Patents by Inventor Yung-Sheng Huang

Yung-Sheng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6136574
    Abstract: The present invention relates to fatty acid desaturases able to catalyze the conversion of oleic acid to linoleic acid, linoleic acid to gamma-linolenic acid, or of alpha-linolenic acid to stearidonic acid. Nucleic acid sequences encoding desaturases, nucleic acid sequences which hybridize thereto, DNA constructs comprising a desaturase gene, and recombinant host microorganism or animal expressing increased levels of a desaturase are described. Methods for desaturating a fatty acid and for producing a desaturated fatty acid by expressing increased levels of a desaturase are disclosed. Fatty acids, and oils containing them, which have been desaturated by a desaturase produced by recombinant host microorganisms or animals are provided. Pharmaceutical compositions, infant formulas or dietary supplements containing fatty acids which have been desaturated by a desaturase produced by a recombinant host microorganism or animal also are described.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: October 24, 2000
    Assignees: Abbott Laboratories, Calgene LLC
    Inventors: Deborah Knutzon, Pradip Mukerji, Yung-Sheng Huang, Jennifer Thurmond, Sunita Chaudhary
  • Patent number: 6110816
    Abstract: A method is adapted to form wire interconnect pads on integrated circuit devices and includes the steps of providing a semiconductor substrate having an aluminum-copper top metal layer, and a titanium nitride layer covering the aluminum-copper top metal layer, and a photoresist coating applied to the titanium nitride layer. The photoresist coating is partially exposed and partially developed to form openings for etching an array of submicron size holes. Etching through the titanium nitride layer to the aluminum-copper layer, by way of the partially developed photoresist, forms a rough textured surface profile in the array of cavities, with diameters of less than 0.3 um, etched in the aluminum copper layer. After stripping of the photoresist and depositing a passivation film, windows are formed delineating improved bond pads for wire bonding. The textured cavities increase the surface area of the bond pads and provide improved bondability for the 0.35 and 0.3 um IC devices.
    Type: Grant
    Filed: March 5, 1999
    Date of Patent: August 29, 2000
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Yung-Sheng Huang, Hung-Chang Hsieh, Han-Chang Hsieh
  • Patent number: 6075183
    Abstract: The present invention relates to compositions and methods for preparing poly-unsaturated long chain fatty acids in plants, plant parts and plant cells, such as leaves, roots, fruits and seeds. Nucleic acid sequences and constructs encoding fatty acid desaturases, including .DELTA.5-desaturases, .DELTA.6-desaturases and .DELTA.12-desaturases, are used to generate transgenic plants, plant parts and cells which contain and express one or more transgenes encoding one or more desaturases. Expression of the desaturases with different substrate specificities in the plant system permit the large scale production of poly-unsaturated long chain fatty acids such as docosahexaenoic acid, eicosapentaenoic acid, .alpha.-linoleic acid, gamma-linolenic acid, arachidonic acid and the like for modification of the fatty acid profile of plants, plant parts and tissues. Manipulation of the fatty acid profiles allows for the production of commercial quantities of novel plant oils and products.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: June 13, 2000
    Assignees: Abbott Laboratories, Calgene LLC
    Inventors: Deborah Knutzon, Pradip Mukerji, Yung-Sheng Huang, Jennifer Thurmond, Sunita Chaudhary
  • Patent number: 5972664
    Abstract: The present invention relates to a fatty acid .DELTA.5-desaturase able to catalyze the conversion of dihomo-gamma-linolenic acid to arachidonic acid. Nucleic acid sequences encoding a .DELTA.5-desaturase, nucleic acid sequences which hybridize thereto, DNA constructs comprising a .DELTA.5-desaturase gene, and recombinant host microorganism or animal expressing increased levels of a .DELTA.5-desaturase are described. Methods for desaturating a fatty acid at the .DELTA.5 position and for producing arachidonic acid by expressing increased levels of a .DELTA.5 desaturase are disclosed. Fatty acids, and oils containing them, which have been desaturated by a .DELTA.5-desaturase produced by recombinant host microorganisms or animals are provided. Pharmaceutical compositions, infant formulas or dietary supplements containing fatty acids which have been desaturated by a .DELTA.5-desaturase produced by a recombinant host microorganism or animal also are described.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: October 26, 1999
    Assignees: Abbott Laboratories, Calgene, Inc.
    Inventors: Deborah Knutzon, Pradip Mukerji, Yung-Sheng Huang, Jennifer Thurmond, Sunita Chaudhary
  • Patent number: 5968809
    Abstract: The present invention relates to fatty acid desaturases able to catalyze the conversion of oleic acid to linoleic acid, linoleic acid to gamma-linolenic acid, or of alpha-linolenic acid to stearidonic acid. Nucleic acid sequences encoding desaturases, nucleic acid sequences which hybridize thereto, DNA constructs comprising a desaturase gene, and recombinant host microorganism or animal expressing increased levels of a desaturase are described. Methods for desaturating a fatty acid and for producing a desaturated fatty acid by expressing increased levels of a desaturase are disclosed. Fatty acids, and oils containing them, which have been desaturated by a desaturase produced by recombinant host microorganisms or animals are provided. Pharmaceutical compositions, infant formulas or dietary supplements containing fatty acids which have been desaturated by a desaturase produced by a recombinant host microorganism or animal also are described.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: October 19, 1999
    Assignees: Abbot Laboratories, Calgene Inc.
