Abstract: A printed circuit board (PCB) includes a substrate base including at least two chip attach regions spaced apart from one another, a plurality of upper pads disposed in the at least two chip attach regions of the substrate base, an accommodation cavity overlapping a part of each of the at least two chip attach regions and recessed in an upper surface of the substrate base, and at least one spacing groove recessed in the upper surface of the substrate base. The at least one spacing groove is connected to the accommodation cavity, and extends in a region between the at least two chip attach regions.

Abstract: A semiconductor package includes upper and lower semiconductor chip packages, and a redistribution wiring layer pattern interposed between the packages. The lower package includes a molding layer in which at least one chip is embedded, and has a top surface and an inclined sidewall surface along which the redistribution wiring layer pattern is formed. The upper and lower packages are electrically connected to through the redistribution wiring layer pattern. A first package may be formed by a wafer level packaging technique and may include a redistribution wiring layer as a substrate, a semiconductor chip disposed on the redistribution wiring layer, and a molding layer on which the lower package, redistribution wiring layer pattern and upper package are disposed.

Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels.

Abstract: The present invention provides compositions comprising chimeric polypeptides that bind to free ubiquitin proteins or free ubiquitin-like proteins with high affinity, as well as chimeric polypeptides that bind to both free and conjugated ubiquitin proteins or free and conjugated ubiquitin-like proteins, and methods of using the chimeric polypeptides to determine the amount of free or toal ubiquitin or free or total ubiquitin-like proteins in various types of samples.

Abstract: Provided herein is an active joint module, and a robot for inspecting pipelines having the active joint module, the active joint module including a frame unit; a first bracket connected to one side of the frame unit in a rotatable manner, and to which a first module is coupled; a second bracket connected to another side of the frame unit in a rotatable manner, and to which a second module is coupled; and a bracket rotating unit supported to the frame unit, and is configured to rotate the first bracket and second bracket independently from each other in response to receiving an operating signal, and to unconstrain rotation of the first bracket and second bracket in response to there being no operating signal received.

Abstract: Disclosed are an apparatus and system for controlling a data rate in a mobile communication system. The apparatus includes a controller which is configured to update an offset when an error rate of a channel needs to be corrected based on a code rate of a frame, presence/absence of an error through Cyclic Redundancy Check (CRC), and channel state information such as an offset value, and maintain the offset when the code rate of the channel is a maximum value or a minimum value.

Abstract: A crosstalk processing module configured to process a crosstalk of an image signal includes a correction element generation unit, a storage, and a crosstalk correction check unit. The correction element generation unit receives the image signal and input information associated with at least a size of the image signal and generates seed values and correction parameters which are used to correct the crosstalk, based on the input information and a representative channel image signal obtained by separating the image signal with respect to color. The storage stores the seed values and the correction parameters. The crosstalk correction check unit receives the image signal, receives the seed values and the correction parameters from the storage, corrects the crosstalk, and outputs a final image signal and pass/fail information indicating a pass or fail of the correction of the crosstalk based on a plurality of reference values.

Abstract: Provided herein is a robot for inspection of a pipeline using a multi-output differential module, the robot including a robot body configured to move along an inside of the pipeline, and having a driving power supply unit; a proceeding unit rotatably-connected to the robot body, and provided with a plurality of active proceeding units having proceeding wheels that proceed along an inner wall of the pipeline; and a power transmission unit supported against the robot body, connected to the driving power supply unit to transmit driving power to the active proceeding unit, and having the multi-output differential module that distributes the transmitted driving power to the active proceeding unit.

Abstract: The present invention provides compositions comprising chimeric polypeptides that bind to free ubiquitin proteins or free ubiquitin-like proteins with high affinity, as well as chimeric polypeptides that bind to both free and conjugated ubiquitin proteins or free and conjugated ubiquitin-like proteins, and methods of using the chimeric polypeptides to determine the amount of free or total ubiquitin or free or total ubiquitin-like proteins in various types of samples.

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

Abstract: A method of forming patterns for a semiconductor device includes preparing a hardmask composition including a carbon allotrope, a spin-on hardmask (SOH) material, an aromatic ring-containing polymer, and a solvent, applying the hardmask composition to an etching target layer, forming a hardmask by heat-treating the applied hardmask composition, forming a photoresist pattern on the hardmask, forming a hardmask pattern by etching the hardmask using the photoresist pattern as an etching mask, and forming an etched pattern by etching the etching target layer using the hardmask pattern as an etching mask.

Abstract: A method of manufacturing a semiconductor package includes: providing a package substrate having a first surface and a second surface opposite the first surface; providing a first semiconductor chip on the package substrate, the first semiconductor chip having a first surface facing the second surface of the package substrate, a second surface opposite the first surface of the first semiconductor chip, and lateral surfaces extending from the first surface of the first semiconductor chip to the second surface of the first semiconductor chip; providing a molding layer covering the lateral surfaces of the first semiconductor chip and covering the second surface of the package substrate; and providing a plurality of through-molding conductive vias outside the lateral surfaces of the first semiconductor chip. The through-molding conductive vias may be formed before forming the molding layer and may pass through the molding layer.

