Patents by Inventor Yun Wei

Yun Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12686423
    Abstract: The present invention relates to a subway vehicle electronic record system based on blockchain technology, which mainly includes business view module, record information maintenance module, statistical analysis module, record information management module, system management module, and blockchain foundation platform. The invention comprehensively makes use of blockchain, database and other technologies to normalize heterogeneous data of subway vehicle record.
    Type: Grant
    Filed: September 8, 2023
    Date of Patent: July 21, 2026
    Assignee: Beijing Subway Operation Co., Ltd. Technology Innovation Research Institute Branch
    Inventors: Ming Li, Jiao Zhang, Yun Wei, Hongtao Zhu, Tingrui Cui, Minghui Ding, Fan Yang, Yu Zhang, Liyuan Zhao, Hao Guo
  • Patent number: 12655901
    Abstract: A vehicle having a powertrain and a power battery is provided. The powertrain includes an engine, a power generator, a driving motor, and a transmission. The power generator is connected to the engine in a transmission manner. The transmission includes a housing and a one-way oil channel. An isolation board is arranged in the housing, a driving cavity is provided on a side of the isolation board, and a power generation cavity is provided on the other side of the isolation board. The one-way oil channel is located at a top of the driving cavity and the power generation cavity, and the one-way oil channel is configured to guide oil from the driving cavity to the power generation cavity in a unidirectional manner.
    Type: Grant
    Filed: July 3, 2024
    Date of Patent: June 16, 2026
    Assignee: BYD COMPANY LIMITED
    Inventors: Jianwen Li, Yankai Zhang, Xuean Fei, Yun Wei
  • Publication number: 20260088770
    Abstract: A Doherty power amplifier includes a combining node that combines amplified output signals from first and second amplifiers. A reconfigurable impedance inverter circuit is coupled between the first amplifier and the combining node. The impedance inverter circuit includes an inductive element coupled between a first node and a second node, and a switching circuit coupled between the first node and the second node. A fundamental frequency tuning circuit and a harmonic frequency resonance circuit are coupled between the switching circuit and a ground reference node. When the switching circuit is configured in a first state, the fundamental frequency tuning circuit and the harmonic frequency resonance circuit are electrically coupled through the switching circuit to the first and second nodes. When the switching circuit is configured in a second state, the fundamental frequency tuning circuit and the harmonic frequency resonance circuit are electrically disconnected from the first and second nodes.
    Type: Application
    Filed: September 25, 2024
    Publication date: March 26, 2026
    Inventors: Yun Wei, Lu Wang
  • Publication number: 20250338459
    Abstract: In one aspect, a computing device-implemented method includes receiving at least one triggering event signal from one or more components of a heat recovery system. The method also includes determining, based in part on the at least one triggering event signal, a computation workload assignment to be executed on one or more computation devices. The method further includes sending one or more command signals to the one or more computation devices. The one or more command signals include a portion of the computation workload assignment for execution by the one or more computation devices. The method also includes initiating capture of heat energy to be stored in one or more heat reservoirs, the heat energy being generated by the one or more computation device based upon the computation workload assignment.
    Type: Application
    Filed: May 14, 2025
    Publication date: October 30, 2025
    Inventors: Lawrence Orsini, Yun Wei
  • Publication number: 20250173684
    Abstract: Embodiments of this specification provide a system and method for assisting intelligent maintenance for a subway vehicle, a device and a medium.
    Type: Application
    Filed: February 8, 2024
    Publication date: May 29, 2025
    Applicant: BEIJING METRO OPERATION CO., LTD. TECHNOLOGY INNOVATION RESEARCH INSTITUTE BRANCH
    Inventors: Yun WEI, Tingrui CUI, Ming LI, Hongtao ZHU, Minghui DING, Jiao ZHANG, Zhichao ZANG
  • Publication number: 20250095081
    Abstract: A system for the cryptographically-secure, autonomous control of devices comprising, connected to or remotely operating devices in an electrically powered network and the transaction of the benefits, costs or value created by or transacted through the devices in this electrically powered network.
    Type: Application
    Filed: December 5, 2024
    Publication date: March 20, 2025
    Inventors: Lawrence Orsini, Yun Wei, Joseph Lubin
  • Publication number: 20250083722
    Abstract: The present invention relates to a subway vehicle electronic record system based on blockchain technology, which mainly includes business view module, record information maintenance module, statistical analysis module, record information management module, system management module, and blockchain foundation platform. The invention comprehensively makes use of blockchain, database and other technologies to normalize heterogeneous data of subway vehicle record.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 13, 2025
    Inventors: Ming Li, Jiao Zhang, Yun Wei, Hongtao Zhu, Tingrui Cui, Minghui Ding, Fan Yang, Yu Zhang, Liyuan Zhao, Hao Guo
  • Publication number: 20250003569
    Abstract: A through lamp for a vehicle includes an exterior trim panel provided with a light-transmitting area; a mounting bracket arranged on an inner surface of the exterior trim panel, a lamp chamber being defined between the mounting bracket and the inner surface of the exterior trim panel; and a light-emitting assembly arranged in the lamp chamber. Light emitted by the light-emitting assembly is emitted outwards through the light-emitting area.
