Patents by Inventor Yung-Chieh Chen
Yung-Chieh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9158346Abstract: A main board, comprising a first set of memory slots, the first set of memory slots comprising a first channel and a second channel disposed in parallel with each other, and each of the first channel and the second channel comprising a first type of slot and a second type of slot respectively, wherein the first type of slot and the second type of slot of the first channel are disposed at a first side and a second side of the first channel respectively, the first type of slot and the second type of slot of the second channel are disposed at a first side and a second side of the second channel respectively, and the first side of the first channel is adjacent to the first side of the second channel.Type: GrantFiled: May 21, 2013Date of Patent: October 13, 2015Assignee: Celestica Technology Consultancy (Shanghai) Co., Ltd.Inventor: Yung-Chieh Chen
-
Publication number: 20140369047Abstract: A frame for a light apparatus and the light apparatus are provided. The light apparatus has at least one light-emitting diode chip. The frame includes an electrode portion, a first body and a second body. The frame has a first portion, a second portion and a bendable connecting portion which is located between the first portion and the second portion. An angle is formed between the first portion and the second portion by the connecting portion. The first body is disposed on the first portion. The first body has a first recess exposing a portion of a first electrode surface of the first portion. The light-emitting diode chip is disposed in the first recess and connected with the first electrode surface electrically. The second body is disposed on the second portion and exposes a portion of the connection surface of the second portion.Type: ApplicationFiled: June 17, 2014Publication date: December 18, 2014Inventors: Yung Chieh Chen, Jung Chiuan Lin, Feng-Ting Hsu, Chien-Chang Pei
-
Publication number: 20140346551Abstract: Various examples of a carrier structure and lighting device are described. A carrier structure configured to carry an LED includes a housing and a lead frame. The housing has a concave. The lead frame includes a main board portion having a main board through hole, at least two insertion portions extending from the main board portion into the main board through hole, and two electrode portions configured to be electrically coupled to the LED. The housing is disposed over the at least two insertion portions with the at least two insertion portions inserted into the housing. The concave of the housing expose the electrode portions. Each of the electrode portions has a respective protrusion sub-portion that extends outside of the housing. Additionally, a lighting device utilizing the carrier structure is also provided.Type: ApplicationFiled: May 9, 2014Publication date: November 27, 2014Applicant: Everlight Electronics Co., Ltd.Inventors: Yung Chieh Chen, Jung Chiuan Lin
-
Patent number: 8780536Abstract: A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads.Type: GrantFiled: October 18, 2011Date of Patent: July 15, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shin-Ting Yen, Yung-Chieh Chen, Duen-Yi Ho
-
Patent number: 8781783Abstract: A system and method for checking a ground via of control chips of a printed circuit board (PCB) provides a graphical user interface (GUI) displaying a layout of the PCB. The control chip has a plurality of ground pins. The computer searches for signal path routing of each ground pin and ground vias along each signal path routing of each ground pin. If there are any ground vias having the same absolute coordinates, the computer determines that the ground vias are shared by more than one ground pin.Type: GrantFiled: February 5, 2010Date of Patent: July 15, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Hsien-Chuan Liang, Shen-Chun Li, Chun-Jen Chen, Shou-Kuo Hsu, Yung-Chieh Chen, Wen-Laing Tseng
-
Publication number: 20140177159Abstract: A main board, comprising a first set of memory slots, the first set of memory slots comprising a first channel and a second channel disposed in parallel with each other, and each of the first channel and the second channel comprising a first type of slot and a second type of slot respectively, wherein the first type of slot and the second type of slot of the first channel are disposed at a first side and a second side of the first channel respectively, the first type of slot and the second type of slot of the second channel are disposed at a first side and a second side of the second channel respectively, and the first side of the first channel is adjacent to the first side of the second channel.Type: ApplicationFiled: May 21, 2013Publication date: June 26, 2014Applicant: Celestica Technology Consultancy (Shanghai) Co., Ltd.Inventor: Yung-Chieh CHEN
-
Patent number: 8723622Abstract: Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, and thickness of each of dielectric layers can be changed. When any component needs to be replaced, the filter can be detached as needed.Type: GrantFiled: December 16, 2009Date of Patent: May 13, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen, Hsien-Chuan Liang
-
Publication number: 20140029209Abstract: A power management system includes a main controller, a pair of supporting frames extending from the main controller, and a number of mobile modules removably mounted on the supporting frames. The main controller receives power from an external power source. Each of the mobile modules is connected to a load and electrically connected to the main controller via the supporting frame. The main controller provides power to the load via the corresponding mobile module. Each of the mobile modules presets a power limit according to a rated power of the load connected to the mobile module and cuts off an electrical connection with the load when an operating power of the load is greater than the power limit.Type: ApplicationFiled: July 30, 2013Publication date: January 30, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: HSIEN-CHUAN LIANG, CHIH-CHUNG SHIH, YUNG-CHIEH CHEN
-
Patent number: 8625269Abstract: A serial advanced technology attachment (SATA) DIMM includes a board body. A control chip is arranged on the board body. An extending board extends from an end of the board body. A first edge connector is set on the extending board. A second edge connector is set on a bottom side of the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins.Type: GrantFiled: June 29, 2011Date of Patent: January 7, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Yung-Chieh Chen, Shou-Kuo Hsu
-
Patent number: 8536456Abstract: A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.Type: GrantFiled: June 9, 2011Date of Patent: September 17, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Yung-Chieh Chen, Shou-Kuo Hsu, Hsien-Chuan Liang, Shin-Ting Yen, Dan-Chen Wu
-
Patent number: 8502617Abstract: A printed circuit board includes a base, a signal layer lying on the base, and a number of pairs of differential signal traces positioned on the signal layer. The base is made of a grid of glass fiber bundles filled with epoxy resin. Each pair of differential signal traces includes a first signal trace and a second signal trace. Each of the first and second signal traces extends in a zigzag pattern. The first signal trace includes a number of wave crests and wave troughs. The wave crests define a reference straight line that connects all the wave crest of the first signal trace. The ratio of the distance from each wave crest to the reference straight line to the orthogonal distance between each wave crest and an adjacent wave trough along the reference straight line is 1:5.Type: GrantFiled: January 28, 2011Date of Patent: August 6, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Ying-Tso Lai, Yung-Chieh Chen
-
Patent number: 8494804Abstract: A system and method generates a test file of a print circuit board (PCB). The system and method loads trace information of the PCB into a storage system of a test computer, searches the storage system for the trace information matching keywords received and selects traces to test from the searched results. The system and method further acquires length and test points of each selected trace, and sets test parameters of each test item. In addition, the system and method generates a test file of the PCB according to the test parameters, the length, and the test points of each selected trace.Type: GrantFiled: March 21, 2010Date of Patent: July 23, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Hsien-Chuan Liang, Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen
-
Patent number: 8456855Abstract: A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.Type: GrantFiled: August 18, 2011Date of Patent: June 4, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Yung-Chieh Chen, Duen-Yi Ho, Shou-Kuo Hsu
-
Patent number: 8434604Abstract: A reversing transmission includes a shaft, a retainer, a spacing collar, reversing members, two gears and two covers. The holder is sleeved on the shaft with spaced sliding notches formed thereon. The spacing collar is mounted on an outer surface of the retainer. The reversing members each include two spaced swing plates, with two reversed spiral teeth dented on two diagonal half surfaces of the two spaced swing plates. The reversing members slide into the sliding notches of the holder, with the two swing plates of each reversing member distributed at different sides of the spacing collar. Each of the gears has a group of spiral teeth formed on the inner side for engaging with the group of spiral teeth of the reversing members, and cogs formed on the outer circumference surface. The covers are mounted on two opposite ends of the holder to keep the reversing members in position.Type: GrantFiled: April 16, 2010Date of Patent: May 7, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen, Hsien-Chuan Liang, Shin-Ting Yen, Hung Chao
-
Patent number: 8434050Abstract: A computing system includes a drawing unit and a layout unit. The computing system sets components parameters to components of a circuit diagram of a printed circuit board (PCB). The drawing unit draws the circuit diagram by using the components with the components parameters. If the drawing unit wants to use a component more than once, the computing system copies the component and the corresponding components parameters. The drawing unit uses the copied components and the corresponding parameters. If the circuit diagram has been drawn, the layout unit loads the circuit diagram and wires the PCB according to the components and the components parameters in the circuit diagram.Type: GrantFiled: August 22, 2011Date of Patent: April 30, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shin-Ting Yen, Shou-Kuo Hsu, Yung-Chieh Chen, Dan-Chen Wu
-
Patent number: 8418357Abstract: A printed circuit board layout method includes the following steps. Providing a printed circuit board with a first layout layer and a second layout layer. Disposing a pair of first conducting portions on the first layout layer to electrically couple to a control chip. Sequentially disposing a pair of second conducting portions, a pair of third conducting portions, and a pair of fourth conducting portions on the second layout layer. Providing a pair of connecting portions to connect the first conducting portions and the third conducting portions. Electrically connecting an electronic device to the second conducting portions, and providing a first and second components are coupled with the third and fourth conducting portions, or electrically coupling the electronic device to the fourth conducting portions, and providing the first and the second components are coupled with the second and third conducting portions.Type: GrantFiled: December 7, 2008Date of Patent: April 16, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Yung-Chieh Chen, Cheng-Shien Li, Shou-Kuo Hsu
-
Patent number: 8410866Abstract: Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, thickness of a dielectric layer, and thickness of an insulation tube can be changed. When any component needs to be replaced, each cover is rotated, with connection partitions moving to two slots of an insulation portion, to detach the filter.Type: GrantFiled: December 23, 2009Date of Patent: April 2, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen, Hsiao-Yun Su, Hsien-Chuan Liang
-
Patent number: 8406005Abstract: A printed circuit board includes first and second transmission lines connected to a first high speed differential signal control chip, third and fourth transmission lines connected to a second high speed differential signal control chip, and fifth and sixth transmission lines connected to a connector pad. To have the first high speed differential signal control chip communicate with the connector pad, the first transmission line is connected to the fifth transmission line through a first connection component, and the second transmission line is connected to the sixth transmission line through a second connection component. To have the second speed differential signal control chip communicate with the connector pad, the third transmission line is connected to the fifth transmission line through the first connection component, and the fourth transmission line is connected to the sixth transmission line through the second connection component.Type: GrantFiled: March 18, 2011Date of Patent: March 26, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Hsiao-Yun Su, Yung-Chieh Chen, Cheng-Hsien Lee
-
Publication number: 20130070410Abstract: A computer system includes a motherboard with first and second storage device interfaces and first to third memory slots, and first to third serial advanced technology attachment dual-in-line memory modules (SATA DIMMs). First and second extending boards are extended from two opposite ends of each SATA DIMM, arranged with first and second edge connectors, respectively. The first edge connector of the first SATA DIMM is connected to the first storage device interface. The second edge connector of the first SATA DIMM is connected to the first edge connector of the second SATA DIMM. The second edge connector of the second SATA DIMM is connected to the first edge connector of the third SATA DIMM. The second edge connector of the third SATA DIMM is connected to the second storage device interface.Type: ApplicationFiled: October 12, 2011Publication date: March 21, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YUNG-CHIEH CHEN, SHOU-KUO HSU, CHIH-CHUNG SHIH, HSIEN-CHUAN LIANG, WEI-CHIEH CHOU, CHUN-HSIEN TSAI
-
Patent number: D714237Type: GrantFiled: August 15, 2013Date of Patent: September 30, 2014Assignee: Everlight Electronics Co., Ltd.Inventor: Yung Chieh Chen