Abstract: An integrated, artificial heart-lung machine and method for performing extracorporeal blood oxygenation and circulation. The heart-lung machine is a single unit in which a cylindrical artificial lung, preferably with a heat exchanger, is connected in series to an undulation pump and a removable drive unit. The undulation pump is directly connected to the oxygenator which significantly reduces the blood priming volume of the system.

Abstract: An integrated, artificial heart-lung machine and method for performing extracorporeal blood oxygenation and circulation. The heart-lung machine is a single unit in which a cylindrical artificial lung, preferably with a heat exchanger, is connected in series to an undulation pump and a removable drive unit. The undulation pump is directly connected to the oxygenator which significantly reduces the blood priming volume of the system.

Abstract: The competition progress or competition results of a competition that is held at each of a plurality of competition sites in which electronic competition systems are installed are transmitted to a relay server by way of the Internet. In the relay server, the competition progress or competition results that have been transmitted in are transmitted to electronic competition systems that are installed in competition sites that have been determined in advance by the transmission source of the competition progress or competition results.

Abstract: An electronic competition system has a plurality of shooting bases each comprised of a laser gun for emitting light, a plurality of strike point detectors each for detecting a strike point on a target board on which the light emitted from the laser gun strikes, and a viewing PC for displaying a competition progress including the strike point detected by each of the strike point detectors. A competition site server is provided for displaying, in response to strike points detected by the strike point detectors, competition progresses at the respective shooting bases in an order in which the strike points are detected.

Abstract: A copper sulfate plating bath is used which contains

Abstract: There are provided a band-shaped tray 12 having grasping grooves 12a for grasping opposite side ends of wafers 1, and a cleaning tank 20 to which the wafers 1 inserted in the tray 12 are conveyed by a conveyor robot 2 to be cleaned. The cleaning tank 20 is provided with guides 22 for mounting the tray 12 in the tank, a bottom portion 26 formed substantially in V-shape conforming to the bottom-face shape of the wafer 1, and flow ports 24 via which cleaning fluid is supplied into the tank. An outer side face of the cleaning tank 20 is provided with an overflow tank 30 for containing the cleaning fluid overflowing from the cleaning tank 20, and the overflow tank 30 is provided with a circulation line 32 for circulating the cleaning fluid again into the cleaning tank 20.

Abstract: A plating apparatus and plating method for an electronic component substrate or the like which prevent the spread of metal contamination in and out of the plating apparatus, do not dissolve a seed layer, have no defects caused by scattering of a treating liquid and wash only the perimeter of the electronic component substrate or the like are provided. The plating apparatus is a plating apparatus for plating an object to be plated such as an electronic component substrate. The plating apparatus includes appropriate numbers of plating baths and baths used for washing or other purposes therein and carries out plating, edge etching, washing and drying continuously therein.

Abstract: A multi-step flow cleaning method and a multi-step flow cleaning apparatus are provided which effectively clean workpieces with a stream of a cleaning solution and to suppress an increase of foreign matters adhering to the surfaces of the workpieces. A cleaning tank 10 for holding workpieces is provided, a supply line 14 for supplying a cleaning solution such as pure water from the bottom surface of the cleaning tank is provided, and a valve 12 for adjusting the flow of the cleaning solution is disposed in the middle of the supply line 14. The valve 12 is equipped with a switching section 12a for controlling the outflow of the cleaning solution by opening or closing the supply line 14, and a bypass 12b for supplying the cleaning solution, bypassing the switching section 12a.

Abstract: There are provided a wafer cleaning device which prevents the contamination of wafers and which can effectively clean the wafers and a tray for use in the wafer cleaning device.

Abstract: There are provided a wafer cleaning device which prevents the contamination of wafers and which can effectively clean the wafers and a tray for use in the wafer cleaning device.