Patents by Inventor Yung-Chieh Chen
Yung-Chieh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973261Abstract: An antenna structure with wide radiation bandwidth in a reduced physical space includes a metallic housing, a first feed portion, and a second feed portion. The metallic housing includes a metallic side frame and a metallic back board. The metallic side frame defines a slot, and first and second gaps. The metallic side frame between the first gap and one end of the slot forms a first radiation portion. The second gap divides the first radiation portion into first and second radiation sections. The first feed portion feeds current and signal to the first radiation section, and the first radiation section works in a GPS mode and a WIFI 2.4 GHz mode. The second feed portion feeds current and signal to the second radiation section, and the second radiation section works in a WIFI 5 GHz mode.Type: GrantFiled: January 15, 2021Date of Patent: April 30, 2024Assignee: Chiun Mai Communication Systems, Inc.Inventors: Kun-Lin Sung, Yung-Chin Chen, Yi-Chieh Lee
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Publication number: 20240126327Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
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Patent number: 11955312Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.Type: GrantFiled: December 23, 2021Date of Patent: April 9, 2024Assignee: MATERIALS ANALYSIS TECHNOLOGY INC.Inventors: Chien-Wei Wu, Keng-Chieh Chu, Yung-Sheng Fang, Chun-Wei Wu, Hung-Jen Chen
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Patent number: 10475974Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.Type: GrantFiled: January 2, 2018Date of Patent: November 12, 2019Assignee: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan Hsieh, Yung Chieh Chen
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Publication number: 20190027665Abstract: A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective plating layer and an external protective plating layer. The protective plating layer may be coated on the top surface, bottom surface and a portion of the side surface of the electrode. The external portative plating layer would be coated on the outer surface of the wing region. The light reflection of the device from top surface of the electrode portion can be maintained and the outer side surface of wing portion can be protected for improving the reliability of connection between light emitting device and outer substrate.Type: ApplicationFiled: March 27, 2017Publication date: January 24, 2019Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan HSIEH, Yung Chieh CHEN
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Patent number: 10177292Abstract: A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective plating layer and an external protective plating layer. The protective plating layer may be coated on the top surface, bottom surface and a portion of the side surface of the electrode. The external portative plating layer would be coated on the outer surface of the wing region. The light reflection of the device from top surface of the electrode portion can be maintained and the outer side surface of wing portion can be protected for improving the reliability of connection between light emitting device and outer substrate.Type: GrantFiled: March 27, 2017Date of Patent: January 8, 2019Assignee: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan Hsieh, Yung Chieh Chen
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Publication number: 20180351061Abstract: The present invention provides a carrier, including: at least one electrode portion, each electrode portion having an electrode portion cross section; and a housing having a housing cross section, the housing covering at least a part of the at least one electrode portion, where the housing cross section or the electrode portion cross section may include at least a curved surface; a reflective concave cup for exposing a part of the electrode portion, the reflective concave cup has, on its outer side wall, at least a plastic block protruding outward and matching a material feeding hole of a fabrication mold for fabricating the reflective concave cup, and thus the production yield and quality of the reflective concave cup are improved.Type: ApplicationFiled: July 18, 2018Publication date: December 6, 2018Applicant: Everlight Electronics Co., Ltd.Inventors: Chien-Nan Liu, Yung-Chieh Chen, Chung-Chuan Hsieh
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Publication number: 20180287017Abstract: The present invention is directed to a light emitting device that includes an elongated package defining a plurality of recesses and a plurality of light emitting units to be disposed in the recesses. The package includes at least three electrodes and a molded body. At least one light emitting unit is disposed in each recess. The molded body has at least one dividing portion separating two adjacent recesses. The dividing portion partially covers the electrode shared by the light emitting diodes respectively disposed in two adjacent recesses.Type: ApplicationFiled: March 30, 2018Publication date: October 4, 2018Applicant: Everlight Electronics Co., Ltd.Inventors: Chien-Nan Liu, Chun-Ming Lai, Yan-Shen Lin, Kuang-Mao Lu, Ya-Chin Tu, Yung-Chieh Chen
