Abstract: A heat treatment system includes a heat treatment condition storing unit that stores a heat treatment condition with respect to a doping processing and a diffusion processing; a model storing unit that stores a model representing a relationship between a change of the heat treatment condition and a change of an impurity concentration in an impurity-doped thin film; a heat treatment unit that forms the impurity-doped thin film under the heat treatment condition; a calculating unit that calculates a heat treatment condition of the doping processing and the diffusion processing that causes the impurity concentration in the impurity-doped film to be included within the predetermined range, based on the impurity concentration in the impurity-doped thin film and the model; and an adjusting unit that adjusts the impurity concentration in the impurity-doped thin film to be included within the predetermined range.

Abstract: In a board-to-board connector assembly, a plug-side power contact includes a first flat surface portion having a plate-like shape, a second flat surface portion having a plate-like shape and being opposed to a first part of the first flat surface portion and a power-contact-side connection portion connecting the first and second flat surface portions to each other. The first flat surface portion has the first part facing in parallel to the second flat surface portion and a second part or an upper end portion other than the first part. The first part includes a thinned portion having a shape recessed more deeply than a surface of the upper end portion and having a smaller thickness along the third direction than a thickness of the upper end portion.

Abstract: To obtain an imaging unit, a lens barrel, and a portable terminal which can effectively suppress spring-back of solid-state imaging elements, while facilitating height lowering thereof. An imaging unit includes: a solid-state imaging element; and an imaging lens for forming a subject image on a photoelectric conversion part of the solid-state imaging element. An imaging surface of the solid-state imaging element is curved in a manner that a peripheral side is inclined toward an object side relative to a screen center. The imaging lens constrains the solid-state imaging element to prevent a radius of curvature of the imaging surface from varying. Thus, field curvature, distortion aberration, and comatic aberration are appropriately corrected.

Abstract: In a board-to-board connector assembly, a plug-side power contact includes a first flat surface portion having a plate-like shape, a second flat surface portion having a plate-like shape and being opposed to a first part of the first flat surface portion and a power-contact-side connection portion connecting the first and second flat surface portions to each other. The first fiat surface portion has the first part facing in parallel to the second flat surface portion and a second part or an upper end portion other than the first part. The first part includes a thinned portion having a shape recessed more deeply than a surface of the upper end portion and having a smaller thickness along the third direction than a thickness of the upper end portion.

Abstract: Disclosed is a connector mateable with a mating connector along a first direction. The connector comprises a housing and a plurality of terminals, wherein the housing includes a plurality of held portions, and the terminals correspond to the held portions, respectively. Each of the terminals includes a base portion, a first portion, a second portion and a third portion. The first portion extends directly from the base portion and is provided with a first contact portion which projects towards the second portion in a second direction perpendicular to the first direction. The second portion extends directly from the base portion and is provided with a second contact portion and a press-fitting projection. The second contact portion projects towards the first portion in the second direction and faces the first contact portion. The press-fitting projection projects towards the third portion in the second direction. The third portion extends directly from the base portion.

Abstract: A controller of a heat treatment apparatus forms a phosphorous-doped polysilicon film (D-poly film) on a semiconductor wafer, and determines whether the D-poly film satisfies a target heat treatment characteristic. When it is determined that the target heat treatment characteristic is not satisfied, the controller calculates a temperature in a reaction tube and flow rates of process gas supply pipes, which satisfy the target heat treatment characteristic, based on a heat treatment characteristic of the D-poly film and a model indicating relationships between changes in the temperature in the reaction tube and the flow rates of the process gas supply pipes, and a change in a heat treatment characteristic. The controller forms the D-poly film on the semiconductor wafer according to heat treatment conditions including the calculated temperature and the calculated flow rates, so as to satisfy the target heat treatment characteristic.

Abstract: A heat treatment system includes a heating unit that heats an inside of a processing chamber in which a plurality of workpieces are accommodated; a heat treatment condition storing unit that stores a heat treatment condition; a heat treatment change model storing unit that stores a heat treatment change model; a heat treatment performing unit that performs the heat treatment condition; a heat treatment result receiving unit that receives a result of heat treatment performed; and an optimum temperature calculating unit that calculate a target heat treatment result for an in-plane shape of the workpiece based on a target heat treatment result and information about a shape of the target heat treatment result, and calculate an optimum temperature that results in the target heat treatment result, based on the calculated target heat treatment result and the heat treatment change model.

Abstract: Disclosed is a connector mateable with a mating connector along a first direction. The connector comprises a housing and a plurality of terminals, wherein the housing includes a plurality of held portions, and the terminals correspond to the held portions, respectively. Each of the terminals includes a base portion, a first portion, a second portion and a third portion. The first portion extends directly from the base portion and is provided with a first contact portion which projects towards the second portion in a second direction perpendicular to the first direction. The second portion extends directly from the base portion and is provided with a second contact portion and a press-fitting projection. The second contact portion projects towards the first portion in the second direction and faces the first contact portion. The press-fitting projection projects towards the third portion in the second direction. The third portion extends directly from the base portion.

