Patents by Inventor Yuki Nakano

Yuki Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230223445
    Abstract: An SiC semiconductor device includes an SiC semiconductor layer including an SiC monocrystal and having a first main surface as an element forming surface, a second main surface at a side opposite to the first main surface, and a plurality of side surfaces connecting the first main surface and the second main surface, and a plurality of modified lines formed one layer each at the respective side surfaces of the SiC semiconductor layer and each extending in a band shape along a tangential direction to the first main surface of the SiC semiconductor layer and modified to be of a property differing from the SiC monocrystal.
    Type: Application
    Filed: March 8, 2023
    Publication date: July 13, 2023
    Inventors: Masaya UENO, Yuki NAKANO, Sawa HARUYAMA, Yasuhiro KAWAKAMI, Seiya NAKAZAWA, Yasunori KUTSUMA
  • Patent number: 11691983
    Abstract: Specifically substituted benzofuro- and benzothienoquinolines and their use in electronic devices, especially electroluminescent devices. When used as charge transport material, charge blocker material and/or host material in electroluminescent devices, the specifically substituted benzofuro- and benzothienoquinolines may provide improved efficiency, stability, manufacturability, or spectral characteristics of electroluminescent devices and reduced driving voltage of electroluminescent devices.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: July 4, 2023
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Yuichi Nishimae, Michelle Groarke, Heinz Wolleb, Annemarie Wolleb, Yuki Nakano, Hideaki Nagashima, Tasuku Haketa, Masahiro Kawamura, Takushi Shiomi
  • Publication number: 20230197786
    Abstract: A SiC semiconductor device includes a SiC chip having a main surface, a trench gate structure formed at the main surface, a trench source structure formed at the main surface away from the trench gate structure in one direction, an insulating film covering the trench gate structure and the trench source structure above the main surface, a gate main surface electrode formed on the insulating film and a gate wiring that is led out from the gate main surface electrode onto the insulating film such as to cross the trench gate structure and the trench source structure in the one direction, and that is electrically connected to the trench gate structure through the insulating film, and that faces the trench source structure with the insulating film between the trench source structure and the gate wiring.
    Type: Application
    Filed: July 16, 2021
    Publication date: June 22, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Seigo MORI, Kenji YAMAMOTO, Hiroaki SHIRAGA, Yuki NAKANO, Keigo MINODE
  • Publication number: 20230187486
    Abstract: A semiconductor device includes a semiconductor layer of a first conductivity type having a first main surface at one side and a second main surface at another side, a trench gate structure including a gate trench formed in the first main surface of the semiconductor layer, and a gate electrode embedded in the gate trench via a gate insulating layer, a trench source structure including a source trench formed deeper than the gate trench and across an interval from the gate trench in the first main surface of the semiconductor layer, a source electrode embedded in the source trench, and a deep well region of a second conductivity type formed in a region of the semiconductor layer along the source trench, a ratio of a depth of the trench source structure with respect to a depth of the trench gate structure being not less than 1.5 and not more than 4.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 15, 2023
    Inventors: Minoru NAKAGAWA, Yuki NAKANO, Masatoshi AKETA, Masaya UENO, Seigo MORI, Kenji YAMAMOTO
  • Publication number: 20230187504
    Abstract: A SiC semiconductor device includes a SiC chip having a main surface that includes a first surface, a second surface hollowed in a thickness direction outside the first surface, and a connecting surface connecting the first surface and the second surface, and in which a mesa is defined by the first surface, the second surface and the connecting surface, a trench structure formed at the first surface such as to be exposed from the connecting surface, and a sidewall wiring that is formed on the second surface such as to cover the connecting surface and that is electrically connected to the trench structure.
    Type: Application
    Filed: July 16, 2021
    Publication date: June 15, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Kenji YAMAMOTO, Seigo MORI, Hiroaki SHIRAGA, Yuki NAKANO, Masaya UENO
  • Patent number: 11670633
    Abstract: The semiconductor device of the present invention includes a semiconductor substrate, a switching element which is defined on the semiconductor substrate, and a temperature sense element which is provided on the surface of the semiconductor substrate independently from the switching element and characterized by being dependent on a temperature.
    Type: Grant
    Filed: October 6, 2022
    Date of Patent: June 6, 2023
    Assignee: ROHM CO., LTD.
