Patents by Inventor Yushuang YAO
Yushuang YAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11894292Abstract: A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.Type: GrantFiled: March 17, 2022Date of Patent: February 6, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Qing Yang, Yong Liu, Yushuang Yao
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Publication number: 20240038632Abstract: A method includes disposing at least one power device between a first direct bonded metal (DBM) substrate and a second DMB substrate and thermally coupling a plurality of pipes to a top side of the first DBM substrate opposite a side of the first DBM substrate with the at least one power device. The plurality of pipes is configured to carry cooling fluids in thermal contact with the first DBM substrate.Type: ApplicationFiled: July 26, 2022Publication date: February 1, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Atapol PRAJUCKAMOL, Chee Hiong CHEW, Yushuang YAO
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Publication number: 20230369176Abstract: Implementations described herein are related to a semiconductor device package having an improved baseplate. In such an improved baseplate, there is a recess cut out of a region of a surface of the baseplate such that the recess has a first sidewall having a first thickness above a recess base and a second sidewall having a second thickness above the recess base. A substrate, e.g., a direct bonded copper (DBC) substrate, may be attached to the baseplate at a recess base using, e.g., a solder layer between the recess base and a surface of the substrate.Type: ApplicationFiled: July 24, 2023Publication date: November 16, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yushuang YAO, Vemmond Jeng Hung NG
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Patent number: 11804421Abstract: A semiconductor package assembly having a connecting clip disposed on both a first material stack and a second material stack having different thicknesses and disposed on a conducting substrate. This connecting clip has a first portion disposed on to the first material stack and second portion disposed on the second material stack, such that the surfaces of the first portion and second portion opposite the conducting substrate are at the same perpendicular distance from the conducting substrate. For example, in some implementations, when the thickness of the second material stack is smaller than the thickness of the first material stack, the second portion of the connecting clip may include a vertical support disposed on the second material stack to equalize the heights of the surfaces of the first portion and second portion of the connecting clip.Type: GrantFiled: December 3, 2020Date of Patent: October 31, 2023Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Atapol Prajuckamol, Chee Hiong Chew, Yushuang Yao
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Publication number: 20230317579Abstract: A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.Type: ApplicationFiled: June 5, 2023Publication date: October 5, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Chee Hiong CHEW, Yushuang YAO, Atapol PRAJUCKAMOL, Chuncao NIU
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Patent number: 11735504Abstract: Implementations described herein are related to a semiconductor device package having an improved baseplate. In such an improved baseplate, there is a recess cut out of a region of a surface of the baseplate such that the recess has a first sidewall having a first thickness above a recess base and a second sidewall having a second thickness above the recess base. A substrate, e.g., a direct bonded copper (DBC) substrate, may be attached to the baseplate at a recess base using, e.g., a solder layer between the recess base and a surface of the substrate.Type: GrantFiled: November 18, 2020Date of Patent: August 22, 2023Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yushuang Yao, Vemmond Jeng Hung Ng
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Patent number: 11710687Abstract: A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.Type: GrantFiled: July 3, 2019Date of Patent: July 25, 2023Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Chee Hiong Chew, Yushuang Yao, Atapol Prajuckamol, Chuncao Niu
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Publication number: 20230180410Abstract: A module includes a power circuit enclosed in a casing. A first power terminal and a second power terminal of the power circuit each extend to an exterior of the casing. The first power terminal and the second power terminal separated by a gap are disposed in a stack on the exterior of the casing.Type: ApplicationFiled: December 1, 2022Publication date: June 8, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Vemmond Jeng Hung NG, Yushuang YAO, Chee Hiong CHEW
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Patent number: 11672087Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.Type: GrantFiled: January 31, 2022Date of Patent: June 6, 2023Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Atapol Prajuckamol, Yushuang Yao, Chee Hiong Chew
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Publication number: 20230027138Abstract: A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.Type: ApplicationFiled: June 20, 2022Publication date: January 26, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yushuang YAO, Chee Hiong CHEW, Vemmond Jeng Hung NG, Chuncao NIU, Sravan VANAPARTHY
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Patent number: 11482468Abstract: A method includes disposing a series of protrusions on a rectangular side panel of an open four-sided box-like structure in a frame, and attaching an electronic substrate to the frame. The electronic substrate carries one or more circuit components. The series of protrusions acts as a spring-like compensator to compensate plastic deformation, twisting or warping of the frame, and to limit propagation of stress to the electronic substrate via the frame.Type: GrantFiled: May 4, 2020Date of Patent: October 25, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yushuang Yao, Vemmond Jeng Hung Ng, Chee Hiong Chew, Qing Yang
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Patent number: 11452225Abstract: A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.Type: GrantFiled: March 29, 2021Date of Patent: September 20, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Atapol Prajuckamol, Chee Hiong Chew, Yushuang Yao
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Publication number: 20220246486Abstract: Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate and a plurality of press-fit pins. The press-fit pins are molded into and fixedly coupled with the case. The pins are also electrically and mechanically coupled to the substrate.Type: ApplicationFiled: April 22, 2022Publication date: August 4, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yushuang YAO, Chee CHEW, Atapol PRAJUCKAMOL
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Publication number: 20220208666Abstract: A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.Type: ApplicationFiled: March 17, 2022Publication date: June 30, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Qing YANG, Yong LIU, Yushuang YAO
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Patent number: 11342237Abstract: Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate and a plurality of press-fit pins. The press-fit pins are molded into and fixedly coupled with the case. The pins are also electrically and mechanically coupled to the substrate.Type: GrantFiled: April 22, 2016Date of Patent: May 24, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yushuang Yao, Chee Hiong Chew, Atapol Prajuckamol
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Publication number: 20220159853Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.Type: ApplicationFiled: January 31, 2022Publication date: May 19, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Atapol PRAJUCKAMOL, Yushuang YAO, Chee Hiong CHEW
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Publication number: 20220157696Abstract: Implementations described herein are related to a semiconductor device package having an improved baseplate. In such an improved baseplate, there is a recess cut out of a region of a surface of the baseplate such that the recess has a first sidewall having a first thickness above a recess base and a second sidewall having a second thickness above the recess base. A substrate, e.g., a direct bonded copper (DBC) substrate, may be attached to the baseplate at a recess base using, e.g., a solder layer between the recess base and a surface of the substrate.Type: ApplicationFiled: November 18, 2020Publication date: May 19, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Yushuang YAO, Vemmond Jeng Hung NG
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Publication number: 20220130740Abstract: A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.Type: ApplicationFiled: October 22, 2020Publication date: April 28, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Qing YANG, Yong LIU, Yushuang YAO
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Patent number: 11315859Abstract: A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.Type: GrantFiled: October 22, 2020Date of Patent: April 26, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Qing Yang, Yong Liu, Yushuang Yao
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Patent number: 11272625Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.Type: GrantFiled: April 4, 2018Date of Patent: March 8, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Atapol Prajuckamol, Chee Hiong Chew, Yushuang Yao