Abstract: An apparatus and a method are provided for allocating resources, in which a base station allocates a time slot to a terminal in a wireless communication system supporting a time division multiple access scheme. The method includes a monitoring block of monitoring a channel state of the terminal after allocating a time slot for the terminal. The method also includes adjusting, by increasing or reducing, the number of the existing allocated time slots when the channel state of the terminal satisfies a preset time slot adjustment requirement.

Abstract: A manufacturing method of a semiconductor device includes forming a hard mask layer on a semiconductor substrate using a hard mask composition. Hard mask patterns are formed by patterning the hard mask layer. Semiconductor patterns are formed by etching the semiconductor substrate using the hard mask patterns. The hard mask composition includes a plurality of first carbon nanotubes (CNTs) having a first length, a plurality of second CNTs having a second length, which is at least 3 times the first length, and a dispersing agent in which the first CNTs and the second CNTs are dispersed. The total mass of the first CNTs is 1 to 2.5 times the total mass of the second CNTs.

Abstract: A printed circuit board (PCB) includes a substrate base including at least two chip attach regions spaced apart from one another, a plurality of upper pads disposed in the at least two chip attach regions of the substrate base, an accommodation cavity overlapping a part of each of the at least two chip attach regions and recessed in an upper surface of the substrate base, and at least one spacing groove recessed in the upper surface of the substrate base. The at least one spacing groove is connected to the accommodation cavity, and extends in a region between the at least two chip attach regions.

Abstract: A device with a front facing camera having two discrete focus positions is provided. The device comprises: a chassis comprising a front side; a display and a camera each at least partially located on the front side; the camera adjacent the display, the camera facing in a same direction as the display, the camera configured to: acquire video in a video mode; acquire an image in a camera mode; and, discretely step between a first and second focus position, the first position comprising a depth of field (“DOF”) at a hyperfocal distance and the second position comprising a DOF in a range of about 20 cm to about 1 meter; and, a processor configured to: when the camera is in the camera mode, automatically control the camera to the first position; and, when the camera is in the video mode, automatically control the camera to the second position.

Abstract: An apparatus and method reduce power consumption in a broadband wireless communication system. A transmitting end apparatus that includes a plurality of transmit (Tx) antennas includes a control block, a Processor (DSP) block, a modem block, and at least one power controller. The control block determines a traffic amount based on an amount of used resources. The Digital Signal Processor (DSP) block performs scheduling by using a subset of Tx antennas and a subset of resources on a frequency axis if the traffic amount is less than a threshold. The modem block applies boosting to a signal transmitted using the subset of resources. And at least one controller turns off an operation of at least one power amplifier that corresponds to at least one Tx antenna that is not included in the subset of Tx antennas.

Abstract: A camera unit and method of control are described. The camera unit has a camera flash sub-unit configurable to emit flash light having an adjustable characteristic. A camera sensor sub-unit generates raw color data when exposed to light for processing into a digital image. The camera unit also includes a camera controller for coordinating operation of the camera flash sub-unit and the camera sensor sub-unit. The camera controller monitors one or more ambient light characteristics in a vicinity of the camera unit. Prior to receiving a command instructing the camera unit to generate the digital image, the camera controller repeatedly configures the camera flash sub-unit based on the monitored ambient light characteristics to adjust the characteristics of the emitted flash light. Once the camera controller receives the command, the camera sensor sub-unit is instructed to expose an image sensor using the pre-adjusted camera flash light to increase illumination.

Abstract: A device with a front facing camera having two discrete focus positions is provided. The device comprises: a chassis comprising a front side; a display and a camera each at least partially located on the front side; the camera adjacent the display, the camera facing in a same direction as the display, the camera configured to: acquire video in a video mode; acquire an image in a camera mode; and, discretely step between a first and second focus position, the first position comprising a depth of field (“DOF”) at a hyperfocal distance and the second position comprising a DOF in a range of about 20 cm to about 1 metre; and, a processor configured to: when the camera is in the camera mode, automatically control the camera to the first position; and, when the camera is in the video mode, automatically control the camera to the second position.

Abstract: A manufacturing method of a semiconductor device includes forming a hard mask layer on a semiconductor substrate using a hard mask composition. Hard mask patterns are formed by patterning the hard mask layer. Semiconductor patterns are formed by etching the semiconductor substrate using the hard mask patterns. The hard mask composition includes a plurality of first carbon nanotubes (CNTs) having a first length, a plurality of second CNTs having a second length, which is at least 3 times the first length, and a dispersing agent in which the first CNTs and the second CNTs are dispersed. The total mass of the first CNTs is 1 to 2.5 times the total mass of the second CNTs.