Patents by Inventor Yung-Chang Chen

Yung-Chang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8941720
    Abstract: A method of enhancing 3D image information density, comprising providing a confocal fluorescent microscope and a rotational stage. 3D image samples at different angles are collected. A deconvolution process of the 3D image samples by a processing unit is performed. A registration process of the deconvoluted 3D image samples by the processing unit is performed. An interpolation process of the registered 3D image samples by the processing unit is performed to output a 3D image in high resolution.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: January 27, 2015
    Assignee: National Tsing Hua University
    Inventors: Ann-Shyn Chiang, Hsiu-Ming Chang, Yung-Chang Chen, Kuan-Yu Chen
  • Patent number: 8908915
    Abstract: The present invention is directed to methods and devices for tracking moving characteristics of at least two moving objects. The present invention identifies an occlusive condition(s) of the moving objects on a video frame(s), analyzes information of a physical framework(s) of the moving objects, finds and records a position(s) of the occluded moving object(s) on the video frames and tracks a moving character(s) of the moving objects. The present invention further provides devices and methods for tracking the moving characteristics of behaviors of living bodies.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: December 9, 2014
    Assignee: National Tsing Hua University
    Inventors: Yung-Jen Chuang, Yung-Chang Chen, Shih-Yin Huang
  • Patent number: 8889440
    Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: November 18, 2014
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Yung-Chang Chen, Hsin-Hsien Wu, Ming Shing Lee, Huai-En Lai, Fu-Wen Liu, Andy Wu
  • Publication number: 20140252380
    Abstract: A shadow mask assembly includes a securing assembly configured to hold a substrate that is configured to hold a plurality of dies. The securing assembly includes a number of guide pins and a shadow mask comprising holes for the guide pins, said holes allowing the guide pins freedom of motion in one direction. The securing assembly includes a number of embedded magnets configured to secure the shadow mask to the securing assembly.
    Type: Application
    Filed: March 10, 2013
    Publication date: September 11, 2014
    Applicant: TSMC Solid State Lighting Ltd.
    Inventors: Ming-Shing Lee, Chyi-Shyuan Chern, Hsin-Hsien Wu, Yung-Chang Chen, Ming-Hua Lo, Chu-Ching Tsai
  • Publication number: 20140215024
    Abstract: A method and system for multimedia broadcasting including dynamically modifying the digital broadcast stream by injecting additional digital content into the digital broadcast stream is disclosed.
    Type: Application
    Filed: January 27, 2014
    Publication date: July 31, 2014
    Applicant: LIVE365, INC.
    Inventors: Kevin LIAO, Joe Y. FONG, Yung-Chang Chen, Lex CHIANG
  • Publication number: 20140093990
    Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
    Type: Application
    Filed: December 11, 2013
    Publication date: April 3, 2014
    Applicant: TSMC Solid State Lighting Ltd.