    Inventors: Deborah Knutzon, Pradip Mukerji, Yung-Sheng Huang, Jennifer Thurmond, Sunita Chaudhary
  • Patent number: 5933704
    Abstract: A new method of preparing for inspection a wafer having multilayer interconnections is described. Semiconductor device structures having multilayer interconnections are provided in and on a semiconductor substrate wherein the multilayer interconnections comprise alternating layers of oxide interlevel dielectric layers and conducting layers and wherein interconnections are made between the conducting layers through the interlevel dielectric layers and wherein a non-oxide passivation layer overlies the topmost dielectric layer. The non-oxide passivation layer is removed and an oxide passivation layer is deposited overlying the topmost dielectric layer. The oxide passivation layer and interlevel dielectric layers and conducting layers are cut through to expose a sidewall to reveal the multilayer interconnections.
    Type: Grant
    Filed: June 2, 1997
    Date of Patent: August 3, 1999
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ruey-Lian Hwang, Yung-Sheng Huang, Chin-Cheng Chiu
  • Patent number: 5861671
    Abstract: A method for fabricating seamless, tungsten filled, small diameter contact holes, has been developed. The process features initially creating a tungsten plug, in the small diameter contact hole, and filling or repairing, seams or voids in the tungsten plug, with an additional layer of selectively deposited tungsten.
    Type: Grant
    Filed: July 14, 1997
    Date of Patent: January 19, 1999
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Nun-Sian Tsai, Yung-Sheng Huang
  • Patent number: 5747382
    Abstract: A novel method is presented to form and planarize an inter-metal-dielectric(IMD) layer of an integrated circuit with two or more levels of interconnection metallurgy. The method utilizes chemical-mechanical-polishing(CMP) followed by reactive-ion-etching(RIE) to first planarize and then etch back a deposited IMD layer. Metal line spacings of less than 1.5 microns produce voids in the IMD even when spin-on-glass(SOG) is used to partially fill the spaces prior to IMD deposition. These voids, which contain organic residues and debris, can produce eruptions of material during several subsequent processing steps. The method of this invention attenuates and de-activates these voids, rendering them completely benign. Since CMP is only used to achieve a planar surface, risks of CMP damage to alignment marks and other features are also reduced.
    Type: Grant
    Filed: September 24, 1996
    Date of Patent: May 5, 1998
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Sheng Huang, Long-Sheng Yeou, Ji-Chung Huang, Chang-Song Lin
  • Patent number: 5700726
    Abstract: A process for filling small diameter contact holes, with tungsten, has been developed. This process consists of using two consecutive tungsten depositions. A first tungsten layer, that will exhibit a fast removal rate in a specific dry etch chemistry, such as RIE, is used to coat the sidewalls of the small diameter contact hole. Next a second layer of tungsten, that will exhibit a significantly slower removal rate then the first tungsten layer, is used to completely fill the contact hole. Etchback, to remove unwanted material from areas outside the contact hole, does not significantly attack the second tungsten fill, in the contact hole, thus not aggravating any seams in the second tungsten fill that may have been created during the LPCVD tungsten, contact hole fill process.
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: December 23, 1997
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd
    Inventors: Yung-Sheng Huang, Nun-Sian Tsai
  • Patent number: 5677237
    Abstract: A method for fabricating seamless, tungsten filled, small diameter contact holes, has been developed. The process features initially creating a tungsten plug, in the small diameter contact hole, and filling or repairing, seams or voids in the tungsten plug, with an additional layer of selectively deposited tungsten.
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: October 14, 1997
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Nun-Sian Tsai, Yung-Sheng Huang
  • Patent number: 5620701
    Abstract: Atopic eczema, breast pain or premenstrual syndrome are treated by administering to a person in need of same a composition containing at least 20% di-linoleoyl-mono-gamma-linolenyl glycerol by weight.
    Type: Grant
    Filed: February 14, 1996
    Date of Patent: April 15, 1997
    Assignee: Scotia Holdings PLC
    Inventors: David F. Horrobin, Yung-Sheng Huang
  • Patent number: 5614208
    Abstract: Atopic eczema, breast pain or premenstrual syndrome are treated by administering to a person in need of same a composition containing at least 20% di-linoleoyl-mono-gamma-linolenyl glycerol by weight.
    Type: Grant
    Filed: February 14, 1996
    Date of Patent: March 25, 1997
    Assignee: Efamol Holdings PLC
    Inventors: David F. Horrobin, Yung-Sheng Huang
  • Patent number: 5552150
    Abstract: A natural or synthetic glycerol oil which comprises at least 20% by weight, preferably at least 25% of di-linoleoyl-mono-gamma-linolenyl-glycerol (DLMG), is used to supplement foods, nutritional compositions and in skin and hair care compositions.
    Type: Grant
    Filed: November 30, 1993
    Date of Patent: September 3, 1996
    Assignee: Efamol Holdings PLC
    Inventors: David F. Horrobin, Yung-Sheng Huang
  • Patent number: 5328691
    Abstract: A natural or synthetic glycerol oil which comprises at least 20% by weight, preferably at least 25% of di-linoleoyl-mono-gamma-linolenyl-glycerol (DLMG), is used to supplement foods, nutritional compositions and in skin and hair care compositions.
    Type: Grant
    Filed: June 1, 1992
    Date of Patent: July 12, 1994
    Assignee: Efamol Holdings PLC
    Inventors: David F. Horrobin, Yung-Sheng Huang