Patents by Inventor Yuichiro ENOMOTO
Yuichiro ENOMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140220353Abstract: Provided is the pattern formability and line edge roughness of the resultant substrate. An underlay film composition for imprints comprising a compound (A) and a solvent (B), the compound (A) having at least either one of a group (Ka) capable of covalently bonding and/or interacting with a substrate, and, a group (Kb) capable of covalently bonding and/or interacting with a curable composition for imprints, an Ohnishi parameter (Z) calculated from (equation 1) of 3.Type: ApplicationFiled: April 4, 2014Publication date: August 7, 2014Applicant: FUJIFILM CORPORATIONInventors: Kunihiko KODAMA, Shinji TARUTANI, Yuichiro ENOMOTO, Tadashi OOMATSU, Takayuki ITO, Hirotaka KITAGAWA, Akiko HATTORI
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Patent number: 8753802Abstract: A pattern forming method comprising: (i) a step of forming a film from a chemical amplification resist composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the resist composition contains: (A) a resin, (B) a nonionic compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a crosslinking agent, and (D) a solvent.Type: GrantFiled: October 22, 2012Date of Patent: June 17, 2014Assignee: FUJIFILM CorporationInventors: Keita Kato, Shinji Tarutani, Sou Kamimura, Yuichiro Enomoto, Kaoru Iwato
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Publication number: 20140154471Abstract: Disclosed is a to provide a curable composition for imprints capable of keeping a good patternability and of producing less defects even after repetitive pattern transfer. The curable composition for imprints comprising: a polymerizable compound (A); a photo-polymerization initiator (B); and a non-polymerizable compound (C) having a polyalkylene glycol structure having at least one terminal hydroxy group, or at least one etherified terminal hydroxy group, and containing substantially no fluorine atom and no silicon atom.Type: ApplicationFiled: January 9, 2014Publication date: June 5, 2014Applicant: FUJIFILM CorporationInventors: Kunihiko KODAMA, Yuichiro ENOMOTO, Kazuyuki USUKI, Tadashi OMATSU, Hirotaka KITAGAWA
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Publication number: 20140127629Abstract: Provided is a method of forming pattern including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing a first organic solvent, wherein in the developer, particles each having a diameter of 0.3 ?m or greater amount to a density of 30 particles/ml or less.Type: ApplicationFiled: January 13, 2014Publication date: May 8, 2014Applicant: FUJIFILM CorporationInventors: Keita KATO, Sou KAMIMURA, Yuichiro ENOMOTO, Kaoru IWATO, Shohei KATAOKA, Shoichi SAITOH
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Patent number: 8663907Abstract: Provided is a method of forming pattern including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing a first organic solvent, wherein in the developer, particles each having a diameter of 0.3 ?m or greater amount to a density of 30 particles/ml or less.Type: GrantFiled: August 24, 2011Date of Patent: March 4, 2014Assignee: FUJIFILM CorporationInventors: Keita Kato, Sou Kamimura, Yuichiro Enomoto, Kaoru Iwato, Shohei Kataoka, Shoichi Saitoh
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Publication number: 20130113082Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, (c) developing the exposed film with a developer containing an organic solvent, and (d) rinsing the developed film with a rinse liquid containing an organic solvent, which rinse liquid has a specific gravity larger than that of the developer.Type: ApplicationFiled: August 26, 2011Publication date: May 9, 2013Applicant: FUJIFILM CORPORATIONInventors: Yuichiro Enomoto, Shinji Tarutani, Sou Kamimura, Keita Kato, Kana Fujii
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Publication number: 20130101812Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an ester and a ketone having 7 or more carbon atoms.Type: ApplicationFiled: September 16, 2011Publication date: April 25, 2013Applicant: FUJIFILM CORPORATIONInventors: Sou Kamimura, Tsukasa Yamanaka, Yuichiro Enomoto, Keita Kato
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Publication number: 20130052431Abstract: Provided is a curable composition for imprints capable of ensuring good patternability after repetitive transfer of pattern, and less causative of defects. The curable composition for imprints comprising a polymerizable compound (A), a photo-polymerization initiator (B) and a non-polymerizable compound (C); the non-polymerizable compound (C) dissolving into the curable composition for imprints in an exothermic manner.Type: ApplicationFiled: August 24, 2012Publication date: February 28, 2013Applicant: FUJIFILM CORPORATIONInventors: Yuichiro ENOMOTO, Kunihiko KODAMA, Shinji TARUTANI, Hirotaka KITAGAWA, Tadashi OOMATSU
