Patents by Inventor Yu-feng Chen

Yu-feng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149485
    Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.
    Type: Application
    Filed: January 8, 2025
    Publication date: May 8, 2025
    Inventors: Ming-Da Cheng, Yung-Ching Chao, Chun Kai Tzeng, Cheng Jen Lin, Chin Wei Kang, Yu-Feng Chen, Mirng-Ji Lii
  • Patent number: 12260669
    Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
    Type: Grant
    Filed: July 7, 2023
    Date of Patent: March 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
  • Publication number: 20250073574
    Abstract: A vehicle rear seat entertainment integration module is provided, the vehicle rear seat entertainment integration module has a display and a multi-functional remote controller, wherein the top of the display has an accommodating space for storing the multi-functional remote controller to solve the problem of losing the multifunctional remote controller due to the lack of storage space. In addition, the multifunctional remote controller may be used as a game handle to enhance the entertainment value of the rear seat of the vehicle.
    Type: Application
    Filed: August 5, 2024
    Publication date: March 6, 2025
    Inventors: Yu-Feng Chen Lee, Sheng-Yueh Lin
  • Publication number: 20250077170
    Abstract: An audio device and a control method thereof are provided. The audio device includes a first switch, a controller, and multiple audio switches. The first switch is turned on or cut off according to whether an audio jack is on a setting position. A first end of the first switch receives a bias voltage. The controller is coupled to the first switch, and generates control signals according to a turned-on or cut-off status of the first switch. The audio switches are respectively coupled between transmission paths of multiple audio signals. The audio switches are turned on or cut off according to the control signals or a voltage on a second end of the first switch.
    Type: Application
    Filed: September 26, 2023
    Publication date: March 6, 2025
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Yu-Feng Chen, Chun-Yuan Lee
  • Publication number: 20250065817
    Abstract: A quick-release structure and a vehicle rear seat display module using the same are provided. The quick-release structure includes a display docking piece, a fixing bracket docking piece, and a connecting hinge. The display docking piece and the fixing bracket docking piece may move relatively through the connecting hinge, so that a display fixed on the quick-release structure may be adjusted in pitch angle. In addition, the display docking piece also has a rotating mechanism, which makes a display rotate from a horizontal direction to a vertical direction.
    Type: Application
    Filed: August 5, 2024
    Publication date: February 27, 2025
    Inventors: Yu-Feng Chen Lee, Sheng-Yueh Lin
  • Patent number: 12230595
    Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: February 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Da Cheng, Yung-Ching Chao, Chun Kai Tzeng, Cheng Jen Lin, Chin Wei Kang, Yu-Feng Chen, Mirng-Ji Lii
  • Patent number: 12193083
    Abstract: There is provided a wireless device including an earphone set and a charging cradle. The charging cradle is used as means for charging the earphone set. The charging cradle further records connection information of multiple external devices that have been BT connected to the charging cradle. The earphone set receives a connection command from the charging cradle to accordingly form an audio connection to one of the multiple external devices. The charging cradle is further used as a communication medium between the multiple external devices.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: January 7, 2025
    Assignees: PIXART IMAGING INC., AIROHA TECHNOLOGY CORP.
    Inventors: Ping-Shun Zeung, Chih-Wei Sung, Yu-Feng Chen
  • Publication number: 20240386744
    Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 21, 2024
    Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240379584
    Abstract: A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.
    Type: Application
    Filed: July 22, 2024
    Publication date: November 14, 2024
    Inventors: Chih-Hsiang Tseng, Yu-Feng Chen, Cheng Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng, Kuo-Ching Hsu, Hong-Seng Shue, Ming-Hong Cha, Chao-Yi Wang, Mirng-Ji Lii
  • Patent number: 12058101
    Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen
  • Patent number: 11948862
    Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen
  • Publication number: 20230386975
    Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Inventors: Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen
  • Publication number: 20230360426
    Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
    Type: Application
    Filed: July 7, 2023
    Publication date: November 9, 2023
    Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
  • Publication number: 20230343133
    Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
    Type: Application
    Filed: June 28, 2023
    Publication date: October 26, 2023
    Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20230300510
    Abstract: An intermediary device and a wearable bridge are provided. The wearable bridge is detachably assembled with two wireless earbuds, and includes a headband, two ear cups respectively connected to two opposite ends of the headband, and a wireless module. Each ear cup includes an assembling slot and an electrical connector that is arranged in the assembling slot. Each assembling slot can be assembled with one of the two wireless earbuds so as to enable the corresponding electrical connector to be structurally and electrically connected to the one of the two wireless earbuds. The wireless module is electrically coupled to the electrical connector of each of the two ear cups, and the wireless module is configured to transmit sound signals from an external apparatus to the electrical connectors of the two ear cups, so that the two wireless earbuds are allowed to synchronously play.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 21, 2023
    Inventor: YU-FENG CHEN
  • Patent number: 11741737
    Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: August 29, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
  • Publication number: 20230262792
    Abstract: There is provided a wireless device including an earphone set and a charging cradle. The charging cradle is used as means for charging the earphone set. The charging cradle further records connection information of multiple external devices that have been BT connected to the charging cradle. The earphone set receives a connection command from the charging cradle to accordingly form an audio connection to one of the multiple external devices. The charging cradle is further used as a communication medium between the multiple external devices.
    Type: Application
    Filed: February 16, 2022
    Publication date: August 17, 2023
    Inventors: Ping-Shun ZEUNG, Chih-Wei SUNG, Yu-Feng CHEN
  • Patent number: 11727714
    Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 11631993
    Abstract: Wireless charging devices, methods of manufacture thereof, and methods of charging electronic devices are disclosed. In some embodiments, a wireless charging device includes a controller, a molding material disposed around the controller, and an interconnect structure disposed over the molding material and coupled to the controller. The wireless charging device includes a wireless charging coil coupled to the controller. The wireless charging coil comprises a first portion disposed in the interconnect structure and a second portion disposed in the molding material. The wireless charging coil is adapted to provide an inductance to charge an electronic device.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: April 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen, Yen-Liang Lin
  • Patent number: 11625940
    Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: April 11, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu