Patents by Inventor Yun Lin

Yun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220366116
    Abstract: An integrated circuit (IC) may include a plurality of functional blocks, and each functional block of the plurality of functional blocks may include hardware circuits, wherein the plurality of functional blocks may include a first functional block. In addition, the first functional block may include a first macro circuit that is positioned within a first sub-region of the first functional block, wherein among multiple sides of the first sub-region, a first side of the first sub-region is closest to a boundary of the first functional block. Additionally, a first intermediate sub-region of the first functional block is positioned between the first side of the first sub-region and the boundary of the first functional block, and there is no tap cell in the first intermediate sub-region of the first functional block.
    Type: Application
    Filed: February 16, 2022
    Publication date: November 17, 2022
    Applicant: MEDIATEK INC.
    Inventors: Yu-Tung Chang, Yi-Chun Tsai, Tung-Kai Tsai, Yi-Te Chiu, Shih-Yun Lin, Hung-Ming Chu, Yi-Feng Chen
  • Publication number: 20220337797
    Abstract: The disclosure relates to a projection system and an operation method thereof. The projection system includes a central control platform and a projection apparatus. The central control platform generates a sequence signal according to a self-defined setting. The projection apparatus is coupled to the central control platform and includes a power circuit, a first processing circuit, and an optical engine module. The power circuit passes the sequence signal through an energy storage element to generate a power supply. The first processing circuit performs an operation based on the power supply to generate a decoding result according to the sequence signal. The optical engine module obtains image information according to the decoding result and generates a display image according to the image information.
    Type: Application
    Filed: October 29, 2021
    Publication date: October 20, 2022
    Applicant: Coretronic Corporation
    Inventors: Yun-Lin Miao, Shao-Chi Lin
  • Patent number: 11453731
    Abstract: The present invention is directed to partially fluorinated copolymers and the production thereof. More specifically, the copolymers, which are preferably produced by a solution polymerization process, preferably have at least three units, the first unit selected from 2,3,3,3-tetrafluoropropene and 1,3,3,3-tetrafluoropropene, the second unit having a polymerized monomer selected from the vinyl esters and vinyl ethers, and the third unit having a polymerized monomer derived from a hydroxyl group-containing vinyl ether. The resulting copolymer is environmentally friendly, has favorable molecular weight characteristics, and may be shipped economically in high concentration.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: September 27, 2022
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Wanchao Jiang, Shijun Feng, Siyuan Zhang, Yun Lin, Andrew J. Poss
  • Publication number: 20220294731
    Abstract: The present disclosure provides a method (100) in a network node advertising a Binding Segment Identifier, BSID. The method (100) includes: receiving (110) a first echo request packet containing a first target Forwarding Equivalence Class, FEC, stack including an FEC associated with the BSID; and transmitting (120), in response to a Time To Live, TTL, expiration associated with the first echo request packet, a first echo reply packet to an initiating network node initiating the first echo request packet, the first echo reply packet containing an indicator indicating that the FEC is to be replaced by a set of FECs.
    Type: Application
    Filed: September 9, 2019
    Publication date: September 15, 2022
    Inventors: Ying Lu, Shuo Yang, Wei Sun, Jinfeng Zhao, Yun Lin
  • Patent number: 11431268
    Abstract: A motor driving system includes a controller, motors and motor drivers. In the normal supplying state of a power supply, the controller controls the motor drivers. The motor drivers output driving signals for driving the motors respectively. In an abnormal state or a power-off state of the power supply, one of the motor drivers is set to be a master driver and the others are set to be slave driver. The master driver activates a deceleration energy backup (DEB) function, powers the slave drivers through a common-DC-bus structure, controls the slave drivers, and during deceleration maintains a ratio between frequencies of the driving signals, until all of the motors are decelerated to stop at the same time.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: August 30, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Yun Lin, Chia-Wei Chou, Chen-Hsiang Kuo
  • Publication number: 20220240645
    Abstract: A telescopic container includes a collar, a handle and a cap. The collar is used to contain an object in the form of a stick. The collar includes a stern extending from an external face. The handle movably receives the collar. The handle includes a front end formed with a cutout. The cap is used to cover a section of the handle. The cap includes a rear end formed with a cutout. The cutouts receive the stem when the front end of the handle is in contact with the rear end of the cap.
    Type: Application
    Filed: February 3, 2021
    Publication date: August 4, 2022
    Inventor: HSIAO-YUN LIN
  • Publication number: 20220246509
    Abstract: A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 4, 2022
    Inventors: CHIN-HER CHIEN, PO-HSIANG HUANG, CHENG-HUNG YEH, TAI-YU WANG, MING-KE TSAI, YAO-HSIEN TSAI, KAI-YUN LIN, CHIN-YUAN HUANG, KAI-MING LIU, FONG-YUAN CHANG, CHIN-CHOU LIU, YI-KAN CHENG
  • Publication number: 20220228227
    Abstract: Two PARMS-SNP molecular markers for identifying resistant gene VrTAF5 of Vigna radiata (Linn.) Wilczek Cercospora leaf spot disease are provided, which belongs to the field of molecular genetic breeding. The two molecular markers PARMS-1517 and PARMS-10010 include SNP sites located at the 32622352 and 32613913 bases of Vigna radiata (Linn.) Wilczek chromosome 6 respectively. 240 bp sequence before and after the PARMS-1517 is shown in SEQ ID NO.1, a 131st position is SNP site, and a polymorphism is A/C; 240 bp sequence before and after the PARMS-10010 is shown in SEQ ID NO.2, a 117th position is SNP site, and a polymorphism is A/G. The PARMS-SNP molecular markers have a high specificity, accurate and reliable detection results, which can be used for rapid identifying Vigna radiata (Linn.) Wilczek Cercospora leaf spot disease resistant varieties, molecular marker-assisted selective breeding, and shortening a breeding period.