    Inventor: Yuki Nakano
  • Publication number: 20230170410
    Abstract: A SiC semiconductor device includes SiC chip having main surface that includes first surface, second surface hollowed in thickness direction at first depth outside the first surface, and a connecting surface connecting the first surface and the second surface, and in which a mesa is defined by the first surface, the second surface and the connecting surface, a transistor structure formed at an inward portion of the first surface, the transistor structure including a trench gate structure that has a second depth less than the first depth and a trench source structure that has a third depth exceeding the second depth and that adjoins the trench gate structure in one direction, and a dummy structure formed at a peripheral edge portion of the first surface, the dummy structure including a plurality of dummy trench source structures which have the third depth and adjoin each other in the one direction.
    Type: Application
    Filed: July 16, 2021
    Publication date: June 1, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Seigo MORI, Kenji YAMAMOTO, Hiroaki SHIRAGA, Yuki NAKANO, Masaya UENO
  • Patent number: 11665962
    Abstract: This organic electroluminescence element includes an anode, a cathode, and an organic layer disposed between the anode and the cathode. The organic layer includes a light-emitting layer and at least one layer disposed between the light-emitting layer and the anode. The light-emitting layer includes a compound represented by formula (1), and the at least one layer disposed between the light-emitting layer and the anode includes a compound represented by formula (2).
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: May 30, 2023
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Yuki Nakano, Hirokatsu Ito, Tetsuya Masuda
  • Patent number: 11657717
    Abstract: An information processing apparatus includes: a memory configured to store information about mobile bodies, each of which forms a vehicle by being coupled with a main body unit and is capable of autonomous driving; and a processor configured to transmit a summon command to a first mobile body existing within a predetermined range, the summon command summoning the first mobile body to a predetermined assembly location, and cause a predetermined number of first mobile bodies assembled at the predetermined assembly location to carry one first main body unit that is larger or heavier than a main body unit that can be carried by one first mobile body, and to cause the predetermined number of first mobile bodies to move to a predetermined destination.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: May 23, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuki Nakano, Masato Ura, Koji Takao, Hideyuki Sakurai, Keisuke Hotta, Rieko Masutani, Atsushi Hanawa, Masanobu Ohmi, Takashi Hayashi, Atsushi Nabata, Tetsuro Sakaguchi
  • Publication number: 20230145611
    Abstract: A compound represented by the following formula (1), wherein at least one of Ra to Rd is a substituted or unsubstituted biphenyl-2-yl group; and at least one of Ra to Rd has a specific substituent.
    Type: Application
    Filed: February 19, 2021
    Publication date: May 11, 2023
    Applicant: IDEMITSU KOSAN CO.,LTD.
    Inventors: Yuki NAKANO, Ryota TAKAHASHI, Yoshinao SHIRASAKI, Yu KUDO
  • Patent number: 11643097
    Abstract: An information processing apparatus includes a controller configured to execute the processing of finding, in connection with a first vehicle whose cabin unit and travel unit are separable from each other and that is scheduled to travel a first section of road in which travelling with a travel unit of a first type is suitable and provided with a travel unit of a second type different from the first type, a second vehicle that is scheduled to travel the first section in the direction opposite to the direction of travel of the first vehicle and finish travelling the first section and provided with a travel unit of the first type, and instructing the first vehicle and the second vehicle to exchange the travel unit of the first type and the travel unit of the second type.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: May 9, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuki Nakano, Masato Ura, Koji Takao, Hideyuki Sakurai, Keisuke Hotta, Rieko Masutani, Atsushi Hanawa, Masanobu Ohmi, Takashi Hayashi, Atsushi Nabata, Tetsuro Sakaguchi
  • Publication number: 20230136019
    Abstract: A semiconductor device includes a semiconductor layer that has a main surface, a main surface electrode that is arranged at the main surface, an insulating film that partially covers the main surface electrode such as to expose a portion of the main surface electrode, a mold layer that covers the insulating film such as to expose the main surface electrode, and a pad electrode that is arranged on the main surface electrode such as to be electrically connected to the main surface electrode.
    Type: Application
    Filed: April 30, 2021
    Publication date: May 4, 2023
    Applicant: ROHM CO., LTD.
    Inventor: Yuki NAKANO
  • Publication number: 20230127217
    Abstract: An organic electroluminescence device (1) includes an anode (3), a cathode (4), and an emitting layer disposed between the anode (3) and the cathode (4). The emitting layer includes a first emitting layer (51) and a second emitting layer (52). The first emitting layer (51) contains, as a first host material, a first compound that has at least one group represented by a formula (11) below and that is represented by a formula (1) below, where at least one of R101 to R112 is a group represented by the formula (11).
    Type: Application
    Filed: December 25, 2020
    Publication date: April 27, 2023
    Applicant: IDEMITSU KOSAN CO.,LTD.
