Abstract: A method of producing a semiconductor device by encapsulating a semiconductor element with a resin, which comprises disposing a semiconductor element with lead frames and an encapsulating resin in a state of being sandwiched between a pair of films on a molding mold having a port for setting the encapsulating resin, closing the mold, pressing the encapsulating resin between the films in a heated state by a plunger vertically moving in the pot, and injecting the molten encapsulating resin in the inside of the mold cavity from the pot portion through a runner portion to encapsulate the semiconductor element with the encapsulating resin.

Abstract: A metal foil material for covering a semiconductor device, a semiconductor device covered with the metal foil material, and a process for producing the metal foil-covered semiconductor device are disclosed. The metal foil material is one which is, in molding a resin for encapsulating a semiconductor element using a mold, temporarily fixed on a surface of a cavity of the mold, and is adhered on a surface of a semiconductor device by injecting the encapsulating resin into the mold and molding the resin, wherein a contact angle of the face of the metal foil material which is in contact with the encapsulating resin during molding, to water is 110.degree. or less.

Abstract: An adhesive resin composition comprising a polycarbodiimde resin and a bisalkenyl-substituted nadimide and an adhesive sheet using the resin composition.The adhesive resin composition can adhere in a short time even at low temperature, has a high heat resistance, has a low hygroscopic property, and is hard to cause package crackings, etc.

Abstract: By employing the structure that in a two-layer lead frame comprising a lamination layer of lead portions and a metal layer, the thickness of an adhesive layer for fixing the a semiconductor element to the adhesive layer is defined to be from 100 to 350 .mu.m and the semiconductor element is buried in the adhesive layer in a depth of at least 1/3o the thickness of the semiconductor element, the extent of the unevenness in the resin-sealed region is reduced and the occurrences of die shift and void are restrained.

Abstract: A semiconductor device comprising a substrate having an individual identification information recorded on the surface thereof, wherein the substrate comprises a metal foil and the individual identification information is formed by a polyimide resin.

Abstract: An individual identification label comprising a substrate having an individual identification information recorded on the surface thereof, wherein the substrate comprises a metal plate or a metal foil and the individual identification information is formed by a polyimide resin.

Abstract: A silver halide color photographic material having at least one silver halide emulsion layer on a support is disclosed. Said silver halide emulsion layer contains at least one of the 1H-pyrazolo [3,2-c]-S-triazole derived magenta couplers that have a substituent of the following formula at 3-position:--R.sub.1 --S(O).sub.n --R.sub.2whereinR.sub.1 is an alkylene group;R.sub.2 is an alkyl, cycloalkyl or aryl group; andn is 1 or 2.

Abstract: A silver halide photographic emulsion is disclosed. The emulsion has silver halide grains that consist essentially of silver chlorobromide and which have been sulfur-sensitized in the presence of a silver halide solvent.

Abstract: There is disclosed a heat-sensitive transfer recording medium comprising a support and, provided thereon, a colorant-containing layer for heat-sensitive transfer, wherein said colorant-containing layer contains a silicone wax as a heat-fusible material which is solid or semi-solid at ambient temperature or room temperature.The recording medium according to the present invention is capable of printing at low energy and with high transfer sensitivity.

Abstract: A thermal transfer recording medium having a thermally transferable coloring agent containing layer coated on a support. The coloring agent containing layer is separated into at least two layers, one of which is the upper layer and the other of which is the lower layer, and the layer farthermost from the support is a thermally transferable layer containing substantially no coloring agent.

Abstract: A thermal transfer recording medium having a support and two coloring agent layers provided on the same side thereof, in which the first coloring agent layer is a layer containing a resin and a coloring agent coated on the support and the second layer is a layer containing a heat-fusible material and a coloring agent coated on the first layer, and the respective coloring agents in the two layers have isochromatic color tone. The thermal transfer recording medium provides low energy printing at high speed with little decrease in its density even after being used for many copies, thus permitting high density dye transfer images to be obtained over very many times.

Abstract: There is disclosed a thermal transfer recording medium which comprises a support, a coloring agent layer containing a heat fusible substance formed on one surface of said support and a backing layer on the other surface of said support, wherein said backing layer contains a resin selected from urethane resins or vinyl chloride resins and a higher fatty acid which is solid or meta-solid at room temperature.The thermal transfer recording medium of this invention can suppress effectively generation of the sticking phenomenon, and has no deleterious effect on the thermal head without either contamination or abrasion of the thermal head.

Abstract: A photosensitive silver halide emulsion comprising photosensitive silver halide grains which essentially consists of monodisperse globular-shaped grains. The grains may be prepared by adding a silver halide solvent to a silver halide emulsion containing monodisperse silver halide grains of regular crystal habit at a time between the complete formation of the monodisperse silver halide grains of regular crystal habit and before commencement of chemical sensitization.

Abstract: A silver halide photographic material containing a coupler capable of releasing a photographically useful group in a controllable timing.