Abstract: A connector includes a housing, contacts arranged and held in the housing, and a shell attached around the housing. The shell is made from a plate and includes an elongated part extending along a sidewall of the housing and a spring piece adapted to contact a ground contact of a mating connector. The spring piece includes a base part protruded from the elongated part in the direction perpendicular to the direction in which the elongated part extends and bent so that its front end is positioned inward from the sidewall, an intermediate part extended from the front end of the base part in the direction in which the elongated part extends, and a contact tip extended from a front end of the intermediate part in the direction perpendicular to the direction in which the elongated part extends.

Abstract: According to an embodiment of the present invention, a heat treatment system is provided. The heat treatment system includes a heating unit, a heat treatment condition memory unit, a power change model memory unit, a heat treatment change model memory unit, a heat treatment result reception unit, and an optimal temperature calculation unit. In the heat treatment system, the optimal temperature calculation unit calculates the power of the heating unit at a corresponding temperature based on the model stored in the power change model memory unit and the calculated temperature, and an optimal temperature is a temperature at which a heat treatment result is closest to the targeted heat treatment result within a range in which the calculated power of the heating unit is not saturated.

Abstract: A plug includes a plurality of plug contacts arranged in a row and a plug housing. The plurality of plug contacts each include first bending portion and the like. The first bending portions and the like are aligned in a direction where the plurality of plug contacts are arranged. The receptacle includes second metal parts and a receptacle housing. When the plug and the receptacle are mated, the plurality of plug contacts of the plug are brought into contact with the plurality of respective second metal parts of the receptacle. When the plug contacts are brought into contact with the respective second metal parts, each of the second metal parts exerts a resistance force against pull-out of the plug from the receptacle. An auxiliary metal fitting exerts a resistance force with different magnitude from the magnitude of the receptacle contact.

Abstract: Disclosed is a substrate processing method. The substrate processing method includes: a first acquisition step of acquiring a first processing condition in a first processing performed using a first number of monitor substrates and a first processing result related to the monitor substrates; a second acquisition step of acquiring a second processing condition in a second processing performed using a second number of monitor substrates and a second processing result related to the monitor substrates; a first calculation step of calculating a processing condition difference between the first processing condition and the second processing condition; and a second calculation step of calculating a processing result of substrates at slot positions where no monitor substrate is placed in the first processing, based on the first processing result, the second processing result, the processing condition difference, and a process model representing a relationship between a processing condition and a processing result.

Abstract: A control apparatus is configured to control an operation of a substrate processing apparatus configured to place at least a monitor substrate therein. The control apparatus controls the operation of the substrate processing apparatus based on a difference between a processing result of the monitor substrate processed by the substrate processing apparatus and a predictive result so as to optimize the monitor substrate loading frequency.

Abstract: A connector includes a housing, contacts arranged and held in the housing, and a shell attached around the housing. The shell is made from a plate and includes an elongated part extending along a sidewall of the housing and a spring piece adapted to contact a ground contact of a mating connector. The spring piece includes a base part protruded from the elongated part in the direction perpendicular to the direction in which the elongated part extends and bent so that its front end is positioned inward from the sidewall, an intermediate part extended from the front end of the base part in the direction in which the elongated part extends, and a contact tip extended from a front end of the intermediate part in the direction perpendicular to the direction in which the elongated part extends.

Abstract: Provided is a substrate processing method of filling a recess of a predetermined uneven pattern formed on a substrate with a film forming material by performing a first film forming processing, a first etching processing and a second film forming processing on the substrate, using a vertical substrate processing apparatus and a control apparatus controlling operations of the vertical substrate processing apparatus. The method includes calculating a first film forming condition, a first etching condition, and a second film forming condition by the control apparatus such that the film forming material is filled in the recess without any void after the second film forming processing; and performing the first film forming processing, the first etching processing and the second film forming processing on the substrate based on the calculated first film forming condition, first etching condition and second film forming condition.

Abstract: A substrate processing method of the present disclosure includes forming a film on a workpiece using a processing gas in a processing chamber with a setting temperature profile including increase or decrease of a temperature; and etching the film. An etching rate of the film in the etching depends on a film formation temperature in the forming. The setting temperature profile is determined based on a first temperature dependence of the etching rate in the etching on the film formation temperature, and a second temperature dependence of a film formation amount in the forming on the film formation temperature.

Abstract: Provided is a connector mountable on a board. The connector comprises a plurality of contacts, a housing holding the contacts, and a monitored member attached to the housing. The monitored member comprises a marker portion and an abutment portion brought into abutment with the board when the connector is mounted on the board in a vertical direction. The abutment portion is apart from the marker portion by a predetermined distance in the vertical direction. The height of the housing is indirectly measured by investigating a position of the marker portion.