Abstract: A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.

Abstract: A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.

Abstract: A first hold-down includes a reinforcing plate part that covers a CPU board opposed surface. A suction cover includes a flat-plate suction plate part covering an electrical contact spring piece of each contact and thereby able to be sucked by a suction nozzle, a plurality of attachment spring pieces configured to catch on a connector so that the suction plate part is detachable from a connector, and a first main deformation restraining part projecting from the suction plate part toward the CPU board opposed surface in order to inhibit the suction plate part from being deformed toward the CPU board opposed surface in the state where the suction cover is attached to the connector. The first main deformation restraining part is disposed to come into contact with the reinforcing plate part when the suction plate part is deformed toward the CPU board opposed surface.

Abstract: A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.

Abstract: A first hold-down includes a reinforcing plate part that covers a CPU board opposed surface. A suction cover includes a flat-plate suction plate part covering an electrical contact spring piece of each contact and thereby able to be sucked by a suction nozzle, a plurality of attachment spring pieces configured to catch on a connector so that the suction plate part is detachable from a connector, and a first main deformation restraining part projecting from the suction plate part toward the CPU board opposed surface in order to inhibit the suction plate part from being deformed toward the CPU board opposed surface in the state where the suction cover is attached to the connector. The first main deformation restraining part is disposed to come into contact with the reinforcing plate part when the suction plate part is deformed toward the CPU board opposed surface.

Abstract: A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.

Abstract: A connector is mounted on an input-output board. The connector is interposed between the input-output board and a CPU board, and thereby a plurality of pads of the input-output board and a plurality of pads of the CPU board are respectively electrically connected. The connector includes a rectangular flat-plate housing having a first positioning hole and a second positioning hole, and at least one contact row held on the housing. The first positioning hole is formed at a first housing corner part of the housing. The second positioning hole is formed at a fourth housing corner part, which is at a diagonal position with respect to the first housing corner part, of the housing.

Abstract: A connector includes a rectangular flat-plate housing including a first positioning hole and a second positioning hole, and a contact row and a contact row held on the housing. The housing includes a first pitch side surface and a second pitch side surface on an opposite side of the first pitch side surface. The contact row and the contact row extend from the first pitch side surface to the second pitch side surface. The first positioning hole is disposed between the first pitch side surface and the contact row, and the second positioning hole is disposed between the first pitch side surface and the contact row.

Abstract: An information processing device includes a storage configured to store a first film thickness model or a first refractive index model defining an amount of change in a film thickness or a refractive index at each position of a first wafer when a film forming processing is performed by changing an output of each of a plurality of plasma sources provided in a film forming device by a predetermined amount and a calculator configured to calculate, based on the first film thickness model or the first refractive index model, a correction value of the output of each of the plurality of plasma sources to achieve a target value of a film thickness or a target value of a refractive index at each position of a second wafer.

Abstract: A substrate processing apparatus includes a substrate transfer device that transfers a substrate accommodated in a substrate transfer container to a substrate holder; a substrate holder transfer stage that introduces the substrate holder into a reaction container; a substrate transfer controller that obtains a film thickness measurement result of the substrate, and determines a placing position of the substrate in the substrate holder by a model created in advance from the film thickness measurement result and a transfer position setting circuit; an information processing circuit that analyzes an eccentricity state from a film thickness variation state when a film thickness measurement result is newly obtained; a learning function circuit that updates the model from the eccentricity state; and an optimization function circuit that updates the placing position of the substrate by an updated model and the transfer position setting circuit.

Abstract: Provided is a control device for controlling an operation of a substrate processing apparatus that forms a predetermined film on a substrate and operations of a plurality of measurement devices that measure a characteristic of the predetermined film. The control device includes: an individual difference information storing unit that stores individual difference information representing a relationship between information allocated to each of the plurality of measurement devices to specify each measurement device and an individual difference of the measurement device; and a controller that corrects a measurement value of the characteristic of the predetermined film measured by the measurement device based on information specifying the measurement device that has measured the characteristic of the predetermined film and the individual difference information stored in the individual difference information storing unit.

Abstract: A heat treatment system includes a heating unit that heats an inside of a processing chamber in which a plurality of workpieces are accommodated; a heat treatment condition storing unit that stores a heat treatment condition; a heat treatment change model storing unit that stores a heat treatment change model; a heat treatment performing unit that performs the heat treatment condition; a heat treatment result receiving unit that receives a result of heat treatment performed; and an optimum temperature calculating unit that calculate a target heat treatment result for an in-plane shape of the workpiece based on a target heat treatment result and information about a shape of the target heat treatment result, and calculate an optimum temperature that results in the target heat treatment result, based on the calculated target heat treatment result and the heat treatment change model.

Abstract: Disclosed is a substrate processing system that includes a substrate processing apparatus configured to perform a predetermined processing on a substrate accommodated in a processing container. The substrate processing system includes: a processing execution unit configured to execute a film deposition processing on the substrate; a characteristic acquiring unit configured to acquire the characteristic of the film deposited on the substrate by the film deposition processing; and an abnormality determination unit configured to determine whether the characteristic of the film includes an abnormal value based on the characteristic of the film acquired by the characteristic acquiring unit.

Abstract: Disclosed is a substrate processing system including a substrate processing apparatus configured to execute a predetermined processing on a substrate accommodated in a processing container, an input receiving unit configured to receive an input of a set value for executing the predetermined processing, and a determination unit configured to determine whether or not the set value received by the input receiving unit is valid based on the set value received by the input receiving unit and a characteristic of the substrate processing apparatus.

Abstract: A connector is mateable with a mating connector along an upper-lower direction (Z-direction). The connector comprises a housing and a terminal. The housing has a holding portion and an upstanding portion which are apart from each other in a width direction (Y-direction). The upstanding portion has a stop portion. The terminal has a held portion held by the holding portion and a spring portion extending from the held portion. The spring portion has a base portion and an upward extending portion extending upward from the base portion. The upward extending portion has a facing portion which faces the upstanding portion in the width direction. The facing portion has a stopped portion. Under a mated state where the connector and the mating connector are mated with each other, the stop portion is located above the stopped portion and faces the stopped portion in the upper-lower direction.

Abstract: Disclosed is a substrate processing system that performs a film deposition on plural substrates in a processing container using a film deposition condition calculated based on a characteristic of a film deposited on at least one of the substrates. The substrate processing system includes: a storage unit storing surface state information and arrangement state information that represent influences of a surface state of the one substrate and an arrangement state of the plural substrates on the characteristic of the film deposited on the one substrate, respectively; a calculation unit calculating information that represents an influence of the plural substrates on the characteristic of the film on the one substrate based on the surface state information and the arrangement state information stored in the storage unit; and a correction unit correcting the characteristic of the film deposited on the one substrate based on the information calculated by the calculation unit.