Abstract: A touch sensor includes a base, first sensing electrode columns (FSECs), and second sensing electrode columns (SSECs). The base includes a sensing region (SR) including a rounded corner (RC), and a non-SR outside the SR. The FSECs extend in a direction on the base, each FSEC among the FSECs including first sensing electrodes (FSEs), each FSE among the FSEs including sub-electrodes. The SSECs are alternately disposed with the FSECs on the base, each SSEC among the SSECs including second sensing electrodes (SSEs). Sub-electrodes of one of adjacent FSEs among the FSEs are electrically connected to respective sub-electrodes of another of the adjacent FSEs. A sub-electrode closest to the RC among the sub-electrodes includes a rounded edge (RE) corresponding to the RC. A SSE closest to the RC among the SSEs includes a RE corresponding to the RC, and a protrusion part protruding toward the sub-electrode including the RE.

Abstract: A touch screen includes a base film which includes a sensing area and a non-sensing area; a plurality of first touch electrodes including a plurality of sub-touch electrodes disposed in the sensing area; a plurality of second touch electrodes disposed in the sensing area; first and second sensing lines disposed in the non-sensing area; and a bridge line which is disposed in the non-sensing area and is connected to the first sensing line. The bridge line includes a multilayer structure in which at least two sub-bridge lines are stacked to overlap each other in plan view.

Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

Abstract: A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

Abstract: A transformer includes a magnetic core, a first coil unit and a second coil unit. The first coil unit is disposed within the magnetic core and includes a laminated board having layers laminated therein and conductive patterns. Respective ones of the conductive patterns are disposed on the laminated layers. The second coil unit includes a conductive wire spaced apart from the conductive patterns of the laminated board by an insulating distance. The conductive wire includes a triple-insulated wire surrounded by three sheets of insulating paper to maintain the insulating distance from the conductive patterns.

Abstract: A package includes an Integrated Voltage Regulator (IVR) die, wherein the IVR die includes metal pillars at a top surface of the first IVR die. The package further includes a first encapsulating material encapsulating the first IVR die therein, wherein the first encapsulating material has a top surface coplanar with top surfaces of the metal pillars. A plurality of redistribution lines is over the first encapsulating material and the IVR die. The plurality of redistribution lines is electrically coupled to the metal pillars. A core chip overlaps and is bonded to the plurality of redistribution lines. A second encapsulating material encapsulates the core chip therein, wherein edges of the first encapsulating material and respective edges of the second encapsulating material are vertically aligned to each other. An interposer or a package substrate is underlying and bonded to the IVR die.

Abstract: A cell layout, a cell layout library and a synthesizing method are disclosed. The cell layout includes a cell block and a tapping connector. The cell block has a pin. The pin being disposed at a Nth metal layer in the cell layout. The tapping connector is disposed at a (N+1)th metal layer and a (N+2)th metal layer and stacked above the pin of the cell block. The tapping connector is electrically connected to the pin and forms an equivalent tapping point of the pin of the cell block. N is a positive integer greater than or equal to 1.

Abstract: Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.

Abstract: A bi-directional scan chain includes a plurality of cell structures, each cell structure having a storage device and at least one multiplexer, the plurality of cell structures coupled to one another in a series configuration, wherein an output of a (K?1)-th cell structure is provided as input to the K-th cell structure to provide a forward data shifting operation, and an output of the K-th cell structure is provided as an input to the (K?1)-th cell structure to provide a backward data shifting operation, where K is an integer greater than 1.

Abstract: A device includes a fault generation circuit and a first fault injection circuit. The fault generation circuit is configured to generate a fault signal and a plurality of control signals according to a mode signal. The first fault injection circuit is configured to inject a first final fault signal to an under-test device based on the fault signal and the plurality of control signals, in order to verify robustness of the under-test device.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation of a various loads on one or more batteries of an electronic device resulting from the electronic device performing one or more functional behaviors. Before this electronic simulation occurs, the electronic device is modeled using the high-level software language or the high-level software format. For example, a battery discharge model, a regulator efficiency model, a power delivery network (PDN) model, or a component power model are used to model behaviors of the one or more batteries, regulator circuitry, power delivery network (PDN) circuitry, and other electronic circuits, respectively, of the electronic device.

Abstract: An optical display system includes an information display (image-generating) component, a polarization dependent image offset optical element and possibly also a polarization rotator. By controlling the image offset optical element either by direct applying voltage or by controlling the polarization of the displayed light through the polarization rotator, the display pixels can be switched by a certain portion. By switching between offset and non-offset state with appropriate image displayed, the resolution as observed by the users can be enhanced.

Abstract: A method of estimating power consumption for a system on chip (SOC) includes simulating operation of a first sub-block to obtain power consumption information for the first sub-block including first activation information for a first IP block. The method further includes simulating operation of a second sub-block to obtain power consumption information for the second sub-block including second activation information for the first IP block and activation information for a plurality of second IP blocks. The method further includes determining a weighting factor for the first activation information for the first IP block, the second activation information for the first IP block and the activation information for each second IP block. The method further includes estimating power consumption for the SOC based on the first and second activation information for the first IP block, the activation information for at least one second IP block, and corresponding weighting factors.

Abstract: A method of estimating power consumption of a processor includes accessing an electronic system level (ESL) model of the processor, the ESL model including a plurality of functional blocks, identifying a plurality of processor events by tracing activity of the plurality of functional blocks for a plurality of machine code instructions, and calculating a first power consumption value based on the plurality of processor events. The method also includes identifying a plurality of cycles by analyzing a plurality of micro-code operation codes corresponding to the plurality of machine code instructions, calculating a second power consumption value based on the plurality of cycles, and calculating a total power consumption value from the first power consumption value summed with the second power consumption value.

Abstract: Electronic design automation (EDA) of the present disclosure, in various embodiments, optimizes designing, simulating, analyzing, and verifying of one or more electronic architectural designs for an electronic device. The EDA of the present disclosure identifies one or more electronic architectural features from the one or more electronic architectural designs. In some situations, the EDA of the present disclosure can manipulate one or more electronic architectural models over multiple iterations using a machine learning process until one or more electronic architectural models from among the one or more electronic architectural models satisfy one or more electronic design targets. The EDA of the present disclosure substitutes the one or more electronic architectural models that satisfy the one or more electronic design targets for the one or more electronic architectural features in the one or more electronic architectural designs to optimize the one or more electronic architectural designs.

Abstract: Systems and methods for circuit fault diagnosis are provided. An original circuit design is evaluated to determine whether the original circuit design is to be modified based at least in part on one or more first faults. In response to the original circuit design being determined not to be modified based at least in part on the one or more first faults, a first test pattern set is automatically generated based at least in part on the original circuit design. The original circuit design is evaluated to determine whether the original circuit design is to be modified based at least in part on the first test pattern set. In response to the original circuit design being determined not to be modified based at least in part on the first test pattern set, fault testing is performed to determine whether the original circuit design fails.