Abstract: A transceiver group includes a plurality of transceivers; wherein the transceiver group performs transmission and receiving through a wire, and each of the transceivers includes a transmitter and a receiver, and the transmitter includes: a carrier generator arranged to generate a plurality of carriers having different frequencies for a plurality of data streams to be transmitted; a modulator, coupled to the data streams to be transmitted and the carrier generator, to generate a plurality of modulated data streams carried on the plurality of carriers; and a summer arranged to merge the plurality of modulated data streams to an output signal to the wire; and the receiver includes: a carrier generator arranged to generate a plurality of carriers having different frequencies for an input signal received from the wire; and a demodulator, coupled to the input signal and the carrier generator, to generate a plurality of demodulated data streams.

Abstract: Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.

Abstract: A device comprises a first die; and a second die stacked below the first die with interconnections between the first die and the second die. A least one of the first die or the second die has a circuit for performing a function and provides a functional path. Each of the first and second dies comprise a plurality of latches, including a respective latch corresponding to each one of the interconnections; and a plurality of multiplexers. Each multiplexer is connected to a respective one of the plurality of latches and arranged for receiving and selecting one of a scan test pattern or a signal from the functional path for outputting during a scan chain test of the first die and second die.

Abstract: A backlight module includes a back plate, a diffuser opposite to the back plate, a plurality of dot light sources arranged on a surface of the backplate facing toward the diffuser in a matrix, thermal emitters configured between the dot light sources, and an optical film configured on the surface of the diffuser facing away the backplate. In addition, the present disclosure also relates to a liquid crystal panel and a liquid crystal device (LCD). The backlight module radiates infrared rays toward the liquid crystal panel, and the liquid crystal within the liquid crystal panel may convert the infrared rays into heat. That is, the absorbed rays may be converted into thermal energy heating up the liquid crystal panel. Thus, even at a low temperature, the LCD may function normally.

Abstract: A method performed at least partially by a processor includes performing a test sequence. In the test sequence, a test pattern is loaded into a circuit. The test pattern is configured to cause the circuit to output a predetermined test response. A test response is unloaded from the circuit after a test wait time period has passed since the loading of the test pattern into the circuit. The unloaded test response is compared with the predetermined test response.

Abstract: A power state transformer, a system and a method thereof are disclosed. The power state transformer is coupled with a processing unit model. The power state transformer is configured for counting performance activities executed in the processing unit model, and further for determining a power state of the processing unit model according to count values of the performance activities.

Abstract: A method of estimating power consumption of a processor includes accessing an electronic system level (ESL) model of the processor, the ESL model including a plurality of functional blocks, identifying a plurality of processor events by tracing activity of the plurality of functional blocks for a plurality of machine code instructions, and calculating a first power consumption value based on the plurality of processor events. The method also includes identifying a plurality of cycles by analyzing a plurality of micro-code operation codes corresponding to the plurality of machine code instructions, calculating a second power consumption value based on the plurality of cycles, and calculating a total power consumption value from the first power consumption value summed with the second power consumption value.

Abstract: A touch screen including a plurality of first sensing electrode columns having a plurality of first sensing electrodes, the plurality of first sensing electrode columns extending in one direction, and a plurality of second sensing electrode columns alternately disposed with the first sensing electrode columns, the plurality of second sensing electrode columns including a plurality of second sensing electrodes having a plurality of sub-electrodes. Sub-electrodes of one of adjacent second sensing electrodes are electrically connected to sub-electrodes of another of the adjacent second sensing electrodes. At least some of the first sensing electrodes include a first region and a second region electrically separated from the first region.

Abstract: A touch sensor includes: a plurality of first sensor electrode columns disposed in a sensing area, the plurality of first sensor electrode columns each including one or more first sensor electrodes; a plurality of second sensor electrode columns alternately disposed with the first sensor electrode columns in the sensing area, the plurality of second sensor electrode columns each including a plurality of second sensor electrodes having a length defined by a longitudinal axis and a width extending in a direction across the length; a plurality of lines connected to the first sensor electrode columns and the second sensor electrode columns; and a pad unit including a plurality of pads connected to the lines, wherein at least some of the second sensor electrodes have a width that varies along the longitudinal axis of its respective second electrodes.

