Patents by Inventor Yung-Chieh Chen

Yung-Chieh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130067254
    Abstract: In a method for transmitting data between a host computer and a slave device, the host computer connects to a slave device through a data communication port. The slave device is equipped with a power supply that includes at least one capacitor. The power supply is charged through the host computer using the capacitor when the host computer is powered on. The method controls the host computer sends data to the slave device, and controls the capacitor to discharge to provide power to the slave device for a period of time when the host computer is powered off, and stores the data packet into the slave device during the period of time. The method further retrieves the data from the storage device when the host computer is powered on, and resends the data to the slave device through the data communication port.
    Type: Application
    Filed: May 31, 2012
    Publication date: March 14, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HSIEN-CHUAN LIANG, CHIH-CHUNG SHIH, SHOU-KUO HSU, YUNG-CHIEH CHEN
  • Publication number: 20130054865
    Abstract: A mouse includes a universal serial bus (USB) 3.0 port, a mouse control circuit, and a memory card port for connecting a memory card. The USB 3.0 port transmits data of the mouse from the mouse control circuit through a first to a fourth pins of the USB 3.0 port, and transmits data of the memory card through the first and a fifth to ninth pins of the USB 3.0 port.
    Type: Application
    Filed: October 31, 2011
    Publication date: February 28, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: XIAO-GANG YIN, YUNG-CHIEH CHEN
  • Patent number: 8383957
    Abstract: A printed circuit board (PCB) includes two layers, two signal transmission traces, and a vertical interconnect access (via). The signal transmission traces are respectively arranged on the layers. The signal transmission traces are electrically connected to each other through the via. A centerline of the via with a vertical line of the layers form an acute angle ?, the angle ? is less than cos?1[(Lv2?Lt2)/(Lv2+Lt2)]. Wherein Lt is loss of the two signal transmitting traces in a unit length, and Lv is loss of the via in a unit length.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: February 26, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shou-Kuo Hsu, Yung-Chieh Chen, Hsien-Chuan Liang, Wen-Laing Tseng, Shen-Chun Li, Chia-Nan Pai
  • Patent number: 8378761
    Abstract: Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, thickness of a dielectric layer, and thickness of an insulation tube can be changed. When any component needs to be replaced, each cover is rotated, with connection partitions move to two slots of an insulation portion, to detach the filter.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: February 19, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen, Hsien-Chuan Liang
  • Publication number: 20130039025
    Abstract: A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.
    Type: Application
    Filed: August 18, 2011
    Publication date: February 14, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUNG-CHIEH CHEN, DUEN-YI HO, SHOU-KUO HSU
  • Patent number: 8359944
    Abstract: A robot arm includes a circular rack, an elongated first mounting member attached to the rack, and a second mounting member attached to the first mounting member. The first mounting member extends in a radius direction of the rack and moves in a circular trace along the rack. The second mounting member slides relative to the first mounting member along the radius direction, thereby defining a polar coordinate system in a plane defined by the rack to allow the second mounting member to flexibly locate at any desired positions in the plane.
    Type: Grant
    Filed: March 23, 2010
    Date of Patent: January 29, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen, Hsien-Chuan Liang
  • Publication number: 20130016466
    Abstract: A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads.
    Type: Application
    Filed: October 18, 2011
    Publication date: January 17, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHIN-TING YEN, YUNG-CHIEH CHEN, DUEN-YI HO
  • Publication number: 20120327623
    Abstract: A printed circuit board includes first and second layout layers, first and second components, and a pair of connecting portions. The first layout layer includes a pair of first conducting portions connected to a control chip. The second layout layer includes pairs of second to fourth conducting portions. The connecting portions connect the first and third conducting portions together. When an electronic device is connected to the second conducting portions, and the first and second components are connected to the third and fourth conducting portions to form a first route, signals generated by the control chip are transmitted to the electronic device through the first route. When the electronic device is connected to the fourth conducting portions, and the first and second components are connected to the second and third conducting portions to form a second route, the signals are transmitted to the electronic device through the second route.
    Type: Application
    Filed: August 28, 2012
    Publication date: December 27, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUNG-CHIEH CHEN, CHENG-HSIEN LI, SHOU-KUO HSU
  • Publication number: 20120320518
    Abstract: A serial advanced technology attachment (SATA) DIMM includes a board body. A control chip is arranged on the board body. An extending board extends from an end of the board body. A first edge connector is set on the extending board. A second edge connector is set on a bottom side of the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins.
    Type: Application
    Filed: June 29, 2011
    Publication date: December 20, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUNG-CHIEH CHEN, SHOU-KUO HSU
  • Patent number: 8330554
    Abstract: Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, thickness of a dielectric layer, and thickness of an insulation tube can be changed. When any component needs to be replaced, each cover is rotated, with connection partitions move to two slots of a resisting portion, to detach the filter.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: December 11, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen, Hsien-Chuan Liang
  • Patent number: 8332177
    Abstract: A method for testing a characteristic impedance of a signal path routing of a printed circuit board (PCB) controls the test device to test a characteristic impedance of the signal path routing of the PCB to get test data of the signal path routing of the PCB. The method further analyzes the test data of the signal path routing of the PCB get analysis results, generate a test report for storing the test data of each signal path routing of the PCB and the analysis results if all signal path routings of the PCB have been tested.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: December 11, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsien-Chuan Liang, Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen
  • Publication number: 20120304145
    Abstract: An electronic device includes a wiring unit. The wiring unit creates one or more circuit diagrams for a design of a first circuit board, and setting electrical rules for components of the first circuit board in each of the one or more diagrams. Based on the one or more diagrams having the electrical rules, the wiring unit generates a wiring diagram for the design of the first circuit board by executing a wiring application. If a second circuit board desires to use a circuit diagram of the first circuit board, the wiring unit copies the circuit diagram having the electrical rules into the wiring application. Then, based on the copied circuit diagram having the electrical rules and particular circuit diagrams of the second circuit board, and the wiring unit creates a wiring diagram for the design of the second circuit board by executing the wiring application.
    Type: Application
    Filed: March 30, 2012
    Publication date: November 29, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUNG-CHIEH CHEN, SHOU-KUO HSU, SHIN-TING YEN
  • Patent number: 8320137
    Abstract: A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors.
    Type: Grant
    Filed: December 24, 2010
    Date of Patent: November 27, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Hsien Lee, Yung-Chieh Chen, Shou-Kuo Hsu, Shin-Ting Yen
  • Patent number: 8315066
    Abstract: A printed circuit board (PCB) includes a top layer, a memory controller, two gaps, and two connectors. The memory controller is located on the top layer. A number of golden fingers are respectively set on the top layer near each gap and electrically connected to the memory controller. Each connector includes a first slot to hold the gold fingers near a corresponding one of the gaps and a second slot to hold a number of gold fingers of a corresponding one of two memory chips. The first slot is electrically connected to the second slot. Each memory chip and the PCB are coplanar.
    Type: Grant
    Filed: December 31, 2010
    Date of Patent: November 20, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Chieh Chen, Shou-Kuo Hsu
  • Publication number: 20120273258
    Abstract: A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.
    Type: Application
    Filed: June 9, 2011
    Publication date: November 1, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUNG-CHIEH CHEN, SHOU-KUO HSU, HSIEN-CHUAN LIANG, SHIN-TING YEN, DAN-CHEN WU
  • Patent number: 8302045
    Abstract: An electronic device and method for inspecting electrical rules of circuit boards includes selecting at least two design files that record electrical rules of the circuit boards and searching the electrical rules in the selected design files using preset parameter keywords. Same electrical rules of the selected design files are acquired by comparing the electrical rules in the selected design files. The same electrical rules and corresponding parameter values are input to a comparison table, and the comparison table is output.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 30, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Chieh Chen, Hsien-Chuan Liang, Shin-Ting Yen, Shen-Chun Li, Shou-Kuo Hsu
  • Patent number: 8301405
    Abstract: A system and method uses a measurement control device and a measurement machine to measure pin voltages of electronic components installed in an electronic device. The measurement control device controls a mechanical arm of the measurement machine to move to the pins of the electronic components according to coordinates of the pins. A voltage probe installed on the end of the mechanical arm can measure voltages of the pins automatically.
    Type: Grant
    Filed: April 5, 2010
    Date of Patent: October 30, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsien-Chuan Liang, Shen-Chun Li, Wen-Laing Tseng, Yung-Chieh Chen, Shou-Kuo Hsu
  • Publication number: 20120268283
    Abstract: A circuit board includes a current balancing unit that receives a number of current values from ammeters. A minimum current value between the current values is determined by the current balancing unit. Resistance of one or more variable resistors of the current balancing unit is adjusted by the current balancing unit to make the current value from one or more the ammeters serially connected to the one or more the variable resistors to be substantially equal to the minimum current value.
    Type: Application
    Filed: June 24, 2011
    Publication date: October 25, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHOU-KUO HSU, YUNG-CHIEH CHEN, HSIEN-CHUAN LIANG, SHEN-CHUN LI, WEN-LAING TSENG, CHIA-NAN PAI
  • Patent number: 8283571
    Abstract: A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines.
    Type: Grant
    Filed: May 31, 2010
    Date of Patent: October 9, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ying-Tso Lai, Yung-Chieh Chen, Chun-Jen Chen, Wei-Chieh Chou
  • Patent number: 8283574
    Abstract: A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: October 9, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Chieh Chen, Cheng-Hsien Lee, Po-Chuan Hsieh, Shou-Kuo Hsu, Shin-Ting Yen, Dan-Chen Wu, Jia-Chi Chen