    Inventors: Yung-Chang Chen, Hsin-Hsien Wu, Ming Shing Lee, Huai-En Lai, Fu-Wen Liu, Andy Wu
  • Patent number: 8665276
    Abstract: The present invention discloses an image processing method for feature retention associated with averaging processes. The image processing method comprises: scaling and aligning a plurality of image data for acquiring feature information; determining a plurality of two-dimensional feature label points according to the feature information for generating at least one Bezier curve; utilizing the at least one Bezier curve to generate at least one Bezier tube and performing Bezier tube fitting for generating result of Bezier tube fitting; deforming the plurality of image data according to the Bezier tube or the result of Bezier tube fitting for generating a plurality of deformed image data; and averaging the plurality of deformed image data for generating feature-preserved average image data. The present invention also provides an image processing system, a computer readable storage medium, and a computer program product, for implementing the image processing method.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: March 4, 2014
    Assignee: National Tsing Hua University
    Inventors: Ann-Shyn Chiang, Hsiu-Ming Chang, Yung-Chang Chen, Kuan-Yu Chen
  • Patent number: 8610161
    Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: December 17, 2013
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Yung-Chang Chen, Hsin-Hsien Wu, Ming Shing Lee, Huai-En Lai, Fu-Wen Liu, Andy Wu
  • Patent number: 8520933
    Abstract: The present invention relates to methods for searching and constructing a 3D motif image database, wherein said 3D motif image database can be used to understand the connection relationship of a 3D network, e.g. a neural network comprising biological neural networks or artificial neural networks. The searching and constructing methods are applied on the 3D motif image database, a proper computer-aided graphic platform. The database not only facilitates the management of the huge amount of categorized data but also rationally excavates the hidden information cloaked within.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: August 27, 2013
    Assignees: National Tsing Hua University, National Applied Research Laboratory
    Inventors: Sheng-Chuan Wang, Ann-Shyn Chiang, Ping-Chang Lee, Ching-Yao Lin, Yu-Tai Ching, Chao-Jun Zhuang, Hsiu-Ming Chang, Yung-Chang Chen, Kuen-Long Tsai, Chang-Huain Hsieh
  • Publication number: 20130208943
    Abstract: The present invention is directed to methods and devices for tracking moving characters of at least two moving objects. The present invention identifies an occlusive condition(s) of the moving objects on a video frame(s), analyzes information of a physical framework(s) of the moving objects, finds and records a position(s) of the occluded moving object(s) on the video frames and tracks a moving character(s) of the moving objects. The present invention further provides devices and methods for tracking the moving characters of behaviors of living bodies.
    Type: Application
    Filed: February 13, 2012
    Publication date: August 15, 2013
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Yung-Jen Chuang, Yung-Chang Chen, Shih-Yin Huang
  • Patent number: 8509565
    Abstract: The disclosure concerns a method for optimizing multiresolution blending of confocal microscope images including the steps of: the multi-band blender proceeding pyramidal correlations; the multi-band blender collecting numerical information from each row of a Laplacian image; the multi-band blender integrating the numerical information from a Laplacian domain of pyramid representation; the multi-band blender measuring the discrepancy between adjacent rows; and the multi-band blender optimizing the overlapped region by estimating the best blending coefficients.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: August 13, 2013
    Assignee: National Tsing Hua University
    Inventor: Yung-Chang Chen
  • Publication number: 20130187635
    Abstract: The invention discloses an electrical sensor for a two-wire power cable. The sensor includes: a flexible substrate joined onto the power cable or the protective jacket thereon; an inductive coil formed on the flexible substrate; a pair of metal electrodes formed on the flexible substrate and at the opposite sides of the power cable, respectively; and a readout circuit formed on the flexible substrate, electrically connected to the inductive coil so as to measure the current in the power cable, and electrically connected to the metal electrodes so as to measure the voltage in the power cable.
    Type: Application
    Filed: September 14, 2012
    Publication date: July 25, 2013
    Applicant: Industrial Technology Research Institute
    Inventors: SHIH-HSIEN CHENG, Ming-Jhe Du, Lien-Yi Cho, Yu-Ting Cheng, Yung-Chang Chen
  • Patent number: 8349628
    Abstract: An embodiment of the disclosure includes a method of fabricating a plurality of light emitting diode devices. A plurality of LED dies is provided. The LED dies are bonded to a carrier substrate. A patterned mask layer comprising a plurality of openings is formed on the carrier substrate. Each one of the plurality of LED dies is exposed through one of the plurality of the openings respectively. Each of the plurality of openings is filled with a phosphor. The phosphor is cured. The phosphor and the patterned mask layer are polished to thin the phosphor covering each of the plurality of LED dies. The patterned mask layer is removed after polishing the phosphor.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: January 8, 2013
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Yung-Chang Chen, Hsin-Hsien Wu, Chyi Shyuan Chern, Ching-Wen Hsiao, Fu-Wen Liu, Kuang-Huan Hsu
  • Publication number: 20120305956
    Abstract: The present disclosure provides a method of patterning a phosphor layer on a light emitting diode (LED) emitter. The method includes providing at least one LED emitter disposed on a substrate; forming a polymer layer over the at least one LED emitter; providing a mask over the polymer layer and the at least one LED emitter; etching the polymer layer through the mask to expose the at least one LED emitter within a cavity having polymer layer walls; and coating the at least one LED emitter with phosphor.