    Type: Application
    Filed: November 7, 2022
    Publication date: January 2, 2025
    Inventors: Yun WEI, Ge HAO, Yu LI
  • Publication number: 20240352999
    Abstract: A vehicle having a powertrain and a power battery is provided. The powertrain includes an engine, a power generator, a driving motor, and a transmission. The power generator is connected to the engine in a transmission manner. The transmission includes a housing and a one-way oil channel. An isolation board is arranged in the housing, a driving cavity is provided on a side of the isolation board, and a power generation cavity is provided on the other side of the isolation board. The one-way oil channel is located at a top of the driving cavity and the power generation cavity, and the one-way oil channel is configured to guide oil from the driving cavity to the power generation cavity in a unidirectional manner.
    Type: Application
    Filed: July 3, 2024
    Publication date: October 24, 2024
    Inventors: Jianwen LI, Yankai ZHANG, Xuean FEI, Yun WEI
  • Patent number: 11984429
    Abstract: Leadless power amplifier (PA) packages having topside termination interposer (TTI) arrangements, and associated fabrication methods, are disclosed. Embodiments of the leadless PA package include a base flange, a first set of interposer mount pads, a first RF power die, a package body. The first RF power die is attached to a die mount surface of the base flange and electrically interconnected with the first set of interposer mount pads. The TTI arrangement is electrically coupled to the first set of interposer mount pads and projects therefrom in the package height direction. The package body encloses the first RF power die and having a package topside surface opposite the lower flange surface. Topside input/output terminals of the PA package are accessible from the package topside surface and are electrically interconnected with the first RF power die through the TTI arrangement and the first set of interposer mount pads.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: May 14, 2024
    Assignee: NXP USA, Inc.
    Inventors: Yun Wei, Scott Duncan Marshall, Lakshminarayan Viswanathan, Taek Kyu Kim, Ricardo Uscola, Fernando A. Santos
  • Publication number: 20240144385
    Abstract: A system for the cryptographically-secure, autonomous control of devices comprising, connected to or remotely operating devices in an electrically powered network and the transaction of the benefits, costs or value created by or transacted through the devices in this electrically powered network.
    Type: Application
    Filed: May 25, 2023
    Publication date: May 2, 2024
    Inventors: Lawrence Orsini, Yun Wei, Joseph Lubin
  • Publication number: 20240090179
    Abstract: In one aspect, a computing device-implemented method includes receiving at least one triggering event signal from one or more components of a heat recovery system. The method also includes determining, based in part on the at least one triggering event signal, a computation workload assignment to be executed on one or more computation devices. The method further includes sending one or more command signals to the one or more computation devices. The one or more command signals include a portion of the computation workload assignment for execution by the one or more computation devices. The method also includes initiating capture of heat energy to be stored in one or more heat reservoirs, the heat energy being generated by the one or more computation device based upon the computation workload assignment.
    Type: Application
    Filed: April 3, 2023
    Publication date: March 14, 2024
    Inventors: Lawrence Orsini, Yun Wei
  • Patent number: 11684687
    Abstract: An automatic floor-disinfection robot for floors of hospital rooms, including a moving device, a alarm and a disinfection device. The moving device is a disc-shaped robot, and includes a chassis moving mechanism, a support plate and a top plate arranged successively from bottom to top. The disinfection device includes a disinfection assembly and a baffle. The disinfection assembly includes a liquid supply mechanism, a liquid spray mechanism and a fan.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: June 27, 2023
    Assignees: SOUTHWEST JIAOTONG UNIVERSITY, LAOKEN MEDICAL TECHNOLOGY CO., LTD.
    Inventors: Xianghui Chang, Bowen Ma, Qijun Liu, Xia Liu, Yan Yan, Weidong Qiu, Xihao Jin, Xiang Li, Miao Zhang, Yun Wei
  • Publication number: 20230115340
    Abstract: Leadless power amplifier (PA) packages having topside termination interposer (TTI) arrangements, and associated fabrication methods, are disclosed. Embodiments of the leadless PA package include a base flange, a first set of interposer mount pads, a first RF power die, a package body. The first RF power die is attached to a die mount surface of the base flange and electrically interconnected with the first set of interposer mount pads. The TTI arrangement is electrically coupled to the first set of interposer mount pads and projects therefrom in the package height direction. The package body encloses the first RF power die and having a package topside surface opposite the lower flange surface. Topside input/output terminals of the PA package are accessible from the package topside surface and are electrically interconnected with the first RF power die through the TTI arrangement and the first set of interposer mount pads.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 13, 2023
    Inventors: Yun Wei, Scott Duncan Marshall, Lakshminarayan Viswanathan, Taek Kyu Kim, Ricardo Uscola, Fernando A. Santos
  • Publication number: 20230111199
    Abstract: An automatic floor-disinfection robot for floors of hospital rooms, including a moving device, a alarm and a disinfection device. The moving device is a disc-shaped robot, and includes a chassis moving mechanism, a support plate and a top plate arranged successively from bottom to top. The disinfection device includes a disinfection assembly and a baffle. The disinfection assembly includes a liquid supply mechanism, a liquid spray mechanism and a fan.
    Type: Application
    Filed: December 8, 2022
    Publication date: April 13, 2023
    Inventors: Xianghui CHANG, Bowen MA, Qijun LIU, Xia LIU, Yan YAN, Weidong QIU, Xihao JIN, Xiang LI, Miao ZHANG, Yun WEI
  • Patent number: 11621231
    Abstract: Leadless power amplifier (PA) packages and methods for fabricating leadless PA packages having topside terminations are disclosed. In embodiments, the method includes providing electrically-conductive pillar supports and a base flange. At least a first radio frequency (RF) power die is attached to a die mount surface of the base flange and electrically interconnected with the pillar supports. Pillar contacts are further provided, with the pillar contacts electrically coupled to the pillar supports and projecting therefrom in a package height direction. The first RF power die is enclosed in a package body, which at least partially defines a package topside surface opposite a lower surface of the base flange. Topside input/out terminals are formed, which are accessible from the package topside surface and which are electrically interconnected with the first RF power die through the pillar contacts and the pillar supports.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: April 4, 2023
    Assignee: NXP USA, Inc.
    Inventors: Yun Wei, Fernando A. Santos, Lakshminarayan Viswanathan, Scott Duncan Marshall
  • Publication number: 20220369521
    Abstract: In one aspect, a computing device-implemented method includes receiving at least one triggering event signal from one or more components of a heat recovery system. The method also includes determining, based in part on the at least one triggering event signal, a computation workload assignment to be executed on one or more computation devices. The method further includes sending one or more command signals to the one or more computation devices. The one or more command signals include a portion of the computation workload assignment for execution by the one or more computation devices. The method also includes initiating capture of heat energy to be stored in one or more heat reservoirs, the heat energy being generated by the one or more computation device based upon the computation workload assignment.
    Type: Application
    Filed: May 26, 2022
    Publication date: November 17, 2022
    Inventors: Lawrence Orsini, Yun Wei
  • Patent number: 11468518
    Abstract: A system for the cryptographically-secure, autonomous control of devices comprising, connected to or remotely operating devices in an electrically powered network and the transaction of the benefits, costs or value created by or transacted through the devices in this electrically powered network.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: October 11, 2022
    Assignee: TransActive Grid Inc.
    Inventors: Lawrence Orsini, Yun Wei, Joseph Lubin
  • Publication number: 20220238450
    Abstract: Leadless power amplifier (PA) packages and methods for fabricating leadless PA packages having topside terminations are disclosed. In embodiments, the method includes providing electrically-conductive pillar supports and a base flange. At least a first radio frequency (RF) power die is attached to a die mount surface of the base flange and electrically interconnected with the pillar supports. Pillar contacts are further provided, with the pillar contacts electrically coupled to the pillar supports and projecting therefrom in a package height direction. The first RF power die is enclosed in a package body, which at least partially defines a package topside surface opposite a lower surface of the base flange. Topside input/out terminals are formed, which are accessible from the package topside surface and which are electrically interconnected with the first RF power die through the pillar contacts and the pillar supports.
    Type: Application
    Filed: April 15, 2022
    Publication date: July 28, 2022
    Inventors: Yun Wei, Fernando A. Santos, Lakshminarayan Viswanathan, Scott Duncan Marshall
  • Patent number: 11349438
    Abstract: Power amplifier (PA) packages, such as Doherty PA packages, containing multi-path integrated passive devices (IPDs) are disclosed. In embodiments, the PA package includes a package body through which first and second signal amplification paths extend, a first amplifier die within the package body and positioned in the first signal amplification path, and a second amplifier die within the package body and positioned in the second signal amplification path. A multi-path IPD is further contained in the package body. The multi-path IPD includes a first IPD region through which the first signal amplification path extends, a second IPD region through which the second signal amplification path extends, and an isolation region formed in the IPD substrate a location intermediate the first IPD region and the second IPD region.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: May 31, 2022
    Assignee: NXP USA, Inc.
    Inventors: Yun Wei, Ricardo Uscola, Monte G. Miller