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Publication number: 20130017377Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition and a method of forming a pattern using the same, ensuring excellent the etching resistivity and the stability during a post-exposure delay (PED) period. The composition contains a resin containing a repeating unit containing a group that is decomposed when acted on by an acid to thereby produce an alcoholic hydroxyl group, and a compound that generates an acid of pKa?1.5 when exposed to actinic rays or radiation.Type: ApplicationFiled: March 25, 2011Publication date: January 17, 2013Applicant: FUJIFILM CORPORATIONInventors: Shohei Kataoka, Kaoru Iwato, Sou Kamimura, Toru Tsuchihashi, Yuichiro Enomoto, Kana Fujii, Kazuyoshi Mizutani, Shinji Tarutani, Keita Kato
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Publication number: 20130011785Abstract: Provided is a method of forming a pattern, ensuring excellent exposure latitude (EL) and focus latitude (depth of focus DOF). The method of forming a pattern includes (A) forming a film from a resist composition, the resist composition, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent, thereby forming a negative pattern. The resist composition contains (a) a resin that is configured to decompose when acted on by an acid and ?SP thereof represented by formula (1) below is 2.5 (MPa)1/2 or above, (b) a compound that is composed to generate an acid when exposed to actinic rays or radiation, and (c) a solvent.Type: ApplicationFiled: March 25, 2011Publication date: January 10, 2013Applicant: FUJIFILM CORPORATIONInventors: Keita Kato, Shinji Tarutani, Toru Tsuchihashi, Sou Kamimura, Yuichiro Enomoto, Kana Fujii, Kaoru Iwato, Shohei Kataoka, Kazuyoshi Mizutani
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Publication number: 20120322007Abstract: A pattern forming method comprising (i) a step of forming a film from a chemical amplification resist composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using a developer containing an organic solvent, wherein the resist composition contains (A) a resin, (B) a compound capable of generating a specific acid upon irradiation with an actinic ray or radiation, (C) a crosslinking agent, and (D) a solvent.Type: ApplicationFiled: February 18, 2011Publication date: December 20, 2012Applicant: FUJIFILM CORPORATIONInventors: Keita Kato, Shinji Tarutani, Sou Kamimura, Yuichiro Enomoto, Kaoru Iwato
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Publication number: 20120321855Abstract: Provided is a method of forming a pattern, ensuring excellent sensitivity, limiting resolving power, roughness characteristic, exposure latitude (EL), dependence on post-exposure bake (PEB) temperature and focus latitude (depth of focus DOF), and a resist composition for use in the method. The method comprises (A) forming a film from a resist composition comprising a resin containing a repeating unit containing a group that is decomposed when acted on by an acid to thereby produce an alcoholic hydroxyl group, which resin thus when acted on by an acid decreases its solubility in a developer containing an organic solvent, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent.Type: ApplicationFiled: February 24, 2011Publication date: December 20, 2012Applicant: FUJIFILM CORPORATIONInventors: Kaoru Iwato, Shohei Kataoka, Shinji Tarutani, Sou Kamimura, Keita Kato, Yuichiro Enomoto, Kazuyoshi Mizutani, Toru Tsuchihashi, Kana Fujii
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Publication number: 20120288691Abstract: A pattern forming method comprising (i) a step of forming a film from a chemical amplification resist composition (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the chemical amplification resist composition contains (A) a resin containing a repeating unit having two or more hydroxyl groups, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a crosslinking agent and (D) a solvent; a pattern formed by the pattern forming method; a chemical amplification resist composition used in the pattern forming method; and a resist film formed using the chemical amplification resist composition.Type: ApplicationFiled: January 13, 2011Publication date: November 15, 2012Applicant: FUJIFILM CORPORATIONInventors: Kaoru Iwato, Shinji Tarutani, Yuichiro Enomoto, Sou Kamimura, Keita Kato
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Publication number: 20120282548Abstract: Provided is a pattern forming method comprising (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the actinic ray-sensitive or radiation-sensitive resin composition comprises (A) a resin capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (D) a solvent, and (G) a compound having at least either one of a fluorine atom and a silicon atom and having basicity or being capable of increasing the basicity by the action of an acid.Type: ApplicationFiled: January 7, 2011Publication date: November 8, 2012Applicant: FUJIFILM CORPORATIONInventors: Yuichiro Enomoto, Shinji Tarutani, Sou Kamimura, Kaoru Iwato, Keita Kato, Akinori Shibuya