    Type: Application
    Filed: November 10, 2021
    Publication date: July 21, 2022
    Inventors: Ranran Wu, Linghui Li, Xin Chen, Jingbin Chen, Yun Lin, Xingxing Yuan, Chenchen Xue, Qiang Yan
  • Patent number: 11392745
    Abstract: A method of manufacturing an integrated circuit (IC) includes receiving a layout of the IC having a first region interposed between two second regions. The layout includes a first layer having first features and second and third layer having second and third features in the first region. The second and third features collectively form cut patterns for the first features. The method further includes modifying the second and third features by a mask house tool, resulting in modified second and third features, which collectively form modified cut patterns for the first features. The modifying of the second and third features meets at least one of following conditions: total spacing between adjacent modified second (third) features is greater than total spacing between adjacent second (third) features, and total length of the modified second (third) features is smaller than total length of the second (third) features.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 19, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Lin Wu, Cheng-Cheng Kuo, Chia-Ping Chiang, Chih-Wei Hsu, Hua-Tai Lin, Kuei-Shun Chen, Yuan-Hsiang Lung, Yan-Tso Tsai
  • Patent number: 11387177
    Abstract: A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: July 12, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Her Chien, Po-Hsiang Huang, Cheng-Hung Yeh, Tai-Yu Wang, Ming-Ke Tsai, Yao-Hsien Tsai, Kai-Yun Lin, Chin-Yuan Huang, Kai-Ming Liu, Fong-Yuan Chang, Chin-Chou Liu, Yi-Kan Cheng
  • Patent number: 11356509
    Abstract: Methods, apparatus, and computer-accessible storage media for providing a volume-based block storage service and application programming interfaces (APIs) to the service. A block storage service and block storage service APIs may allow processes (applications or appliances) on the service client network to leverage remote, volume-based block storage provided by the service provider. The APIs may provide a standard interface to volume-based block storage operations on a remote data store. The service provider, the service clients, and/or third parties may develop various applications and/or appliances that may, for example, be instantiated in service clients' local networks and that leverage the block storage service via the APIs to create and manage volumes and snapshots on the remote data store and to upload and download data from the volumes and snapshots on the remote data store.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: June 7, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Yun Lin, James Christopher Sorenson, III, David C. Salyers
  • Publication number: 20220139772
    Abstract: Integrated circuit interconnect structures including an interconnect metallization feature with a liner material of a greater thickness between a fill metal and dielectric material, and of a lesser thickness between the fill metal and a lower-level interconnect metallization feature. The liner material may be substantially absent from an interface between the fill metal and the lower-level interconnect metallization feature. Liner material of reduced thickness at a bottom of the via may reduce via resistance and/or facilitate the use of a highly resistive liner material that may enhance the scalability of interconnect structures. In some embodiments, liner material is deposited upon dielectric surfaces with an area selective atomic layer deposition process. For single damascene implementations, both a via and a metal line may include a selectively deposited liner material.
    Type: Application
    Filed: November 2, 2020
    Publication date: May 5, 2022
    Applicant: Intel Corporation
    Inventors: Christoper Jezewski, Jiun-Ruey Chen, Miriam Reshotko, James M. Blackwell, Matthew Metz, Che-Yun Lin
  • Publication number: 20220087565
    Abstract: Systems and methods relating to a smart elastic fabric tape are disclosed. For example, a method may include interrogating a sensing mesh using an electrical impedance tomography (EIT) device, wherein the sensing mesh is affixed onto skin nearby a musculoskeletal (MSK) region of interest, wherein the sensing mesh comprises a nanocomposite thin film disposed on elastic fabric tape, and wherein the sensing mesh forms a geometrical pattern on the skin; generating, in real-time, EIT conductivity maps from interrogating the sensing mesh; and generating, in real time, strain distribution and strain directionality data of the MSK region of interest based on the EIT conductivity maps.
    Type: Application
    Filed: July 19, 2021
    Publication date: March 24, 2022
    Inventors: Kenneth Loh, Yun-An Lin
  • Publication number: 20220069744
    Abstract: A motor driving system includes a controller, motors and motor drivers. In the normal supplying state of a power supply, the controller controls the motor drivers. The motor drivers output driving signals for driving the motors respectively. In an abnormal state or a power-off state of the power supply, one of the motor drivers is set to be a master driver and the others are set to be slave driver. The master driver activates a deceleration energy backup (DEB) function, powers the slave drivers through a common-DC-bus structure, controls the slave drivers, and during deceleration maintains a ratio between frequencies of the driving signals, until all of the motors are decelerated to stop at the same time.
