Abstract: A pin for a semiconductor package includes an upper contact portion having a contact surface configured to mechanically and electrically couple with a pin receiver. A lower portion of the pin is configured to flex to allow an upper portion of the pin to move towards an upper contact surface of a horizontal base of the pin in response to a pressure applied along a direction collinear with a longest length of the pin towards the upper contact surface of the horizontal base when the pin is inserted into a pin receiver. Some implementations of pins include a vertical stop to stop movement of the pin when a surface of the vertical stop contacts the upper contact surface of the horizontal base. Varying implementations of pins include: two curved legs and one vertical stop; two partially curved legs and no vertical stop, and; a single leg bent into an N-shape.

Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.