Abstract: A semiconductor package includes upper and lower semiconductor chip packages, and a redistribution wiring layer pattern interposed between the packages. The lower package includes a molding layer in which at least one chip is embedded, and has a top surface and an inclined sidewall surface along which the redistribution wiring layer pattern is formed. The upper and lower packages are electrically connected to through the redistribution wiring layer pattern. A first package may be formed by a wafer level packaging technique and may include a redistribution wiring layer as a substrate, a semiconductor chip disposed on the redistribution wiring layer, and a molding layer on which the lower package, redistribution wiring layer pattern and upper package are disposed.

Abstract: A camera unit and method of control are described. The camera unit has a camera flash sub-unit configurable to emit flash light having an adjustable characteristic. A camera sensor sub-unit generates raw color data when exposed to light for processing into a digital image. The camera unit also includes a camera controller for coordinating operation of the camera flash sub-unit and the camera sensor sub-unit. The camera controller monitors one or more ambient light characteristics in a vicinity of the camera unit. Prior to receiving a command instructing the camera unit to generate the digital image, the camera controller repeatedly configures the camera flash sub-unit based on the monitored ambient light characteristics to adjust the characteristics of the emitted flash light. Once the camera controller receives the command, the camera sensor sub-unit is instructed to expose an image sensor using the pre-adjusted camera flash light to increase illumination.

Abstract: A multi-output differential gear apparatus includes a first differential gear having a first output gear and a middle gear, and second differential gear having a second output gear and a third output gear.

Abstract: A device with a front facing camera having two discrete focus positions is provided. The device comprises: a chassis comprising a front side; a display and a camera each at least partially located on the front side; the camera adjacent the display, the camera facing in a same direction as the display, the camera configured to: acquire video in a video mode; acquire an image in a camera mode; and, discretely step between a first and second focus position, the first position comprising a depth of field (“DOF”) at a hyperfocal distance and the second position comprising a DOF in a range of about 20 cm to about 1 meter; and, a processor configured to: when the camera is in the camera mode, automatically control the camera to the first position; and, when the camera is in the video mode, automatically control the camera to the second position.

Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels.

Abstract: A method of manufacturing a semiconductor package includes: providing a package substrate having a first surface and a second surface opposite the first surface; providing a first semiconductor chip on the package substrate, the first semiconductor chip having a first surface facing the second surface of the package substrate, a second surface opposite the first surface of the first semiconductor chip, and lateral surfaces extending from the first surface of the first semiconductor chip to the second surface of the first semiconductor chip; providing a molding layer covering the lateral surfaces of the first semiconductor chip and covering the second surface of the package substrate; and providing a plurality of through-molding conductive vias outside the lateral surfaces of the first semiconductor chip. The through-molding conductive vias may be formed before forming the molding layer and may pass through the molding layer.

Abstract: An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

Abstract: Provided is a stacked semiconductor package which minimizes a limitation on a design of a lower semiconductor chip due to a characteristic of an upper semiconductor chip stacked on the lower chip. The stacked semiconductor package includes a lower chip having a through electrode area in which a plurality of through electrodes are disposed; and at least one upper chip stacked on the lower chip and having a pad area in which a plurality of pads corresponding to the plurality of through electrodes are disposed. The pad area is disposed along a central axis bisecting an active surface of the upper chip. The central axis where the pad area of the upper chip is disposed is placed at a position which is shifted from a central axis in a longitudinal direction of an active surface of the lower chip.

Abstract: Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.

Abstract: Methods and electronic devices for producing a zoomed image using a narrow field of view monochrome camera are described. In one aspect, the method includes: receiving a color image that is captured by a color camera; receiving an achromatic image that is captured by a monochrome camera with the monochrome camera having a narrower field of view than the color camera; and merging the color image and the achromatic image to produce an enhanced image.

Abstract: A brake mechanism of a robot using a multi-output differential gear, capable of selectively blocking or applying driving force as needed, the brake mechanism including, a differential gear unit receiving driving force and generating at least three outputs differentiated from the driving force while being linked with the driving force, a driving unit transferring the driving force to the differential gear unit and moving in a direction away from or approaching the differential gear unit to thereby be detachably provided in the differential gear unit, and a rescuing unit controlling a spaced distance between the driving unit and the differential gear unit to attach and detach the driving unit to and from the differential gear unit.