Abstract: A method is disclosed that includes establishing an intellectual property (IP) bank, an application bank, and a technology bank; selecting valid configurations from the IP bank for corresponding IPs and at least one subsystem based on the application data, for generating in response to a user-defined requirement, by a model generator, a performance, power, area and cost (PPAC) model of the valid configurations; based on the PPAC model, creating at least one architecture comprising at least one of the corresponding IPs, and at least one of the valid configurations for the at least one of the corresponding IPs; and, estimating, by a PPAC explorer assessing the technology bank, at least one of a performance value, a power value, an area value and a cost value for a fabrication of the at least one architecture by simulating available fabrication process technology based on the technology bank.

Abstract: A transformer includes a magnetic core, a first coil unit and a second coil unit. The first coil unit is disposed within the magnetic core and includes a laminated board having layers laminated therein and conductive patterns. Respective ones of the conductive patterns are disposed on the laminated layers. The second coil unit includes a conductive wire spaced apart from the conductive patterns of the laminated board by an insulating distance. The conductive wire includes a triple-insulated wire surrounded by three sheets of insulating paper to maintain the insulating distance from the conductive patterns.

Abstract: In one embodiment, a processor includes a plurality of domains each to operate at an independently controllable voltage and frequency, a plurality of linear regulators each to receive a first voltage from an off-chip source and controllable to provide a regulated voltage to at least one of the plurality of domains, and a plurality of selectors each coupled to one of the domains, where each selector is configured to provide a regulated voltage from one of the linear regulators or a bypass voltage to a corresponding domain. Other embodiments are described and claimed.

Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

Abstract: A partition method includes sorting the plurality of components into a plurality of partitions according to a set of partition criteria and sorting the plurality of components of each partition into a first stack and a second stack according to a set of stack criteria, and the first stack includes a plurality of higher pitch metal layers and the second stack includes a plurality of lower pitch metal layers. The partition criteria include size, power and speed of the component, and the stack criteria include a pitch of a metal layer.

Abstract: A bi-directional scan chain includes a plurality of cell structures, each cell structure having a storage device and at least one multiplexer, the plurality of cell structures coupled to one another in a series configuration, wherein an output of a (K-1)-th cell structure is provided as input to the K-th cell structure to provide a forward data shifting operation, and an output of the K-th cell structure is provided as an input to the (K-1)-th cell structure to provide a backward data shifting operation, where K is an integer greater than 1.

Abstract: A system and method for designing integrated circuits is disclosed. An embodiment comprises placing a standard cell with a first cell height into a cell row with a different height. The standard cell may have a height smaller than the cell row or else may have a height that is larger than the cell row. Vertical fillers and horizontal fillers are utilized to extend and connect the standard cell to adjacent cells without having to redesign the entire cell row.

Abstract: A method of estimating power consumption for a system on chip (SOC) includes simulating operation of a first sub-block to obtain power consumption information for the first sub-block including first activation information for a first IP block. The method further includes simulating operation of a second sub-block to obtain power consumption information for the second sub-block including second activation information for the first IP block and activation information for a plurality of second IP blocks. The method further includes determining a weighting factor for the first activation information for the first IP block, the second activation information for the first IP block and the activation information for each second IP block. The method further includes estimating power consumption for the SOC based on the first and second activation information for the first IP block, the activation information for at least one second IP block, and corresponding weighting factors.

Abstract: Some embodiments relate to a semiconductor module comprising a low-cost integrated antenna that uses a conductive backside structure in conjunction with a ground metal layer to form a large ground plane with a small silicon area. In some embodiments, the integrated antenna structure has an excitable element that radiates electromagnetic radiation. An on-chip ground plane, located on a first side of an interposer substrate, is positioned below the excitable element. A compensation ground plane, located on an opposing side of the interposer substrate, is connected to the ground plane by one or more through-silicon vias (TSVs) that extend through the interposer substrate. The on-chip ground plane and the compensation ground collectively act to reflect the electromagnetic radiation generated by the excitable element, so that the compensation ground improves the performance of the on-chip ground plane.

Abstract: A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.

Abstract: The present disclosure provides a liquid crystal display panel, which includes a first control line, a second control line, a plurality of sub pixel columns and a plurality of strip common electrodes, the first control line and the second control line are spacedly disposed in parallel along a X axis direction, the plurality of sub pixel columns and the plurality of strip common electrodes are spacedly disposed in parallel along a Y axis direction, each of the strip common electrodes covers at least one of the sub pixel columns, the strip common electrodes in odd columns are connected to the first control line, the strip common electrodes in even columns are connected to the second control line. In addition the present disclosure further provides an electronic device. The liquid crystal display panel may achieve the columns between the sub pixel columns or the pixel columns to rotate.