Patents by Inventor Yusuke Fujii

Yusuke Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing method
    Patent number: 11251082
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: February 15, 2022
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Ink jet liquid composition and ink jet recording method
    Patent number: 11248136
    Abstract: Provided is an ink jet liquid composition including an organic solvent, a bifunctional urethane (meth)acrylate oligomer having a weight-average molecular weight of 2,000 to 15,000, a photopolymerization initiator, and a vinyl chloride-vinyl acetate copolymer, in which a content of the organic solvent is 40% by mass or more and 90% by mass or less with respect to a total mass of the liquid composition. Also provided is an ink jet recording method using the ink jet liquid composition.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: February 15, 2022
    Assignee: FUJIFILM CORPORATION
    Inventors: Tsutomu Umebayashi, Toshihiro Kamada, Yusuke Fujii
  • ARTICLE PROCESSING APPARATUS
    Publication number: 20210403254
    Abstract: An article processing apparatus includes: a configuration determination unit configured to determine a configuration of at least one transport unit including articles and stacked article groups each including a pallet, and at least one of the articles placed on the pallet, wherein first article groups are article groups excluding uppermost one of the stacked article groups; a palletizing mechanism configured to place the at least one of the articles on the pallet so as to form each of the stacked article groups; and a stacking mechanism configured to stack the article groups formed by the palletizing mechanism so as to form the transport unit, wherein the configuration determination unit is configured to determine the configuration of the at least one transport unit such that a load applied to each of the first article groups is smaller than a load index set to each of the first article groups.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 30, 2021
    Applicant: Daifuku Co., Ltd.
    Inventors: Kazutoshi ITO, Osamu FUTAMI, Tadasuke OGAWA, Atsushi MINOO, Yusuke FUJII
  • ARTICLE PROCESSING APPARATUS
    Publication number: 20210403190
    Abstract: An article processing apparatus includes: a configuration determination unit configured to determine a configuration of at least one transport unit including articles, and stacked article groups each including a pallet, and at least one of the articles placed on the pallet, wherein the at least one of the articles is placed on the pallet in a manner that allows a pallet of another article group to be placed thereon, excluding uppermost one of the stacked article groups; a palletizing mechanism configured to place the at least one of the articles on the pallet so as to form each of the article groups included in the transport unit whose configuration is determined by the configuration determination unit; and a stacking mechanism configured to stack the article groups formed by the palletizing mechanism so as to form the transport unit determined by the configuration determination unit.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 30, 2021
    Applicant: Daifuku Co., Ltd.
    Inventors: Kazutoshi ITO, Osamu FUTAMI, Tadasuke OGAWA, Atsushi MINOO, Yusuke FUJII
  • INKJET INK FOR IMPERMEABLE BASE MATERIAL, IMAGE RECORDING METHOD, AND METHOD OF PRODUCING LAMINATE
    Publication number: 20210403735
    Abstract: An inkjet ink for an impermeable base material includes water, a resin-coated pigment in which at least a part of the pigment is coated with a crosslinked resin, a solvent A which is an alkanediol compound having a boiling point of 180° C. to 200° C., and a solvent B which is at least one of a monoalcohol compound having a boiling point of 70° C. to 160° C. or a glycol monoether compound having a boiling point of 70° C. to 160° C. An image recording method includes applying of the inkjet ink for an impermeable base material to record an image.
    Type: Application
    Filed: September 2, 2021
    Publication date: December 30, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Ayato SATO, Yusuke FUJII, Takeshi MIYATO
  • INK SET AND IMAGE RECORDING METHOD
    Publication number: 20210388225
    Abstract: An ink set includes: an inkjet ink which contains a pigment, a resin dispersant, and water and in which the content of an organic solvent having a boiling point of higher than 210° C. is less than 1% by mass; and a maintenance liquid which contains water, a solvent MA, and a solvent MB, in which the solvent MA is an organic solvent formed of a hydrophilic portion such as —OH and a hydrophobic portion that is a portion other than the hydrophilic portion and having an MA value of 5.8 or less, the solvent MB is glycerin, ethylene glycol, or the like, and the content of the solvent MA is in a range of 0.5% by mass to 10% by mass with respect to a total amount of the maintenance liquid.
    Type: Application
    Filed: June 27, 2021
    Publication date: December 16, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Yusuke FUJII, Ayato SATO
  • Vehicle front-part structure
    Patent number: 11124135
    Abstract: A pair of floor-side extensions are provided in the vehicle width direction on the lower surface of at least one of a dash lower panel and a floor panel constituting the floor of a vehicle chamber so as to protrude downward in front of the battery unit front surface with a high voltage cable interposed between the pair of floor-side extension members. A pair of member-side extensions are provided so as to protrude upward at positions facing the pair of floor-side extensions in the vehicle front-and-rear direction on the rear end edge of a suspension member.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: September 21, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akihiro Yamada, Kenshi Tomiki, Yusuke Fujii, Satoshi Kasai
  • Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet
    Patent number: 11127633
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: September 21, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • POWER SUPPLY DEVICE
    Publication number: 20210288363
    Abstract: A power supply device includes battery cells each having a rectangular external shape, a separator disposed between the battery cells, a pair of end plates that are disposed on respective ends of a battery assembly in which the separator and the battery cells are stacked, and a bind bar that binds the pair of end plates. The separator has insulating rib parts that protrude from both surfaces of the separator, and the insulating rib parts of the separator stacked on each surface of the battery cell are stacked on each other on a bottom surface of the battery cell. The insulating rib parts are stacked on each other on the bottom surface of the battery cell by inserting an insertion rib provided in one of the stacked insulating rib parts into an insertion groove provided in the other of the stacked insulating rib parts.
