Patents by Inventor Yuki Nakano
Yuki Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12148798Abstract: An SiC semiconductor device includes an SiC semiconductor layer of a first conductivity type having a main surface, a source trench formed in the main surface and having a side wall and a bottom wall, a source electrode embedded in the source trench and having a side wall contact portion in contact with a region of the side wall of the source trench at an opening side of the source trench, a body region of a second conductivity type formed in a region of a surface layer portion of the main surface along the source trench, and a source region of the first conductivity type electrically connected to the side wall contact portion of the source electrode in a surface layer portion of the body region.Type: GrantFiled: May 21, 2020Date of Patent: November 19, 2024Assignee: ROHM CO., LTD.Inventors: Yuki Nakano, Kenji Yamamoto, Seigo Mori
-
Patent number: 12146087Abstract: A compound represented by the following formula (1), wherein in the formula (1), at least one of R1 to R8 is a group represented by the following formula (2).Type: GrantFiled: December 28, 2018Date of Patent: November 19, 2024Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Tomoki Kato, Keita Seda, Ryota Takahashi, Hidetsugu Ikeda, Yuki Nakano, Thomas Schaefer, Peter Murer, Carsten Rothe
-
Patent number: 12133462Abstract: An organic electroluminescence device including: a cathode, an anode, and an organic layer disposed between the cathode and the anode, wherein the organic layer comprises an emitting layer and a first layer, the first layer is disposed between the cathode and the emitting layer, the emitting layer comprises one or both of a compound represented by the following formula (1A) and a compound represented by the following formula (1B), and the first layer comprises a compound represented by the following formula (BE1):Type: GrantFiled: April 8, 2020Date of Patent: October 29, 2024Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Hiroaki Itoi, Yuki Nakano, Satomi Tasaki, Taro Yamaki, Tetsuya Masuda
-
Patent number: 12108666Abstract: A compound having a structure represented by the following formulas (a) and (b): wherein, in the formulas (a) and (b), a ring A, a ring B, a ring C and a ring D are independently a substituted or unsubstituted aromatic hydrocarbon ring having 6 to 50 ring carbon atoms, or a substituted or unsubstituted heterocyclic ring having 5 to 50 ring atoms; two or more of the ring A, the ring B, the ring C and the ring D are a heterocyclic ring; and each of sites *a, *b, *c and *d in the formula (a) and the formula (b) represents a position of an atom, and the atoms located in the sites *a, *b,*c and *d form one substituted or unsubstituted and saturated or unsaturated six-membered ring including four atoms thereof.Type: GrantFiled: September 26, 2019Date of Patent: October 1, 2024Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Ryota Takahashi, Hidetsugu Ikeda, Yuki Nakano, Keita Seda
-
Publication number: 20240316311Abstract: A delivery device includes: an indwelling device including a stent body that is self-expandable; and a delivery catheter configured to separably support the indwelling device. The delivery catheter includes: a cover configured to cover at least a part of an axial range of the stent body; and an expansion restraining mechanism including a plurality of restraining wire rods configured to restrain expansion of the stent body by hooking a stent wire rod that constitutes the stent body. The plurality of restraining wire rods are configured to release restraint of the stent body by moving axially.Type: ApplicationFiled: February 29, 2024Publication date: September 26, 2024Inventors: Yuki TOYODA, Eiichi NAKANO
-
Patent number: 12090251Abstract: A cell sheet for transplantation into a living body, containing MSCs having an average cell density of 3.0×104 cells/cm2 or less on the surface of the sheet is provided. A method for producing a cell sheet for transplantation into a living body, including: a step of seeding MSCs on a cell culture carrier having a three-dimensional structure formed of fibers at a cell number of 3.0×105 cells/cm2 or less; and a step of culturing the MSCs and thereby preparing a cell sheet containing the MSCs having an average cell density of 3.0×104 cells/cm2 or less is also provided.Type: GrantFiled: April 25, 2019Date of Patent: September 17, 2024Assignee: Sapporo Medical UniversityInventors: Takako Chikenji, Mineko Fujimiya, Yuki Saito, Masako Nakano, Naoto Konari, Miho Otani
-
