Abstract: A method for manufacturing an electronic device comprising the steps of: dry-etching a Ti-containing metal film formed on a substrate with a gas containing fluorine; and treating the substrate with a chemical solution containing fluorine ions after the dry etching step.

Abstract: Electronic device cleaning equipment includes a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed, a vapor supply nozzle for supplying vapor to the obverse face of the substrate, and chemical solution supply means for supplying a chemical solution to the obverse face of the substrate. Accordingly, static electricity present on the obverse face of the substrate is diselectrified.

Abstract: An electronic device cleaning method includes the steps of: placing, on a processing face, a semiconductor substrate having an obverse face portion in which an electronic device is formed so that the processing face faces a reverse face of the semiconductor substrate; diselectrifying at least the reverse face of the semiconductor substrate by irradiating light to the semiconductor substrate by a light source provided at the processing face; and supplying a chemical solution to an obverse face of the semiconductor substrate after the diselectrifying step starts. Whereby, static electricity present on the processing face is removed reliably.

Abstract: A method of manufacturing a honeycomb structure according to an embodiment of the present invention is characterized by including the steps of: forming a clay by mixing and kneading a silicon carbide powder raw material, a metal silicon raw material, an organic binder, and a raw material containing alkaline earth metal; forming the clay to form a formed body; and pre-firing and firing the formed body, wherein firing is performed in a protective container made of silicon carbide in which a solid containing aluminum is placed.

Abstract: There is disclosed a honeycomb structure manufacturing method which is capable of efficiently and inexpensively manufacturing a honeycomb structure for preferable use in a filter for trapping particulates in an exhaust gas or the like by use of a long-life grinding member whose satisfactory grinding performance is retained for a long time. The method includes the step of: working an outer periphery of a coarsely shaped honeycomb structure 20 made of a porous ceramic by use of a grinding member 10 to obtain a honeycomb structure 30 having a predetermined shape, wherein diamond abrasive grains of the grinding member 10 have a grain size of 40 to 150 mesh (JIS B 4130 standard) and a concentration degree of 80 or more, and the surfaces of the diamond abrasive grains are coated with at least one selected from the group consisting of Ti, Ni, and Cr.

Abstract: Respective pieces of the porous honeycomb segments (2) are stacked while interposing the adhesive layers between respective adhered surfaces (2a), and are bonded together by performing main pressurization (F1, F2) on the whole through the porous honeycomb segments (2) located on an outermost layer after stacking a predetermined number of pieces. Main pressurization force at this time is simultaneously applied to all the honeycomb segments (2) and does not act as a separating force against any of the honeycomb segments (2).

Abstract: A method for cleaning electronic devices including the step of cleaning a target substrate placed in a cleaning chamber by etching using a cleaning solution which is circulated for reuse in a cleaning solution circulation path including at least the cleaning chamber and a cleaning solution circulation line, the method further including the steps of: (a) determining etch time based on data concerning variations in amount of a target film on the target substrate etched by the cleaning solution, the variations depending on time elapsed since the cleaning solution was fed into the cleaning solution circulation path; (b) etching the target substrate in the cleaning chamber using the cleaning solution for the determined etch time; and (c) rinsing the target substrate with water.

Abstract: A method for manufacturing an electronic device comprising the steps of: dry-etching a Ti-containing metal film formed on a substrate with a gas containing fluorine; and treating the substrate with a chemical solution containing fluorine ions after the dry etching step.

Abstract: A method of producing a honeycomb structure of the present invention includes the steps of: forming plugged portions by dipping an end face of a honeycomb structure in slurry in a container, and pressing the honeycomb structure against an inner bottom surface of the container to force the slurry into at least some of the cells; and bringing out the honeycomb structure from the container to obtain the honeycomb structure having at least some of the cells being plugged. An air layer is formed between the plugged portions and the inner bottom surface of the container to separate them from each other in advance of bringing out the honeycomb structure having plugged portions from the container.

Abstract: There is disclosed a die for forming a honeycomb structure and a method of manufacturing the honeycomb structure by use of the die, in which variations of cell pitches are suppressed in a central portion and the vicinity of an outer periphery after drying and firing an extruded honeycomb structure, and the honeycomb structure having a uniform cell pitch can be manufactured. A die 1 for forming a honeycomb structure has a front surface provided with groovy slits 2 formed between cell blocks 3 and a back surface provided with back holes 4a communicating with the slits 2. The die 1 has a structure in which a pitch P of the adjacent cell blocks 3 is enlarged from a central portion of the front surface toward an outer periphery in a stepwise manner.

Abstract: There is disclosed a die cleaning method for removing a forming-material from a die used in forming the forming-material containing a binder, comprising the steps of: removing a part or all of the binder contained in the forming-material from the die; and removing the forming-material from the die, whereby the forming-material in the die can be removed without damaging or deforming the die for use in forming the forming-material containing the binder.