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Publication number: 20120207943Abstract: Provided is a method of producing a curable composition for imprints including (A) a polymerizable monomer, (B) a polymerization initiator, and (C) a solvent which is capable of effectively suppressing lifting or separation of patterns, excellent in coatability, and excellent in time-dependent stability. The method of producing a curable composition for imprints comprises preparing one species of liquid (D) which contains at least either one of the polymerizable monomer (A) and the polymerization initiator (B), passing the liquid (D) through a filter, and then adding the solvent (C).Type: ApplicationFiled: February 10, 2012Publication date: August 16, 2012Applicant: FUJIFILM CORPORATIONInventors: Yuichiro ENOMOTO, Kunihiko KODAMA, Shinji TARUTANI
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Publication number: 20120148957Abstract: A pattern forming method includes: (i) forming a film from a chemical amplification resist composition; (ii) exposing the film, so as to form an exposed film; and (iii) developing the exposed film by using an organic solvent-containing developer, wherein the chemical amplification resist composition contains: (A) a resin substantially insoluble in alkali; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a crosslinking agent; and (D) a solvent, a negative chemical amplification resist composition used in the method, and a resist film formed from the negative chemical amplification resist composition.Type: ApplicationFiled: October 5, 2010Publication date: June 14, 2012Applicant: FUJIFILM CORPORATIONInventors: Yuichiro Enomoto, Sou Kamimura, Shinji Tarutani, Keita Kato, Kaoru Iwato
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Publication number: 20120077131Abstract: According to one embodiment, a method of forming a pattern includes the step of applying an actinic-ray- or radiation-sensitive resin composition on a substrate so as to form a film, the step of selectively exposing the film through a mask and the step of developing the exposed film with the use of a developer containing an organic solvent, wherein the actinic-ray- or radiation-sensitive resin composition contains a resin (A) whose polarity is increased by the action of an acid so that the solubility of the resin in the developer containing an organic solvent is decreased, a photoacid generator (B) that when exposed to actinic rays or radiation, generates an acid containing a fluorine atom and a solvent (C), and wherein the photoacid generator (B) is contained in the composition in a ratio of 8 to 20 mass % based on the total solids of the composition.Type: ApplicationFiled: June 3, 2010Publication date: March 29, 2012Applicant: FUJIFILM CORPORATIONInventors: Yuichiro Enomoto, Shinji Tarutani, Akinori Shibuya, Shuhei Yamaguchi
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Publication number: 20120076948Abstract: Provided is a method for producing a curable composition for imprints which excellent in patternability. Applied is a method for producing a curable composition for imprints, which comprises passing a curable composition comprising a polymerizable monomer (A) and a polymerizable initiator (B) through a filter having an effective filter area of 200 cm2 or more at least one time.Type: ApplicationFiled: September 21, 2011Publication date: March 29, 2012Applicant: FUJIFILM CORPORATIONInventors: Yuichiro ENOMOTO, Kunihiko KODAMA, Shinji TARUTANI
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Publication number: 20120058427Abstract: A pattern forming method, including: (i) forming a film from a chemical amplification resist composition; (ii) exposing the film, so as to form an exposed film; and (iii) developing the exposed film by using a developer containing an organic solvent, wherein the chemical amplification resist composition contains: (A) a resin capable of decreasing a solubility of the resin (A) in the developer containing an organic solvent by an action of an acid; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) a basic, compound or ammonium salt compound whose basicity decreases upon irradiation with an actinic ray or radiation, and a resist composition used for the pattern forming method and a resist film formed from the resist composition are provided.Type: ApplicationFiled: June 14, 2010Publication date: March 8, 2012Applicant: FUJIFILM CORPORATIONInventors: Yuichiro Enomoto, Sou Kamimura, Shinji Tarutani
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Publication number: 20120052449Abstract: Provided is a method of forming pattern including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing a first organic solvent, wherein in the developer, particles each having a diameter of 0.3 ?m or greater amount to a density of 30 particles/ml or less.Type: ApplicationFiled: August 24, 2011Publication date: March 1, 2012Applicant: FUJIFILM CORPORATIONInventors: Keita KATO, Sou KAMIMURA, Yuichiro ENOMOTO, Kaoru IWATO, Shohei KATAOKA, Shoichi SAITOH