    Type: Application
    Filed: June 1, 2011
    Publication date: December 6, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fu-Wen Liu, Chyi Shyuan Chern, Hsin-Hsien Wu, Yung-Chang Chen, Ming Shing Lee, Tzu-Wen Shih, Hsin-Hung Chen
  • Patent number: 8315809
    Abstract: A method of generating standard brain model from a bio-expression system includes performing steps of registration to input standard surface and individual surface into affine registration; recording a transformation parameters from the affine registration; performing steps of inputting a individual neuropil and transform parameters into an affine transformation; applying the data of the affine transformation to transform individual neuropil to achieve transformed individual neuropil; and performing a step of affine registration to register a standard neuropil to the transformed individual neuropil to achieve a resulting transformation, wherein the resulting transformation can be output as a position and orientation of standard neuropil within the standard surface.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: November 20, 2012
    Assignee: National Tsing Hua University
    Inventors: Ann-Shyn Chiang, Yung-Chang Chen, Hsiu-Ming Chang
  • Publication number: 20120244652
    Abstract: An embodiment of the disclosure includes a method of fabricating a plurality of light emitting diode devices. A plurality of LED dies is provided. The LED dies are bonded to a carrier substrate. A patterned mask layer comprising a plurality of openings is formed on the carrier substrate. Each one of the plurality of LED dies is exposed through one of the plurality of the openings respectively. Each of the plurality of openings is filled with a phosphor. The phosphor is cured. The phosphor and the patterned mask layer are polished to thin the phosphor covering each of the plurality of LED dies. The patterned mask layer is removed after polishing the phosphor.
    Type: Application
    Filed: March 22, 2011
    Publication date: September 27, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Chang CHEN, Hsin-Hsien WU, Chyi Shyuan CHERN, Ching-Wen HSIAO, Fu-Wen LIU, Kuang-Huan HSU
  • Publication number: 20120237137
    Abstract: The disclosure concerns a method for optimizing multiresolution blending of confocal microscope images including the steps of: the multi-band blender proceeding pyramidal correlations; the multi-band blender collecting numerical information from each row of a Laplacian image; the multi-band blender integrating the numerical information from a Laplacian domain of pyramid representation; the multi-band blender measuring the discrepancy between adjacent rows; and the multi-band blender optimizing the overlapped region by estimating the best blending coefficients.
    Type: Application
    Filed: May 18, 2012
    Publication date: September 20, 2012
    Applicant: NATIONAL TSING HUA UNIVERSITY (TAIWAN)
    Inventor: Yung-Chang Chen
  • Publication number: 20120194646
    Abstract: A method of enhancing 3D image information density, comprising providing a confocal fluorescent microscope and a rotational stage. 3D image samples at different angles are collected. A deconvolution process of the 3D image samples by a processing unit is performed. A registration process of the deconvoluted 3D image samples by the processing unit is performed. An interpolation process of the registered 3D image samples by the processing unit is performed to output a 3D image in high resolution.
    Type: Application
    Filed: February 2, 2011
    Publication date: August 2, 2012
    Applicant: National Tsing Hua University
    Inventors: Ann-Shyn Chiang, Hsiu-Ming Chang, Yung-Chang Chen, Kuan-Yu Chen
  • Publication number: 20120104450
    Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
    Type: Application
    Filed: October 5, 2011
    Publication date: May 3, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Chang CHEN, Hsin-Hsien WU, Ming Shing LEE, Huai-En LAI, Fu-Wen LIU, Andy WU
  • Publication number: 20120098006
    Abstract: Optical emitters are fabricated by forming and shaping photoresist reflectors on a package wafer using lithography processes, and bonding Light-Emitting Diode (LED) dies to the package wafer.
    Type: Application
    Filed: July 7, 2011
    Publication date: April 26, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Chang CHEN, Hsin-Hsien WU, Fu-Wen LIU, Hao-Wei KU, Hsin-Hung CHEN