Abstract: A honeycomb structure 1 has a large number of through-holes 3 divided by partition walls 2 and extending in the axial direction, characterized in that the honeycomb structure contains a Si phase having a lattice constant controlled at 0.54302 to 0.54311 nm at room temperature. A process for producing the honeycomb structure 1, includes a firing step of firing a precursor of honeycomb structure, wherein the precursor contains a Si phase and the firing step is conducted using a furnace material free from any boron-containing compound. A process for producing the honeycomb structure 1, includes a firing step of firing a precursor of honeycomb structure, wherein a reduction percentage of Si content in Si phase after firing step relative to Si content in Si phase before firing step is suppressed at 10% by mass or less. Having an improved thermal conductivity, the honeycomb structure is superior in thermal shock resistance.

Abstract: There is disclosed a method of manufacturing a porous ceramic structure, comprising the steps of: preparing a formed structure using a ceramic material containing a pore former and a binder; and drying and firing the formed structure, wherein the process of firing the formed structure comprises the steps of: holding a firing atmosphere temperature in a temperature range of ?50 to +10° C. with respect to a combustion start temperature of the binder from the time when the temperature reaches the combustion start temperature of the binder contained in the porous ceramic structure to be fired to the time when the binder is burnt out. According to this method, ceramic structures having not only a low porosity but also a high porosity can be manufactured without generating any crack during the firing.

Abstract: A method of producing a honeycomb structure of the present invention includes the steps of: forming plugged portions 2 by dipping an end face of a honeycomb structure 1 in slurry 8 in a container 9, and pressing the honeycomb structure against an inner bottom surface of the container 9 to force the slurry 8 into at least some of the cells 8; and bringing out the honeycomb structure 1 from the container 9 to obtain the honeycomb structure 1 having at least some of the cells 3 being plugged. An air layer 10 is formed between the plugged portions 2 and the inner bottom surface of the container 9 to separate them from each other in advance of bringing out the honeycomb structure 1 having plugged portions 2 from the container 9.

Abstract: The present invention provides a method for manufacturing a honeycomb structure, the method including steps of: forming, by extrusion, a formed body 1 having an outer wall, partition walls provided inside the outer wall, and cells each surrounded by the partition walls as well as extending to an axial direction of the body; and drying the formed body 1.

Abstract: There is disclosed a die cleaning method for removing a forming-material from a die used in forming the forming-material containing a binder, comprising the steps of: removing a part or all of the binder contained in the forming-material from the die; and removing the forming-material from the die, whereby the forming-material in the die can be removed without damaging or deforming the die for use in forming the forming-material containing the binder.

Abstract: A method of drying a honeycomb formed body comprising an outer wall, partition walls disposed inside the outer wall, and cells surrounded by the partition walls and extending in an axial direction of the honeycomb formed body. The method of drying a honeycomb formed body comprises a drying step of starting to dry in a state of covering at least a part of the outer wall 7a and 7b with a guide 12 covering the outer wall 7a and/or 7b so as not to come into contact with the outer wall 7a and/or 7b. Alternatively, the method of drying a honeycomb formed body comprises a drying step of drying in a state of covering at least a part of the outer wall with a guide that covers the outer wall so as to come into contact with the outer wall, wherein in the drying step the pressure applied to the outer wall by the guide at the contact portion is less than 0.2 MPa. A method of drying a honeycomb formed body causing less distortion and cross sectional deformation in the honeycomb formed body is provided.

Abstract: A method for manufacturing a porous ceramic structure which can produce a high porosity ceramic structure as well as a low porosity ceramic structure without causing cracks at the time of firing. A method for manufacturing a porous ceramic structure comprising molding a raw material which contains a ceramic material as a main component and a pore-forming agent and then drying and firing the obtained molded article. When the molded article is fired, the temperature of a firing environment is raised substantially in synchronization with the temperature of the central portion of the molded article within a temperature range in which at least a portion of the molded article is shrunk by firing.

Abstract: There is provided a method for fabricating a semiconductor device involving the formation of two or more oxide films having different etching properties. A multilayer-film sidewall including a first oxide film such as an NSG film, a TEOS film, or a HTO film and a second oxide film such as a BPSG film or a PSG film is formed over the side surfaces of a gate electrode. After the multilayer-film sidewall is used as an implantation mask for forming the source and drain of a MIS transistor, wet etching is performed by using an aqueous solution mixture containing a hydrofluoric acid and an inorganic acid (a hydrochloric acid, a sulfuric acid, or the like) in selectively removing the second oxide film. This increases the etching selectivity between the individual oxide films and allows the removal of only the upper-layer second oxide film.

Abstract: There are provided a porous honeycomb structure body capable of satisfying a pressure loss and isostatic strength which are mutually contradictory properties simultaneously and a method for manufacturing the same. In a porous honeycomb structure body having partition walls which contain cordierite as a primary crystal phase and have a porosity of 40 to 75% and an average pore diameter of 10 to 50 &mgr;m, porosity and an average pore diameter in a center portion of the structure body are made larger than porosity and an average pore diameter in a peripheral portion of the structure body.