Shen, Wei Feng, Gaofeng Shen, Min Zhang, Kai Yang, Xinyue Kong
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Publication number: 20250095932Abstract: An electronic device includes a casing, an exterior button, a sliding assembly and an internal button. The casing includes an outer surface and an opening at the outer surface. The exterior button has a first side and a second side opposite to each other, the first side is pivotally connected to the casing so that the exterior button is rotatably disposed at the casing. The sliding assembly is movably disposed on the casing, and includes a sliding body, a toggle and a pusher, the sliding body is located in the casing, the toggle is fixed to the sliding body and exposed to the casing, and the pusher is linked with the sliding body in a first direction, and is movably disposed at the sliding body in a second direction. The inner button is located in the casing, and the sliding assembly is located between the outer button and the inner button.Type: ApplicationFiled: August 8, 2024Publication date: March 20, 2025Applicant: ASUSTeK COMPUTER INC.Inventors: Wei-Ting Cheng, Ching-Yuan Yang
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Publication number: 20250097444Abstract: A method of decoding video data performed by an electronic device is provided. The method receives the video data and determines a block unit from a current frame included in the video data. The method determines an extrapolation merge list of the block unit. The extrapolation merge list includes multiple extrapolation merge candidates. The method selects an extrapolation reference candidate from the extrapolation merge candidates for the block unit. Each of the extrapolation merge candidates includes multiple previous extrapolation parameters used to reconstruct a corresponding one of multiple extrapolation-reconstructed blocks. The extrapolation reference candidate is one of the extrapolation merge candidates. The method then determines an extrapolation prediction filter of the block unit based on the extrapolation reference candidate, and reconstructs the block unit based on the extrapolation prediction filter.Type: ApplicationFiled: September 13, 2024Publication date: March 20, 2025Inventors: CHIH-YUAN CHEN, Yu-Chiao Yang
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Publication number: 20250093240Abstract: A method of identifying defects in crystals includes the following steps. A silicon carbide crystal to be identified for defects is sliced to obtain a test piece. An etching process is performed on the test piece. Etching conditions of the etching process includes the following. An etchant including potassium hydroxide is used, and etching is performed at a temperature of 400° C. to 550° C. in an environment where dry air or oxygen is introduced, so as to form etching pits of threading edge dislocations (TED) and threading screw dislocations (TSD) in the test piece. After the etching process is performed, a diameter ratio (TED/TSD) of the etching pits of the threading edge dislocations (TED) and the threading screw dislocations (TSD) observed by an optical microscope in the test piece is in a range of 0.2 to 0.5.Type: ApplicationFiled: July 18, 2024Publication date: March 20, 2025Applicant: GlobalWafers Co., Ltd.Inventors: YewChung Sermon Wu, Bing-Yue Tsui, Tsan-Feng Lu, Cheng-Jui Yang, Chen Yuan Lee
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Publication number: 20250098257Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a first dielectric layer over the substrate. The semiconductor device structure also includes a first metal gate stack and a second metal gate stack over the substrate and the first dielectric layer. The semiconductor device structure further includes a second dielectric layer beside the first metal gate stack and an insulating structure over the substrate. A portion of the insulating structure is between the first metal gate stack and the second metal gate stack. The insulating structure penetrates into the second dielectric layer.Type: ApplicationFiled: December 4, 2024Publication date: March 20, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Hsuan HSIAO, Shu-Yuan KU, Chih-Chang HUNG, I-Wei YANG, Chih-Ming SUN
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Publication number: 20250094151Abstract: Embodiments of the present disclosure provide a solution for deploying a service. A method includes: receiving a deployment request for deploying a service in a content delivery network (CDN) network, the deployment request at least indicating a plurality of clusters of CDN nodes where the service is to be deployed; receiving a base deployment configuration for the plurality of clusters of CDN nodes; receiving at least one deployment configuration overlay specific to at least one of the plurality of clusters of CDN nodes, a deployment configuration overlay specific to a cluster of CDN nodes indicating a delta configuration on top of the base deployment configuration that is applied to the cluster of CDN nodes; and deploying the service in the CDN network based on the base deployment configuration and the at least one deployment configuration overlay.Type: ApplicationFiled: December 2, 2024Publication date: March 20, 2025Inventors: Shuo Liu, Yunsi Mou, Bin Yao, Yang Yang, Yuan-Yi Wang, Yimeng Sun, Jian Wang
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Publication number: 20250092473Abstract: Provided are a recombinase polymerase amplification (RPA)-PAND based enterovirus virus typing detection kit and a rapid sensitive detection method, where the detection kit includes a PfAgo protein three gDNAs (g1/g2/g3), MB and its corresponding gDNA (gMB) combination for specifically detection of enteroviruses EV71, CVA6, CVA10, CVA16 and the universal enterovirus (EVU). RPA-HFMD-PAND rapid nucleic acid detection methods for typing detection of common enterovirus type A pathogens EV71, CVA6, CVA10, CVA16 and enterovirus universal EVU are successfully established based on PfAgo protein mediated target detection in combination with an RPA technology. The method has the advantages of high sensitivity, high specificity, low cost, relatively low position targeting restriction, simple reaction system and no aerosol pollution, and can conduct multi-channel nucleic acid detection.Type: ApplicationFiled: November 27, 2024Publication date: March 20, 2025Inventors: Yanming Dong, Lixin Ma, Xuan Yang, Yuan Wang, Yibin Cheng, Junbo Cao