Publication number: 20240304447Abstract: A method for producing a semiconductor power device includes forming a gate trench from a surface of the semiconductor layer toward an inside thereof. A first insulation film is formed on the inner surface of the gate trench. The method also includes removing a part on a bottom surface of the gate trench in the first insulation film. A second insulation film having a dielectric constant higher than SiO2 is formed in such a way as to cover the bottom surface of the gate trench exposed by removing the first insulation film.Type: ApplicationFiled: May 1, 2024Publication date: September 12, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Publication number: 20240297088Abstract: A semiconductor device includes a chip that has a main surface, a main surface electrode that is arranged on the main surface, a terminal electrode that is arranged on the main surface electrode, a sealing insulator that covers a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and that includes a matrix resin and fillers added into the matrix resin such that a ratio of a total cross-sectional area with respect to a unit cross-sectional area is higher than a ratio of a cross-sectional area of the matrix resin with respect to the unit cross-sectional area.Type: ApplicationFiled: May 3, 2024Publication date: September 5, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Patent number: 12080760Abstract: An SiC semiconductor device includes an SiC semiconductor layer having a first main surface and a second main surface, a gate electrode embedded in a trench with a gate insulating layer, a source region of a first conductivity type formed in a side of the trench in a surface laver portion of the first main surface, a body region of a second conductivity type formed in a region at the second main surface side with respect to the source region in the surface layer portion of the first main surface, a drift region of the first conductivity type formed in a region at the second main surface side in the SiC semiconductor layer, and a contact region of the second conductivity type having an impurity concentration of not more than 1.0×1020 cm?3 and formed in the surface layer portion of the first main surface.Type: GrantFiled: August 5, 2019Date of Patent: September 3, 2024Assignee: ROHM CO., LTD.Inventors: Yuki Nakano, Masatoshi Aketa, Takui Sakaguchi, Yuichiro Nanen
-
Publication number: 20240290673Abstract: A semiconductor device includes a chip having a main surface, a recessed portion formed in the main surface, and a sealing insulator that covers the main surface, and that has an anker portion positioned in the recessed portion.Type: ApplicationFiled: May 1, 2024Publication date: August 29, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Publication number: 20240290679Abstract: A semiconductor device includes a chip having a main surface, a main surface electrode arranged on the main surface, a terminal electrode that has a terminal surface and a terminal side wall, and that has a recessed portion recessed toward the main surface electrode side in the terminal surface, and a sealing insulator that covers a periphery of the terminal electrode on the main surface such as to expose the terminal surface and cover the terminal side wall.Type: ApplicationFiled: May 3, 2024Publication date: August 29, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Publication number: 20240287685Abstract: A pickling apparatus for pickling a strip of metal being conveyed is equipped with: a pickling tank for storing an acid solution; a surrounding part disposed in the pickling tank so as to surround the strip immersed in the acid solution in the pickling tank; and an oxidant supply part for supplying a liquid oxidant toward an inside of the surrounding part.Type: ApplicationFiled: July 9, 2021Publication date: August 29, 2024Applicant: PRIMETALS TECHNOLOGIES JAPAN, LTD.Inventors: Naohiko MATSUDA, Takashi NAKANO, Yuki MAEHASHI, Shinji NAMBA, Masashi YOSHIKAWA, Kosei TSUJI, Takahiro YAGI, Ryusuke NAKATSUKA
-
Publication number: 20240282656Abstract: A semiconductor module includes a housing that has a housing space, a semiconductor device that is arranged in the housing space, and that has a chip having a main surface, a main surface electrode arranged on the main surface, a terminal electrode arranged on the main surface electrode, and a sealing insulator covering a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and an insulating gel-like filling agent that is filled in the housing space such as to contact the sealing insulator, and that seals the semiconductor device in the housing space.Type: ApplicationFiled: May 1, 2024Publication date: August 22, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Publication number: 20240282657Abstract: A semiconductor device includes a chip that has a main surface, a main surface electrode that is arranged on the main surface, a terminal electrode that is arranged on the main surface electrode such as to expose a part of the main surface electrode; and a sealing insulator that covers a periphery of the terminal electrode such as to expose a part of the terminal electrode, and that has a portion directly covering the main surface electrode.Type: ApplicationFiled: May 2, 2024Publication date: August 22, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Publication number: 20240284786Abstract: An organic electroluminescence device includes a first emitting layer and a second emitting layer provided between an anode and a cathode, in which the first emitting layer contains, as a first host material, a first compound represented by a formula (1) below and having at least one group represented by a formula (11) below, and the second emitting layer contains a second host material.Type: ApplicationFiled: March 31, 2021Publication date: August 22, 2024Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Satomi TASAKI, Kazuki NISHIMURA, Ryota TAKAHASHI, Yuki NAKANO, Maiko IIDA, Hiroaki ITOI
