Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Abstract: An audio device and a control method thereof are provided. The audio device includes a first switch, a controller, and multiple audio switches. The first switch is turned on or cut off according to whether an audio jack is on a setting position. A first end of the first switch receives a bias voltage. The controller is coupled to the first switch, and generates control signals according to a turned-on or cut-off status of the first switch. The audio switches are respectively coupled between transmission paths of multiple audio signals. The audio switches are turned on or cut off according to the control signals or a voltage on a second end of the first switch.

Abstract: A vehicle rear seat entertainment integration module is provided, the vehicle rear seat entertainment integration module has a display and a multi-functional remote controller, wherein the top of the display has an accommodating space for storing the multi-functional remote controller to solve the problem of losing the multifunctional remote controller due to the lack of storage space. In addition, the multifunctional remote controller may be used as a game handle to enhance the entertainment value of the rear seat of the vehicle.

Abstract: A quick-release structure and a vehicle rear seat display module using the same are provided. The quick-release structure includes a display docking piece, a fixing bracket docking piece, and a connecting hinge. The display docking piece and the fixing bracket docking piece may move relatively through the connecting hinge, so that a display fixed on the quick-release structure may be adjusted in pitch angle. In addition, the display docking piece also has a rotating mechanism, which makes a display rotate from a horizontal direction to a vertical direction.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: There is provided a wireless device including an earphone set and a charging cradle. The charging cradle is used as means for charging the earphone set. The charging cradle further records connection information of multiple external devices that have been BT connected to the charging cradle. The earphone set receives a connection command from the charging cradle to accordingly form an audio connection to one of the multiple external devices. The charging cradle is further used as a communication medium between the multiple external devices.

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Abstract: A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.

Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.

Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.

Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Abstract: An intermediary device and a wearable bridge are provided. The wearable bridge is detachably assembled with two wireless earbuds, and includes a headband, two ear cups respectively connected to two opposite ends of the headband, and a wireless module. Each ear cup includes an assembling slot and an electrical connector that is arranged in the assembling slot. Each assembling slot can be assembled with one of the two wireless earbuds so as to enable the corresponding electrical connector to be structurally and electrically connected to the one of the two wireless earbuds. The wireless module is electrically coupled to the electrical connector of each of the two ear cups, and the wireless module is configured to transmit sound signals from an external apparatus to the electrical connectors of the two ear cups, so that the two wireless earbuds are allowed to synchronously play.

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Abstract: There is provided a wireless device including an earphone set and a charging cradle. The charging cradle is used as means for charging the earphone set. The charging cradle further records connection information of multiple external devices that have been BT connected to the charging cradle. The earphone set receives a connection command from the charging cradle to accordingly form an audio connection to one of the multiple external devices. The charging cradle is further used as a communication medium between the multiple external devices.

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Abstract: Wireless charging devices, methods of manufacture thereof, and methods of charging electronic devices are disclosed. In some embodiments, a wireless charging device includes a controller, a molding material disposed around the controller, and an interconnect structure disposed over the molding material and coupled to the controller. The wireless charging device includes a wireless charging coil coupled to the controller. The wireless charging coil comprises a first portion disposed in the interconnect structure and a second portion disposed in the molding material. The wireless charging coil is adapted to provide an inductance to charge an electronic device.

Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.