    Type: Application
    Filed: May 11, 2021
    Publication date: March 3, 2022
    Inventors: Cheng-Yun LIN, Chia-Wei CHOU, Chen-Hsiang KUO
  • Publication number: 20220068794
    Abstract: Metal insulator metal capacitors are described. In an example, a capacitor includes a first electrode plate, and a first capacitor dielectric on the first electrode plate. A second electrode plate is on the first capacitor dielectric and is over and parallel with the first electrode plate, and a second capacitor dielectric is on the second electrode plate. A third electrode plate is on the second capacitor dielectric and is over and parallel with the second electrode plate, and a third capacitor dielectric is on the third electrode plate. A fourth electrode plate is on the third capacitor dielectric and is over and parallel with the third electrode plate. In another example, a capacitor includes a first electrode, a capacitor dielectric on the first electrode, and a second electrode on the capacitor dielectric. The capacitor dielectric includes a plurality of alternating first dielectric layers and second dielectric layers.
    Type: Application
    Filed: December 21, 2020
    Publication date: March 3, 2022
    Inventors: Aaron J. WELSH, Christopher M. PELTO, David J. TOWNER, Mark A. BLOUNT, Takayoshi ITO, Dragos SEGHETE, Christopher R. RYDER, Stephanie F. SUNDHOLM, Chamara ABEYSEKERA, Anil W. DEY, Che-Yun LIN, Uygar E. AVCI
  • Publication number: 20220041884
    Abstract: Methods of reducing the release of volatile organic compounds (VOCs) into the Earth's atmosphere during coating operations are provided, as well as a coating composition comprising a carrier and one or more fluorocopolymers. The carrier comprises VOC compounds and the one or more fluorocopolymers is produced by copolymerization of (1) a first monomer selected from the group consisting of hydrofluoroalkenes, (2) a second monomer comprising vinyl ester(s), and (3) a third monomer comprising vinyl ether(s), wherein at least a portion of the vinyl ether monomer is a hydroxyl group-containing vinyl ether, and wherein the one or more fluorocopolymers comprise at least about 70% by weight of the coating composition and the VOC portion of the carrier is not greater than about 30% by weight of the coating composition.
    Type: Application
    Filed: September 6, 2021
    Publication date: February 10, 2022
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: WANCHAO JIANG, RAJIV RATNA SINGH, GANG XU, SIYUAN ZHANG, YUN LIN
  • Publication number: 20220040309
    Abstract: The present invention provides compositions and methods for delivery of therapeutic agents across an barrier. The compositions include a therapeutic agent (e.g., antimicrobial agent, antibiotic, or anesthetic agent), a permeation enhancer which increases the flux of the therapeutic agent across the barrier, and a matrix forming agent. The matrix forming agent forms a gel at a suitable gelation temperature and rheological properties for use in drug delivery, and in some cases, the gelation temperature and rheological properties are not significantly changed from those of the composition without the permeation enhancer. The invention also provides a matrix forming agent and compositions thereof. Such compositions are particularly useful in the treatment of otitis media. Methods of treatment, methods of delivery, and kits for the compositions described herein are also provided.
    Type: Application
    Filed: July 23, 2021
    Publication date: February 10, 2022
    Applicants: Children's Medical Center Corporation, Massachusetts Institute of Technology
    Inventors: Daniel S. Kohane, Rong Yang, Lily Yun Lin
  • Patent number: 11239607
    Abstract: A fastening device for expansion cards that is capable of connecting to a slot on a normal motherboard and fastening an expansion card in the slot is disclosed. The fastening device includes a top pressing unit and two side fastening units, wherein the two side fastening units are connected to two ends of the top pressing unit, respectively, and each side fastening unit is provided with an opening. When two clip units disposed on the two ends of the slot pass through the openings of the two side fixing units respectively, the top pressing unit presses the top edge of the expansion card inserted into the slot and the two side fastening units respectively press and fasten the two clip units so as to restrain the clip units from unlocking and to prevent the expansion card from becoming loose in the slot.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: February 1, 2022
    Assignee: Innodisk Corporation
    Inventors: Shuang-Te Chang, Ting-Yun Lin, Cheng-Wei Lee, Rei Yeh, Chung-Yu Chuang
  • Publication number: 20220022626
    Abstract: A cosmetic container includes a cylinder, a lining and an elevator. The cylinder is made of metal and includes a slot. The lining is made of metal, includes a helical groove, and wraps the cylinder so that the helical groove intersects the slot. The elevator is made of metal, includes a boss, and is inserted in the cylinder so that the boss is movable in and along the slot and the helical groove to elevate the elevator relative to the cylinder.
    Type: Application
    Filed: July 21, 2020
    Publication date: January 27, 2022
    Inventor: HSIAO-YUN LIN
  • Patent number: D944638
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: March 1, 2022
    Assignee: LIBO COSMETICS CO., LTD.
    Inventor: Hsiao-Yun Lin