-
Publication number: 20240282825Abstract: An SiC semiconductor device includes an SiC semiconductor layer including an SiC monocrystal and having a first main surface as an element forming surface, a second main surface at a side opposite to the first main surface, and a plurality of side surfaces connecting the first main surface and the second main surface, and a plurality of modified lines formed one layer each at the respective side surfaces of the SiC semiconductor layer and each extending in a band shape along a tangential direction to the first main surface of the SiC semiconductor layer and modified to be of a property differing from the SiC monocrystal.Type: ApplicationFiled: May 3, 2024Publication date: August 22, 2024Applicant: ROHM CO., LTD.Inventors: Masaya UENO, Yuki NAKANO, Sawa HARUYAMA, Yasuhiro KAWAKAMI, Seiya NAKAZAWA, Yasunori KUTSUMA
-
Publication number: 20240282749Abstract: A semiconductor device includes a chip that has a main surface, a main surface electrode that covers the main surface, pillar electrodes that are arranged on the main surface electrode at an interval, a sealing insulator that covers a region between the pillar electrodes on the main surface electrode such as to expose parts of the pillar electrodes, and at least one terminal film that covers at least one of the pillar electrodes on the sealing insulator.Type: ApplicationFiled: May 2, 2024Publication date: August 22, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Publication number: 20240282634Abstract: A manufacturing method for a semiconductor device includes a step of preparing a wafer source that has a first main surface on one side and a second main surface on the other side, a step of forming a main surface electrode on the first main surface, a step of forming a terminal electrode on the main surface electrode, a step of forming a sealing insulator that covers a periphery of the terminal electrode on the first main surface such as to expose a part of the terminal electrode, and a step of cutting the wafer source in a horizontal direction along the first main surface from an intermediate portion of a thickness range of the wafer source, and separating the wafer source into a sealed wafer on the sealing insulator side and an unsealed wafer on the second surface side.Type: ApplicationFiled: May 2, 2024Publication date: August 22, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Publication number: 20240282593Abstract: A manufacturing method for a semiconductor device includes a step of preparing a wafer structure that includes a wafer having a main surface, and a main surface electrode arranged on the main surface, a step of forming a terminal electrode on the main surface electrode, a step of preparing a mask member that has a frame portion demarcating an opening portion exposing an inner portion of the main surface and configuring to overlap a peripheral edge portion of the main surface, and arranging the mask member on the main surface such that the frame portion overlaps the peripheral edge portion of the main surface, a step of supplying a sealant including a liquid thermosetting resin into the opening portion such as to cover the terminal electrode and a step of forming a sealing insulator by thermally curing the sealant.Type: ApplicationFiled: May 1, 2024Publication date: August 22, 2024Applicant: ROHM CO., LTD.Inventor: Yuki NAKANO
-
Publication number: 20240280106Abstract: An electric pump includes a case, and a motor that includes a rotor and a stator and is surrounded by the case. The case includes an introduction pipe portion for introducing a fluid and a discharge pipe portion for discharging the fluid. The rotor is disposed in a space surrounded by the case and the stator and communicating with the introduction pipe portion and the discharge pipe portion. The rotor includes a first blade member, a second blade member, and a relay portion. An outer diameter of the relay portion is smaller than an outer diameter of at least one of the first and second blade members. The relay portion is positioned between the first blade member and the second blade member.Type: ApplicationFiled: February 22, 2024Publication date: August 22, 2024Applicant: SHINANO KENSHI CO., LTD.Inventors: Takuya NAKANO, Norihiro SUDO, Akihiro TAKEDA, Yuki SAKYU