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Publication number: 20180123012Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.Type: ApplicationFiled: January 2, 2018Publication date: May 3, 2018Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan Hsieh, Yung Chieh Chen
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Patent number: 9905742Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.Type: GrantFiled: February 24, 2017Date of Patent: February 27, 2018Assignee: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan Hsieh, Yung Chieh Chen
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Publication number: 20170229625Abstract: A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective plating layer and an external protective plating layer. The protective plating layer may be coated on the top surface, bottom surface and a portion of the side surface of the electrode. The external portative plating layer would be coated on the outer surface of the wing region. The light reflection of the device from top surface of the electrode portion can be maintained and the outer side surface of wing portion can be protected for improving the reliability of connection between light emitting device and outer substrate.Type: ApplicationFiled: March 27, 2017Publication date: August 10, 2017Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan HSIEH, Yung Chieh CHEN
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Patent number: 9691960Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.Type: GrantFiled: February 24, 2017Date of Patent: June 27, 2017Assignee: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan Hsieh, Yung Chieh Chen
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Publication number: 20170170376Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.Type: ApplicationFiled: February 24, 2017Publication date: June 15, 2017Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan HSIEH, Yung Chieh CHEN
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Publication number: 20170162771Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.Type: ApplicationFiled: February 24, 2017Publication date: June 8, 2017Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chung-Chuan HSIEH, Yung Chieh CHEN
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Patent number: 9640733Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.Type: GrantFiled: May 22, 2015Date of Patent: May 2, 2017Assignee: Everlight Electronics Co., Ltd.Inventors: Chung-Chuan Hsieh, Yung Chieh Chen
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Patent number: 9391251Abstract: Various examples of a carrier structure and lighting device are described. A carrier structure configured to carry an LED includes a housing and a lead frame. The housing defines a concavity. The lead frame includes a main board portion having a main board through hole, at least two insertion portions extending from the main board portion into the main board through hole, and two electrode portions configured to be electrically coupled to the LED. The housing is disposed over the at least two insertion portions with the at least two insertion portions inserted into the housing. The concavity of the housing expose the electrode portions. Each of the electrode portions has a respective protrusion sub-portion that extends outside of the housing. Additionally, a lighting device utilizing the carrier structure is also provided.Type: GrantFiled: May 9, 2014Date of Patent: July 12, 2016Assignee: Everlight Electronics Co., Ltd.Inventors: Yung Chieh Chen, Jung Chiuan Lin
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Publication number: 20150340568Abstract: A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.Type: ApplicationFiled: May 22, 2015Publication date: November 26, 2015Inventors: Chung-Chuan Hsieh, Yung Chieh Chen
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Patent number: 9158346Abstract: A main board, comprising a first set of memory slots, the first set of memory slots comprising a first channel and a second channel disposed in parallel with each other, and each of the first channel and the second channel comprising a first type of slot and a second type of slot respectively, wherein the first type of slot and the second type of slot of the first channel are disposed at a first side and a second side of the first channel respectively, the first type of slot and the second type of slot of the second channel are disposed at a first side and a second side of the second channel respectively, and the first side of the first channel is adjacent to the first side of the second channel.Type: GrantFiled: May 21, 2013Date of Patent: October 13, 2015Assignee: Celestica Technology Consultancy (Shanghai) Co., Ltd.Inventor: Yung-Chieh Chen
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Patent number: D869408Type: GrantFiled: April 20, 2018Date of Patent: December 10, 2019Assignee: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Yung-Chieh Chen, Jung-Chiuan Lin
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Patent number: D871356Type: GrantFiled: April 20, 2018Date of Patent: December 31, 2019Assignee: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Yung-Chieh Chen, Jung-Chiuan Lin