Abstract: A device with a front facing camera having two discrete focus positions is provided. The device comprises: a chassis comprising a front side; a display and a camera each at least partially located on the front side; the camera adjacent the display, the camera facing in a same direction as the display, the camera configured to: acquire video in a video mode; acquire an image in a camera mode; and, discretely step between a first and second focus position, the first position comprising a depth of field (“DOF”) at a hyperfocal distance and the second position comprising a DOF in a range of about 20 cm to about 1 metre; and, a processor configured to: when the camera is in the camera mode, automatically control the camera to the first position; and, when the camera is in the video mode, automatically control the camera to the second position.

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

Abstract: Provided herein is a robot for inspection of a pipeline using a multi-output differential module, the robot including a robot body configured to move along an inside of the pipeline, and having a driving power supply unit; a proceeding unit rotatably-connected to the robot body, and provided with a plurality of active proceeding units having proceeding wheels that proceed along an inner wall of the pipeline; and a power transmission unit supported against the robot body, connected to the driving power supply unit to transmit driving power to the active proceeding unit, and having the multi-output differential module that distributes the transmitted driving power to the active proceeding unit.

Abstract: A liquid crystal display apparatus includes a display panel, a light source module configured to provide light to the display panel, a receiving container receiving the light source module therein, and an adhesion member disposed between the display panel and the receiving container to couple the display panel to the receiving container. The adhesion member includes a base layer with a hollow pocket therein and an adhesion layer disposed on both surface of the base layer. When the display panel is deformed, the adhesion member conforms thereto. Thus, light-leakage of the display panel may be prevented and light characteristics of the liquid crystal display apparatus may be improved.

Abstract: Provided herein is an active joint module, and a robot for inspecting pipelines having the active joint module, the active joint module including a frame unit; a first bracket connected to one side of the frame unit in a rotatable manner, and to which a first module is coupled; a second bracket connected to another side of the frame unit in a rotatable manner, and to which a second module is coupled; and a bracket rotating unit supported to the frame unit, and is configured to rotate the first bracket and second bracket independently from each other in response to receiving an operating signal, and to unconstrain rotation of the first bracket and second bracket in response to there being no operating signal received.

Abstract: A method for mitigating inter-cell interference by a base station in a cellular communication system. The base station determines cells to which same frequency resources are allocated, and which cause interference to each other, and determines a starting time slot, at which resource allocation to each cell starts, as a different time slot for each cell, taking into account a number of the cells and time slots constituting time resources. In response to receiving a call setup request from a terminal, the base station selects a time slot taking into account interference information of each of the time slots, and allocates a resource based on the selected time slot to the terminal.

Abstract: Disclosed are methods and systems of adapting an optical image stabilizer (OIS) for a camera, the methods comprising acquiring an image of the scene; obtaining image context associated with the image of the scene; selecting a mode of operating the OIS based on the obtained image context; and, applying the OIS using the selected mode of operation.

Abstract: A liquid crystal display apparatus includes a display panel, a light source module configured to provide light to the display panel, a receiving container receiving the light source module therein, and an adhesion member disposed between the display panel and the receiving container to couple the display panel to the receiving container. The adhesion member includes a base layer with a hollow pocket therein and an adhesion layer disposed on both surface of the base layer. When the display panel is deformed, the adhesion member conforms thereto. Thus, light-leakage of the display panel may be prevented and light characteristics of the liquid crystal display apparatus may be improved.

Abstract: A semiconductor package having a first semiconductor device including an active surface and a non-active surface opposite to the active surface, and a second semiconductor device having an active surface facing the active surface of the first semiconductor device is provided. Connection terminals are provided on the active surface of the second semiconductor device and first through vias are provided in the first semiconductor device. External terminals providing electrical connection with an external device are provided. The connection terminals comprise center terminals overlapping with the active surface of the first semiconductor device and outer terminals around the center terminals. The center terminals are electrically connected to the external terminals through the first through via.