Patents by Inventor Yusuke Fujii

Yusuke Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHTING UNIT AND LIGHTING FIXTURE
    Publication number: 20210190279
    Abstract: A lighting unit includes a first light source to emit first light; and a diffusive body including a first incidence surface that allows the first light to enter, a diffusive part that includes nanoparticles, guides the entered first light and makes the first light be scattered by the nanoparticles into first scattered light, and an emission surface that emits the first scattered light, wherein the first incidence surface is formed on a first edge part of the diffusive body, the first scattered light is emitted from a first region of the emission surface, and a correlated color temperature of the first scattered light is higher than a correlated color temperature of the first light.
    Type: Application
    Filed: September 25, 2018
    Publication date: June 24, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yusuke FUJII, Satoru OKAGAKI
  • Wafer processing method
    Patent number: 11043421
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of cooling the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: June 22, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method
    Patent number: 11037813
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: June 15, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method using a ring frame with a polyester sheet with no adhesive layer
    Patent number: 11037814
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet in each region of the polyester sheet corresponding to each device chip, pushing up each device chip from the polyester sheet side to pick up each device chip from the polyester sheet.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: June 15, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method including applying a polyolefin sheet to a wafer
    Patent number: 11031234
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip through the polyolefin sheet to push up each device chip, thereby picking up each device chip from the polyolefin sheet after performing the dividing step.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: June 8, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Vehicle front-part structure
    Patent number: 11027782
    Abstract: A battery unit is positioned under the floor of a vehicle chamber. A battery-side extension is provided on the lower surface of the front part of the battery unit case. A member-side extension member is provided, on the rear part of a suspension member, at a position facing the battery-side extension in the vehicle front-and-rear direction.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: June 8, 2021
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yusuke Fujii, Yoshihito Tomizawa
  • Wafer processing method including applying a polyester sheet to a wafer
    Patent number: 11024543
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: June 1, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • PARTICLE THERAPY SYSTEM
    Publication number: 20210154495
    Abstract: A particle therapy system includes an accelerator 1 which generates a particle beam for extraction, an irradiation apparatus 21 which irradiates the particle beam to an irradiation target 26, a gantry 18 which rotates together with the irradiation apparatus 21, and an MRI apparatus 50 which rotates together with the gantry 18. The MRI apparatus 50 includes a magnetic circuit composed of an iron core 60 and a plurality of coils 61 serving as a magnetic flux source. The iron core 60 includes two oppositely disposed magnetic poles 63A and 63B, and a return yoke 64 for connecting the magnetic poles 63A and 63B. The magnetic poles 63A, 63B have cavities 65A, 65B. The particle beam passing through the cavity 65A is irradiated to the irradiation target 26.
    Type: Application
    Filed: April 11, 2019
    Publication date: May 27, 2021
    Inventors: Yusuke FUJII, Ryuya ANDO, Manabu AOKI, Kikuo UMEGAKI, Shinichi SHIMIZU, Taeko MATSUURA, Hiroki SHIRATO
  • Wafer processing method for dividing a wafer along predefined division lines using polyester sheet
    Patent number: 11018058
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet in each region of the polyester sheet corresponding to each device chip, pushing up each device chip from the polyester sheet side to pick up each device chip from the polyester sheet.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: May 25, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method using a ring frame and a polyester sheet
    Patent number: 11018043
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 25, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method using a ring frame and a polyolefin sheet
    Patent number: 11011407
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: May 18, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • WAFER PROCESSING METHOD
    Publication number: 20210143064
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 13, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • WAFER PROCESSING METHOD
    Publication number: 20210143063
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 13, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • Wafer processing method for dividing a wafer along predefined division lines
    Patent number: 11004744
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: May 11, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Printing pretreatment liquid, base material for printing, method of producing base material for printing, ink set, image recording method, and image recorded material
    Patent number: 11001726
    Abstract: Provided are a printing pretreatment liquid for a polyester base material including a polymer which has a Hansen solubility parameter value of 18 MPa0.5 to 30 MPa0.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 11, 2021
    Assignee: FUJIFILM CORPORATION
    Inventors: Kiyotaka Fukagawa, Akinori Sugishima, Yusuke Fujii
  • Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet
    Patent number: 10998232
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: May 4, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method including applying a polyolefin sheet to a wafer
    Patent number: 10991624
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: April 27, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Wafer processing method including applying a polyester sheet to a wafer
    Patent number: 10991587
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: April 27, 2021
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • WAFER PROCESSING METHOD
    Publication number: 20210118736
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.
    Type: Application
    Filed: October 13, 2020
    Publication date: April 22, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
  • WAFER PROCESSING METHOD
    Publication number: 20210118737
    Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.
    Type: Application
    Filed: October 13, 2020
    Publication date: April 22, 2021
    Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE