Abstract: An exemplary antistatic circuit board includes a first outer layer, a second outer layer, a first ground layer, and a second ground layer. The first ground layer and the second ground layer are positioned between the first outer layer and the second outer layer. The first ground layer is adjacent to the first outer layer and the second ground layer is adjacent to the second outer layer. The antistatic circuit board defines two position holes each penetrating through the first ground layer and the second ground layer. Two circuit grounds are wired on the first ground layer and the second ground layer, respectively. The second ground layer further includes a chassis ground. Each of the position holes also penetrates through the chassis ground.

Abstract: A printed circuit board includes first and second transmission lines connected to a first high speed differential signal control chip, third and fourth transmission lines connected to a second high speed differential signal control chip, and fifth and sixth transmission lines connected to a connector pad. To have the first high speed differential signal control chip communicate with the connector pad, the first transmission line is connected to the fifth transmission line through a first connection component, and the second transmission line is connected to the sixth transmission line through a second connection component. To have the second speed differential signal control chip communicate with the connector pad, the third transmission line is connected to the fifth transmission line through the first connection component, and the fourth transmission line is connected to the sixth transmission line through the second connection component.

Abstract: A system, storage medium, and method for structuring data are provided. The system connects to a storage device that stores original data. The method obtains the original data from the storage device, and stores the original data in the form of character strings into a buffer memory according to end of file-line (EOF) tags. The method further constructs data arrays to store the character strings, and arranges each of the data arrays into a data matrix. In addition, the method classifies each of the data arrays in the data matrix according to properties of the character strings, arranges the classified data arrays into a data file, and stores the data file into the buffer memory.

Abstract: A bearing includes a main body, a plurality of first magnetic members, a plurality of second magnetic members, and a plurality of friction members. The main body defines a pivot hole, and a plurality of first receiving portions and a plurality of second receiving portions around the pivot hole. Each of the second receiving portions defines a cutout. The first magnetic members are received in the first receiving portions. The second magnetic members together with the friction members are received in the second receiving portions, thus generating a repelling force between the first magnetic members and the second magnetic members to impel the friction members to partially extend out of the cutouts.

Abstract: A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board.

Abstract: A system and method for inspecting layout of a printed circuit board (PCB) provides a graphical user interface (GUI). The GUI displays a layout of the PCB. High side pins of a pulse width modulation (PWM) controller and a component connected to a high side pin are found. If the component is a metallic oxide semiconductor field effect transistor (MOSFET), the system calculate absolute a linear distance and a trace distance between a source pin of the MOSFET and a capacitor pin of a coupling capacitor connected to the source pin. If the linear distance, the trace distance and a capacitance of the coupling capacitor accord with a layout standard, the layout of the PCB is determined to be up to standard.

Abstract: A computer motherboard includes a printed circuit board which includes a central processing unit (CPU) socket and a group of memory slots. The group of memory slots includes an in-line type memory slot and a surface mounted device (SMD) type memory slot. The in-line type memory slot includes a number of plated through holes. The SMD type memory slot is set between the in-line type memory slot and the CPU socket. The through holes of the in-line type memory slot are connected to the CPU socket through traces, pads of the SMD type memory slot are connected to corresponding through holes of the in-line type memory slot having the same pin definition.

Abstract: A motherboard includes a printed circuit board (PCB) and a memory connector. A number of golden fingers are set on corresponding sides of a top layer and a bottom layer of the PCB and connected to a memory controller. First and second socket slots are defined in two opposite sides of the memory connector. A number of grooves are defined in top and bottom sidewalls bounding the first and the second socket slots. A number of metal pins are exposed through the grooves of the first socket slot for connection to the golden fingers of the PCB. The metal pins are extended to the second socket slot to be exposed through the grooves of the second socket opening for connection to the golden fingers of a memory.

Abstract: A motherboard includes a printed circuit board (PCB) and a memory connector. The PCB includes top and bottom layers. A number of pads are set on the sides of the top and bottom layers and connected to a memory controller. A number of metal pins are set on a first sidewall of the memory connector. A socket slot is defined in a second sidewall opposite to the first sidewall. Top and bottom sidewalls bounding the socket slot define a number of grooves. First ends of the metal pins are soldered on the pads of the top layer and the bottom layer of the PCB. Second ends of the metal pins are extended to the socket slot through the memory connector and exposed through the grooves of the memory connector, to be electrically connected to the golden fingers of a memory when the memory is inserted in the socket slot.

Abstract: A testing apparatus is for testing products on an assembly line and includes a worktable, a positioning device, and a testing member. The worktable includes a number of wheels pivotably attached to a bottom thereof, and a number of retractable feet attached to the bottom thereof. The positioning device is attached to the worktable and includes a number of clamping members to position a product to be test. The testing member is attached to the worktable and operated by a control box to move a robot arm with a testing head to test the product.

Abstract: A computing system includes a drawing unit and a layout unit. The computing system sets components parameters to components of a circuit diagram of a printed circuit board (PCB). The drawing unit draws the circuit diagram by using the components with the components parameters. If the drawing unit wants to use a component more than once, the computing system copies the component and the corresponding components parameters. The drawing unit uses the copied components and the corresponding parameters. If the circuit diagram has been drawn, the layout unit loads the circuit diagram and wires the PCB according to the components and the components parameters in the circuit diagram.

Abstract: A printed circuit board includes a base, a signal layer lying on the base, and a number of pairs of differential signal traces positioned on the signal layer. The base is made of a grid of glass fiber bundles filled with epoxy resin. Each pair of differential signal traces includes a first signal trace and a second signal trace. Each of the first and second signal traces extends in a zigzag pattern. The first signal trace includes a number of wave crests and wave troughs. The wave crests define a reference straight line that connects all the wave crest of the first signal trace. The ratio of the distance from each wave crest to the reference straight line to the orthogonal distance between each wave crest and an adjacent wave trough along the reference straight line is 1:5.

Abstract: A printed circuit board (PCB) includes a top layer, a memory controller, a gap, and a connector. The memory controller is located on the top layer. A number of first golden fingers are set on the top layer near the gap and electrically connected to the memory controller. A connector includes a first slot to hold the first golden fingers and a second slot to hold a number of second golden fingers of a memory chip. The first slot is electrically connected to the second slot. The memory chip and the PCB are coplanar.

Abstract: A printed circuit board (PCB) includes first and second signal layers. First and second pairs of signal transmission lines are respectively laid out on the first and second signal layers. The first pair of signal transmission lines includes first positive and negative differential signal transmission lines. The second pair of signal transmission lines includes second positive and negative differential signal transmission lines. The first positive differential signal transmission line is electrically connected to the second negative differential signal transmission line by a first vertical interconnect access (via). The first negative differential signal transmission line is electrically connected to the second positive differential signal transmission line by a second via. An angle between a centerline of each of the first via and second via and a surface of the PCB is an acute angle.

Abstract: A printed circuit board (PCB) includes a top layer, a memory controller, two gaps, and two connectors. The memory controller is located on the top layer. A number of golden fingers are respectively set on the top layer near each gap and electrically connected to the memory controller. Each connector includes a first slot to hold the gold fingers near a corresponding one of the gaps and a second slot to hold a number of gold fingers of a corresponding one of two memory chips. The first slot is electrically connected to the second slot. Each memory chip and the PCB are coplanar.

Abstract: A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

Abstract: A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors.

Abstract: A printed circuit board includes a top layer. A memory controller, a first dual-channel architecture, and a second dual-channel architecture are located on the top layer. A distance between the memory modules of the first dual-channel architecture and the memory controller is equal to a distance between the memory modules of the second dual-channel architecture and the memory controller.

Abstract: A printed circuit board is constructed from various woven fiberglass fabrics, strengthened and bound together with epoxy resin, and includes a signal layer. The signal layer includes a positive differential signal line and a negative differential signal line laid out in parallel following a zig-zag pattern. A first distance and a second distance is designed at a ratio of 1:7. The first distance is a perpendicular distance between a highest point of the negative differential signal line and a reference line formed by connecting all lowest points of the negative differential signal line. The second distance is a perpendicular distance between a lowest point and an adjacent highest point of the negative differential signal line along the direction of the reference line.

Abstract: A printed circuit board includes an insulating board, a pair of differential vias, and a number of wiring layers. A pair of via holes extends through opposite surfaces of the insulating board. The differential vias correspond to the pair of via holes. Each differential via includes a metal plated barrel and two via capture pads. The plated barrel is plated on the inner surface of the respective via hole, and terminates at each of the two opposite surfaces of the insulating board. The via capture pads are formed on the opposite surfaces of the insulating board around the openings of the via hole, and are electrically connected to the plated barrel. The wiring layers are arranged in the insulating board, and each define a clearance hole surrounding all of the via capture pads.