Patents by Inventor Yusuke Fujii

Yusuke Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing method for dividing a wafer along division lines
    Patent number: 10985066
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: April 20, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method using a laser beam dividing step
    Patent number: 10985067
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: April 20, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • WAFER PROCESSING METHOD
    Publication number: 20210111073
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.
    Type: Application
    Filed: October 6, 2020
    Publication date: April 15, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • WAFER PROCESSING METHOD
    Publication number: 20210111074
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.
    Type: Application
    Filed: October 6, 2020
    Publication date: April 15, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • IMAGE RECORDING METHOD AND IMAGE RECORDING SYSTEM
    Publication number: 20210094325
    Abstract: An image recording method includes determining whether a surface energy of a base material is less than 50 mN/m or greater than 50 mN/m; deciding a condition for drying a pretreatment liquid containing water and an aggregating agent as a condition A in which the mass ratio of the mass of the pretreatment liquid after being dried to the mass of the pretreatment liquid before being dried is 30% or greater and deciding a condition for drying the pretreatment liquid as a condition B in which the mass ratio thereof is less than 50% in a case where the surface energy is determined to be less than 50 mN/m and 50 mN/m or greater, respectively; applying the pretreatment liquid to the base material; drying the applied pretreatment liquid under the drying condition decided; and applying an ink containing water and a colorant to at least a part of the base material.
    Type: Application
    Filed: December 14, 2020
    Publication date: April 1, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Yusuke FUJII, Ayato SATO, Takeshi MIYATO
  • WAFER PROCESSING METHOD
    Publication number: 20210074588
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyolefin sheet side to push up each device chip through the polyolefin sheet and picking up each device chip from the polyolefin sheet.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 11, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • WAFER PROCESSING METHOD
    Publication number: 20210074589
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyester sheet side to push up each device chip through the polyester sheet and picking up each device chip from the polyester sheet.
    Type: Application
    Filed: September 9, 2020
    Publication date: March 11, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • ARTICULATED ROBOT AND METHOD OF ESTIMATING REDUCED STATE OF GAS IN GAS SPRING OF THE ARTICULATED ROBOT
    Publication number: 20210069919
    Abstract: A robot includes an arm supporting part, a rotary arm rotatably supported by the arm supporting part, a drive motor configured to rotate the rotary arm, a gas spring configured to reduce a load of the drive motor by supporting a load acting on the rotary arm and a controller. The controller determines that the rotary arm rotates, and estimates a reduced state of gas in the gas spring based on a comparison between an actual current value and a theoretical current value of the drive motor when the rotary arm rotates.
    Type: Application
    Filed: May 9, 2019
    Publication date: March 11, 2021
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventor: Yusuke FUJII
  • PRETREATMENT LIQUID FOR IMPERMEABLE MEDIUM, BASE MATERIAL FOR IMAGE RECORDING, METHOD OF PRODUCING BASE MATERIAL FOR IMAGE RECORDING, IMAGE RECORDING METHOD, AND INK SET
    Publication number: 20210054223
    Abstract: A pretreatment liquid for an impermeable medium is a pretreatment liquid including water, a resin, and an organic acid, in which a ratio of a content of the resin to a content of the organic acid is greater than 0 and less than 4 on a mass basis, and the organic acid is a compound represented by Formula 1. In Formula 1, l represents 1 or greater, m represents 0 or 1, n represents 1 or greater, and l+m+n is 2 or greater. R1, R2, R3, and R4 each independently represent a hydrogen atom, a hydroxyl group, a carboxy group, an amino group, or an alkyl group having 1 to 4 carbon atoms.
    Type: Application
    Filed: November 10, 2020
    Publication date: February 25, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Yusuke FUJII, Ayato SATO, Takeshi MIYATO
  • WAFER PROCESSING METHOD
    Publication number: 20210043513
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 11, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • WAFER PROCESSING METHOD
    Publication number: 20210043514
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 11, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • Wafer processing method
    Patent number: 10910269
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: February 2, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method
    Patent number: 10896850
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: January 19, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • MOVING OBJECT TRACKING APPARATUS, RADIOTHERAPY SYSTEM AND MOVING OBJECT TRACKING METHOD
    Publication number: 20210012500
    Abstract: The moving object tracking apparatus emphasizes an image with specific size in each of fluoroscopic images derived from two or more paired fluoroscopic radiographic devices, obtains a value indicating certainty degree of detecting a candidate position of the object to be tracked on the image subjected to the emphasizing process, extracts the candidate position based on the value indicating the certainty degree of detection, calculates a value indicating a correlation between the candidate position extracted from images picked up from two or more directions, and a position of the fluoroscopic radiation generator, detects the position of the object to be tracked based on the value indicating the certainty degree of detection, and the value indicating the correlation, and controls irradiation of radiation to an irradiation target based on the detected position of the object to be tracked.
    Type: Application
    Filed: December 5, 2019
    Publication date: January 14, 2021
    Inventors: Koichi MIYAZAKI, Toru UMEKAWA, Yusuke FUJII
  • WAFER PROCESSING METHOD
    Publication number: 20210013100
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 14, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • WAFER PROCESSING METHOD
    Publication number: 20210013101
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 14, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • Ink jet liquid composition and ink jet recording method
    Patent number: 10883010
    Abstract: An ink jet liquid composition contains an organic solvent, a polymerizable compound, a photopolymerization initiator, and a polyether-modified siloxane compound having a weight-average molecular weight of 3,000 or more, and the content of the organic solvent is 40% by mass or more and 90% by mass or less with respect to the total mass of the composition. In addition, an ink jet recording method using the ink jet liquid composition is provided.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: January 5, 2021
    Assignee: FUJIFILM CORPORATION
    Inventors: Yusuke Fujii, Tsutomu Umebayashi, Toshihiro Kamada
  • METHOD FOR DEPHOSPHORIZATION OF MOLTEN IRON, AND REFINING AGENT
    Publication number: 20200385830
    Abstract: When performing dephosphorization treatment of hot metal by adding a refining agent as a lime source and an oxygen source (dephosphorizing agent(s) and a gaseous oxygen source into the hot metal accommodated in a hot metal holding container, the refining agent used is a refining agent having an Ig-loss value of from 4.0% by mass to 35.0% by mass and including 60% by mass or more of quicklime.
    Type: Application
    Filed: December 15, 2017
    Publication date: December 10, 2020
    Applicant: JFE Steel Corporation
    Inventors: Yusuke Fujii, Yoshie Nakai, Mikihiro Mori, Takahiko Maeda, Naoki Kikuchi, Noritaka Nishiguchi
  • WAFER PROCESSING METHOD
    Publication number: 20200388537
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.
    Type: Application
    Filed: June 8, 2020
    Publication date: December 10, 2020
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • WAFER PROCESSING METHOD
    Publication number: 20200388536
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.
    Type: Application
    Filed: June 5, 2020
    Publication date: December 10, 2020
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE