Abstract: A housing 20 integrally formed with a light guide 10 in which a liquid crystal module of a cellular phone is mounted, a multiple number of hollow, conductive toe-pins 28 which are inserted in respective passage holes 23 of the housing 20 and slidably come out from the undersurface of housing 20, and conductive head pins 30 which each are fitted into respective conductive toe-pins 28 and slidably come out from the top surface of housing 20, are provided. A coil spring 32 is interposed between each conductive toe-pin 28 and conductive head pin 30 and elastically urges the conductive toe-pin 28 and conductive head pin 30, so that they come out from both sides of housing 20.

Abstract: An adapter includes an insulative base holder 10 interposed between a cellular phone speaker 1 and an electronic circuit board 5, a pair of electrode plates 15 and 15A, arranged left and right, radially outwardly from the approximate center of base holder 10 to the outer peripheral edge of the base holder 10; and first and second coil springs 17 and 18 welded at both ends of each of electrode plates 15 and 15A, and is constructed such that the first coil springs 17 are put in pressing contact with speaker electrodes 4 at the outer peripheral edge on the underside of speaker 1 and the second coil springs 18 are put in pressing contact with approximately concentric board electrodes 6 of electric circuit board 5.

Abstract: A compression type connector is constructed of a cap-like conductive toe-pin 1, a conductive pin 10 fitted and slidably supported within conductive toe-pin 1 and a coil spring 20 fitted on conductive pin 10 and repulsively urging the conductive pin 10 upwards or in the direction opposite to the bottom of conductive toe-pin 1. A multiple number of the compression type connectors are arranged in an insulative housing 50 interposed between electrodes 31 and 41 of an electronic circuit board 30 and an electrically joined object 40, each opposing the other. Each conductive toe-pin 1 is put into contact with electrode 31 of electronic circuit board 30 and conductive pin 10 into contact with electrode 41 of electrically joined object 40, to establish electrical connection between electronic circuit board 30 and electrically joined object 40.

Abstract: A beam current measuring device (BMD) capable of measuring beam current while radiating the beam on a target, such as a semiconductor wafer. The BMD at least includes: (a) a detecting section for detecting or collecting a magnetic field corresponding to the beam current; and (b) measuring section including (i) a SQUID sensitive to magnetic flux, and (ii) a feedback coil for carrying feedback current to cancel out a change in the magnetic flux penetrating through the SQUID. With finite beam current except zero penetrating through the detecting section, the SQUID is locked. A BMD of the present invention can be incorporated and used in an ion-implantation apparatus, electron beam exposure apparatus, accelerator, and the like.

Abstract: An ion irradiation system has a leader and a trailer at its beam line, and at least one non-beam-breaking beam-current measuring instrument is prepared between the leader and the trailer. The leader is an ion source, and the trailer is a process chamber where semiconductor wafers are placed. The beam-current measuring instrument is placed before the wafers.

Abstract: An adapter includes an insulative base holder 10 interposed between a cellular phone speaker 1 and an electronic circuit board 5, a pair of electrode plates 15 and 15A, arranged left and right, radially outwardly from the approximate center of base holder 10 to the outer peripheral edge of the base holder 10; and first and second coil springs 17 and 18 welded at both ends of each of electrode plates 15 and 15A, and is constructed such that the first coil springs 17 are put in pressing contact with speaker electrodes 4 at the outer peripheral edge on the underside of speaker 1 and the second coil springs 18 are put in pressing contact with approximately concentric board electrodes 6 of electric circuit board 5.

Abstract: In order to realize a plasma doping method capable of carrying out a stable low-density doping, exhaustion is carried out with a pump while introducing a predetermined gas into a vacuum chamber from a gas supplying apparatus, the pressure of the vacuum chamber is held at a predetermined pressure and a high frequency power is supplied to a coil from a high frequency power source. After the generation of plasma in the vacuum chamber, the pressure of the vacuum chamber is lowered, and the low-density plasma doping is performed to a substrate placed on a substrate electrode. Moreover, the pressure of the vacuum chamber is gradually lowered, and the high frequency power is gradually increased, thereby the low-density plasma doping is carried out to the substrate placed on the substrate electrode.

Abstract: A housing 20 integrally formed with a light guide 10 in which a liquid crystal module of a cellular phone is mounted, a multiple number of hollow, conductive toe-pins 28 which are inserted in respective passage holes 23 of the housing 20 and slidably come out from the undersurface of housing 20, and conductive head pins 30 which each are fitted into respective conductive toe-pins 28 and slidably come out from the top surface of housing 20, are provided. A coil spring 32 is interposed between each conductive toe-pin 28 and conductive head pin 30 and elastically urges the conductive toe-pin 28 and conductive head pin 30, so that they come out from both sides of housing 20.

Abstract: A permanent magnet field-type compact DC motor having a high output and a low cogging torque is made by fixing a pair of rare earth magnets mainly composed of rare earth-iron-based rapidly quenched and solidified flakes to a soft magnetic frame so as to extend along an inner peripheral surface thereof, and by unsaturation-magnetizing the rare earth magnets so that demagnetization curves at circumferentially opposite end portions of the rare earth magnets are made smaller than a demagnetization curve at a central portion of a magnetic pole of each of the rare earth magnets.

Abstract: An ion irradiation system has a leader and a trailer at its beam line, and at least one non-beam-breaking beam-current measuring instrument is prepared between the leader and the trailer. The leader is an ion source, and the trailer is a process chamber where semiconductor wafers are placed. The beam-current measuring instrument is placed before the wafers.

Abstract: A compression type connector is constructed of a cap-like conductive toe-pin 1, a conductive pin 10 fitted and slidably supported within conductive toe-pin 1 and a coil spring 20 fitted on conductive pin 10 and repulsively urging the conductive pin 10 upwards or in the direction opposite to the bottom of conductive toe-pin 1. A multiple number of the compression type connectors are arranged in an insulative housing 50 interposed between electrodes 31 and 41 of an electronic circuit board 30 and an electrically joined object 40, each opposing the other. Each conductive toe-pin 1 is put into contact with electrode 31 of electronic circuit board 30 and conductive pin 10 into contact with electrode 41 of electrically joined object 40, to establish electrical connection between electronic circuit board 30 and electrically joined object 40.

Abstract: An insulative housing 20 is interposed between electrodes 2 and 11 formed on a circuit board 1 and an electrically joined object 10, each opposing the other; and spring elements 26 are fitted into multiple passage holes 21 formed in housing 20. Each spring element 26 is a conductive coil spring, and the coil spring is formed so as to have a greater diameter at the lower end 27 than in middle part 28 or at the upper end 29. The lower end 27 of each spring element 26 is fitted into and joined to a conductive toe-pin 30 having an approximately U-shaped section, which in turn is put into contact with an electrode 2 of circuit board 1, while the upper end 29 of each spring element 26 is projected from the surface of housing 20 with a conductive pin 31 fitted thereto. Since contracting spring element 26 is used, it is possible to reduce the height of the compression type connector and to expect achievement of low-resistance and low-load connection.