    Inventors: Satomi TASAKI, Kazuki NISHIMURA, Yuki NAKANO
  • Publication number: 20230128708
    Abstract: An organic electroluminescence device comprising: a cathode, an anode, and at least one organic layer disposed between the cathode and the anode, wherein at least one layer of the at least one organic layer comprises a compound represented by the following formulas (1-1) and (1-3) or a compound represented by the following formulas (1-2) and (1-3).
    Type: Application
    Filed: December 12, 2022
    Publication date: April 27, 2023
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Ryota TAKAHASHI, Hidetsugu IKEDA, Keita SEDA, Yuki NAKANO
  • Patent number: 11626490
    Abstract: An SiC semiconductor device includes an SiC semiconductor layer including an SiC monocrystal and having a first main surface as an element forming surface, a second main surface at a side opposite to the first main surface, and a plurality of side surfaces connecting the first main surface and the second main surface, and a plurality of modified lines formed one layer each at the respective side surfaces of the SiC semiconductor layer and each extending in a band shape along a tangential direction to the first main surface of the SiC semiconductor layer and modified to be of a property differing from the SiC monocrystal.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: April 11, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Masaya Ueno, Yuki Nakano, Sawa Haruyama, Yasuhiro Kawakami, Seiya Nakazawa, Yasunori Kutsuma
  • Publication number: 20230103655
    Abstract: An electronic component includes a covered object, an electrode that covers the covered object and has an electrode side wall on the covered object, an inorganic insulating film that has an inner covering portion covering the electrode such as to expose the electrode side wall, and an organic insulating film that covers the electrode side wall.
    Type: Application
    Filed: May 12, 2021
    Publication date: April 6, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Yuki NAKANO, Masaya UENO
  • Publication number: 20230109650
    Abstract: A semiconductor device includes a semiconductor layer that has a first main surface at one side and a second main surface at another side, a first main surface electrode that includes a first electrode covering the first main surface and a second electrode having a higher hardness than the first electrode and covering the first electrode, and an oxide layer that covers the first main surface electrode.
    Type: Application
    Filed: April 30, 2021
    Publication date: April 6, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Yuki NAKANO, Yasunori KUTSUMA
  • Patent number: 11621319
    Abstract: An SiC semiconductor device includes an SiC semiconductor layer including an SiC monocrystal that is constituted of a hexagonal crystal and having a first main surface as a device surface facing a c-plane of the SiC monocrystal and has an off angle inclined with respect to the c-plane, a second main surface at a side opposite to the first main surface, and a side surface facing an a-plane of the SiC monocrystal and has an angle less than the off angle with respect to a normal to the first main surface when the normal is 0°.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: April 4, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Masaya Ueno, Sawa Haruyama, Yasuhiro Kawakami, Seiya Nakazawa, Yasunori Kutsuma
  • Patent number: 11618401
    Abstract: There is provided a vehicle system including: a body unit; a traveling unit capable of traveling with the body unit being mounted thereon; coupling units configured to couple the body unit and the traveling unit; a sensor used for predicting a crash; a controller configured to execute causing coupling between the traveling unit and the body unit by the coupling units to be released when a crash is predicted based on a detection value of the sensor; an acting unit provided on one of the traveling unit and the body unit and configured to act so that a positional relationship between the body unit and the traveling unit is changed when the coupling is released; and an acted-upon unit provided on the other between the traveling unit and the body unit and configured to receive action of the acting unit.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: April 4, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuki Nakano, Masato Ura, Koji Takao, Hideyuki Sakurai, Keisuke Hotta, Rieko Masutani, Atsushi Hanawa, Masanobu Ohmi, Takashi Hayashi, Atsushi Nabata, Tetsuro Sakaguchi
  • Publication number: 20230097629
    Abstract: A semiconductor device includes a semiconductor chip having a principal surface, a first-conductivity-type drift region, a second-conductivity-type body region, a first-conductivity-type source region, a plurality of trench source structures that are formed at the principal surface so as to cross the source region and the body region and so as to reach the drift region and that are arranged with intervals therebetween in a first direction, a second-conductivity-type body connection region formed in a region between two of the trench source structures that are adjacent in the surface layer portion of the body region so as to be electrically connected to the body region, and a first-conductivity-type source connection region formed in a region between two of the trench source structures that are adjacent in a region differing from the body connection region in the surface layer portion of body region so as to be electrically connected to source region.
    Type: Application
    Filed: June 18, 2021
    Publication date: March 30, 2023
    Applicant: ROHM CO., LTD.
    Inventor: Yuki NAKANO