    Type: Application
    Filed: May 9, 2017
    Publication date: September 16, 2021
    Applicant: SANYO Electric Co., Ltd.
    Inventors: Wataru Okada, Kosho Abe, Yusuke Fujii, Takeshi Nagane, Sho Ojima
  • METHOD FOR DESIGNING MOLD SHAPE AND METHOD FOR PRODUCING PRESSED PART
    Publication number: 20210260640
    Abstract: A preformed shape capable of suppressing occurrence of cracks and wrinkles in a metal sheet can be determined by simple means. A metal sheet is press formed into a three-dimensionally shaped component. A method therefor includes a first step of press forming the metal sheet into an intermediate component having a preformed shape including a shape of the three-dimensionally shaped component crushed under a load applying condition for applying load in a direction in which at least a part of the three-dimensionally shaped component is straightened and a second step of press forming the intermediate component into the three-dimensionally shaped component.
    Type: Application
    Filed: June 14, 2019
    Publication date: August 26, 2021
    Applicant: JFE Steel Corporation
    Inventors: Yusuke Fujii, Yuji Yamasaki
  • Wafer processing method including applying a polyester sheet to a wafer
    Patent number: 11069574
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: July 20, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method
    Patent number: 11062948
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: July 13, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method using a ring frame and a polyester sheet
    Patent number: 11056334
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip through the polyester sheet to push up each device chip, thereby picking up each device chip from the polyester sheet after performing the dividing step.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: July 6, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • PRETREATMENT LIQUID, INK SET, BASE MATERIAL FOR IMAGE RECORDING, METHOD OF PRODUCING BASE MATERIAL FOR IMAGE RECORDING, IMAGE RECORDING MATERIAL, AND IMAGE RECORDING METHOD
    Publication number: 20210197606
    Abstract: A pretreatment liquid is a pretreatment liquid to be used for a pretreatment that is performed on an impermeable base material before an image is recorded on the impermeable base material, containing an aggregating agent, an aqueous medium, and a resin, in which the resin has at least one selected from the group consisting of a structural unit (1), a structural unit (2), and a structural unit (3), and a glass transition temperature of the resin is ?40° C. or higher and lower than 100° C. In the formulae, R2 represents a hydrogen atom or a C1 to C4 alkyl group, A2 represents —NH— or —N(L4-Y4)—, L2 and L4 represent a divalent group or a single bond, L3 represents a divalent group, Y2 and Y4 represent a monovalent group such as an alkyl group, and Y3 represents a monovalent group such as —OH.
    Type: Application
    Filed: March 17, 2021
    Publication date: July 1, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Kenji SHIROKANE, Shoichiro KOBAYASHI, Yusuke FUJII
  • PRETREATMENT LIQUID, INK SET, BASE MATERIAL FOR IMAGE RECORDING, METHOD OF PRODUCING BASE MATERIAL FOR IMAGE RECORDING, IMAGE RECORDING MATERIAL, AND IMAGE RECORDING METHOD
    Publication number: 20210197605
    Abstract: A pretreatment liquid is a pretreatment liquid to be used for a pretreatment that is performed on an impermeable base material before an image is recorded on the impermeable base material, including a resin and an aqueous medium, in which the resin has at least one selected from the group consisting of a structural unit (1), and a structural unit (2), a glass transition temperature of the resin is ?40° C. or higher and lower than 100° C., and a content of an alkyl (meth)acrylate unit containing a C2 or more chain alkyl group in the resin is less than 5% by mass. In the formulae, R2 represents a hydrogen atom or a C1 to C4 alkyl group, A2 represents —NH— or —N(L4-Y4)—, L2 and L4 represent a divalent group or a single bond, L3 represents a divalent group, Y2 and Y4 represent a monovalent group such as an alkyl group, and Y3 represents a monovalent group such as —OH.
    Type: Application
    Filed: March 15, 2021
    Publication date: July 1, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Kenji SHIROKANE, Shoichiro KOBAYASHI, Yusuke FUJII
  • Wafer processing method including applying a polyester sheet to a wafer
    Patent number: 11049757
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each region of the polyester sheet corresponding to each device chip, pushing up each device chip from the polyester sheet side to pick up each device chip from the polyester sheet.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: June 29, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method including applying a polyester sheet to a wafer
    Patent number: 11049772
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: June 29, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Moving object tracking apparatus, radiotherapy system and moving object tracking method
    Patent number: 11049252
    Abstract: The moving object tracking apparatus emphasizes an image with specific size in each of fluoroscopic images derived from two or more paired fluoroscopic radiographic devices, obtains a value indicating certainty degree of detecting a candidate position of the object to be tracked on the image subjected to the emphasizing process, extracts the candidate position based on the value indicating the certainty degree of detection, calculates a value indicating a correlation between the candidate position extracted from images picked up from two or more directions, and a position of the fluoroscopic radiation generator, detects the position of the object to be tracked based on the value indicating the certainty degree of detection, and the value indicating the correlation, and controls irradiation of radiation to an irradiation target based on the detected position of the object to be tracked.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: June 29, 2021
    Assignee: HITACHI, LTD.
    Inventors: Koichi Miyazaki, Toru Umekawa, Yusuke Fujii
  • Lighting device
    Patent number: D927038
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: August 3, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Satoru Okagaki, Yusuke Fujii, Haruka Yamazaki, Muneharu Kuwata, Kuniko Kojima
  • Lighting device
    Patent number: D929012
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: August 24, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Satoru Okagaki, Yusuke Fujii, Haruka Yamazaki, Muneharu Kuwata, Kuniko Kojima