Patents by Inventor Yusuke Takagi
Yusuke Takagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10279653Abstract: The present invention aims to suppress a coolant from bypassing a non-cooling unit without lowering the productivity. The power converter according to the present invention includes: a power semiconductor module; and a flow path forming body having a flow path in which the power semiconductor module is disposed and an opening which is connected with the flow path, wherein the power semiconductor module includes a first fin formed on one surface and a second fin formed on another surface which faces the one surface so as to sandwich the semiconductor element, the flow path forming body has a first coolant control unit and a second coolant control unit which are arranged so as to sandwich the first fin, the first coolant control unit and the second coolant control unit are formed to be overlapped with a region of the power semiconductor module where the first fin is not formed, and a first flow path is formed along the first coolant control unit and the second coolant control unit.Type: GrantFiled: October 7, 2015Date of Patent: May 7, 2019Assignee: Hitachi Automotive Systems, Ltd.Inventors: Yusuke Takagi, Takahiro Shimura, Takashi Kuboki, Akira Matsushita
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Publication number: 20190123659Abstract: Reliability of a power converter is improved while suppressing an increase in size and an increase in cost of the power converter. A power converter according to the present invention includes a power semiconductor module and a flow path forming body which contains the power semiconductor module and forms a flow path through which a refrigerant flows. In the flow path forming body, a first opening which communicates one surface of the flow path forming body with the flow path is formed, and in the power semiconductor module, a first sealing surface which is formed along an insertion direction of the power semiconductor module into the flow path and faces the flow path forming body and a second sealing surface which is formed along the insertion direction and faces the flow path forming body are formed.Type: ApplicationFiled: March 2, 2017Publication date: April 25, 2019Inventors: Yutaka OKUBO, Tokihito SUWA, Yusuke TAKAGI
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Publication number: 20180303001Abstract: A power semiconductor device includes a first power semiconductor element, a second power semiconductor element, a first conductor plate, a second conductor plate, a third conductor plate, and a fourth conductor plate. The power semiconductor device also includes a DC positive terminal, a DC negative terminal, an AC terminal, and a sealing member that integrally seals the first conductor plate, the second conductor plate, the third conductor plate, and the fourth conductor plate. Each of the DC positive terminal, the DC negative terminal, and the AC terminal has a cut section formed by cutting a tie bar that integrally couples the DC positive terminal, the DC negative terminal, and the AC terminal.Type: ApplicationFiled: June 25, 2018Publication date: October 18, 2018Inventors: Tokihito SUWA, Yujiro KANEKO, Yusuke TAKAGI, Shinichi FUJINO, Takahiro SHIMURA
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Patent number: 10054064Abstract: An actuator mounting structure of a variable compression ratio internal combustion engine includes: a variable compression ratio mechanism arranged to vary an engine compression ratio in accordance with a rotational position of a control shaft; an actuator arranged to drivingly rotate the control shaft, the actuator being fixed on an actuator mounting portion provided to a side wall of a main body of the engine by using a plurality of fixing bolts, and a rigidity improvement section arranged to improve a mounting rigidity of the actuator to the actuator mounting portion, and which is provided within an inter-bolt distance between two bolts of the plurality of the fixing bolts, which are located on the both sides in a direction of a crank shaft.Type: GrantFiled: June 3, 2013Date of Patent: August 21, 2018Assignee: NISSAN MOTOR CO., LTD.Inventors: Yoshiaki Tanaka, Ryosuke Hiyoshi, Yusuke Takagi, Katsutoshi Nakamura
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Patent number: 10037930Abstract: An object of the present invention is to provide a power semiconductor module that can secure a satisfactory cooling without expanding the size of a case component. In the power semiconductor module according to the present invention, a frame case includes a front surface, a back surface, and a pair of side surfaces and formed with an opening part in at least one of the front surface and the back surface. A metal base is inserted into the opening part of the frame case. A frame case is provided with a joining part FW to which the peripheral part of the metal base and the peripheral part of the opening part of the frame case are joined. A first concaved part and a second concaved part are formed respectively in each of a pair of side surfaces of the frame case.Type: GrantFiled: May 11, 2015Date of Patent: July 31, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takashi Kume, Takahiro Shimura, Akira Matsushita, Shinichi Fujino, Yusuke Takagi
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Patent number: 10034401Abstract: A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.Type: GrantFiled: September 17, 2015Date of Patent: July 24, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Tokihito Suwa, Yujiro Kaneko, Yusuke Takagi, Shinichi Fujino, Takahiro Shimura
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Patent number: 9960147Abstract: A power module includes a base plate, first, second, and third semiconductor chips. At least one of a third edge or fourth edge of the first semiconductor chip is disposed adjacent to a side end of the base plate. Among a half of a distance from a first edge of the first semiconductor chip to one edge of the second semiconductor chip, a half of a distance from a second edge of the first semiconductor chip to one edge of the third semiconductor chip, and a distance from the third edge or fourth edge of the first semiconductor chip disposed adjacent to the side end of the base plate to the side end of the base plate, a length of a solder fillet formed on the edge of the first semiconductor chip at the shortest distance is formed in the shortest length.Type: GrantFiled: December 10, 2015Date of Patent: May 1, 2018Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Shiro Yamashita, Yusuke Takagi, Takahiro Shimura
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Publication number: 20180005986Abstract: A power module includes a base plate, first, second, and third semiconductor chips. At least one of a third edge or fourth edge of the first semiconductor chip is disposed adjacent to a side end of the base plate. Among a half of a distance from a first edge of the first semiconductor chip to one edge of the second semiconductor chip, a half of a distance from a second edge of the first semiconductor chip to one edge of the third semiconductor chip, and a distance from the third edge or fourth edge of the first semiconductor chip disposed adjacent to the side end of the base plate to the side end of the base plate, a length of a solder fillet formed on the edge of the first semiconductor chip at the shortest distance is formed in the shortest length.Type: ApplicationFiled: December 10, 2015Publication date: January 4, 2018Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Shiro YAMASHITA, Yusuke TAKAGI, Takahiro SHIMURA
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Publication number: 20170313159Abstract: The present invention aims to suppress a coolant from bypassing a non-cooling unit without lowering the productivity. The power converter according to the present invention includes: a power semiconductor module; and a flow path forming body having a flow path in which the power semiconductor module is disposed and an opening which is connected with the flow path, wherein the power semiconductor module includes a first fin formed on one surface and a second fin formed on another surface which faces the one surface so as to sandwich the semiconductor element, the flow path forming body has a first coolant control unit and a second coolant control unit which are arranged so as to sandwich the first fin, the first coolant control unit and the second coolant control unit are formed to be overlapped with a region of the power semiconductor module where the first fin is not formed, and a first flow path is formed along the first coolant control unit and the second coolant control unit.Type: ApplicationFiled: October 7, 2015Publication date: November 2, 2017Applicant: Hitachi Automotive Systems, Ltd.Inventors: Yusuke TAKAGI, Takahiro SHIMURA, Takashi KUBOKI, Akira MATSUSHITA
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Publication number: 20170302191Abstract: A power converter device includes a double-sided electrode module in which an electrical wiring board and a power semiconductor element are molded with a resin material. The power converter device also includes a heat dissipating base disposed on both sides of the double-sided electrode module and directly contacting cooling medium. The power converter device also includes a module fixture which presses the heat dissipating base in a state of contact with the heat dissipating base. The module fixture is configured to support a circuit board.Type: ApplicationFiled: June 28, 2017Publication date: October 19, 2017Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
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Patent number: 9729076Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.Type: GrantFiled: June 28, 2016Date of Patent: August 8, 2017Assignee: Hitachi Automotive Systems, Ltd.Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
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Patent number: 9693466Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.Type: GrantFiled: February 16, 2012Date of Patent: June 27, 2017Assignee: Yazaki CorporationInventors: Akira Harao, Mototatsu Matsunaga, Yusuke Takagi, Akinori Saneto
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Publication number: 20170162472Abstract: An object of the present invention is to provide a power semiconductor module that can secure a satisfactory cooling without expanding the size of a case component. In the power semiconductor module according to the present invention, a frame case includes a front surface, a back surface, and a pair of side surfaces and formed with an opening part in at least one of the front surface and the back surface. A metal base is inserted into the opening part of the frame case. A frame case is provided with a joining part FW to which the peripheral part of the metal base and the peripheral part of the opening part of the frame case are joined. A first concaved part and a second concaved part are formed respectively in each of a pair of side surfaces of the frame case.Type: ApplicationFiled: May 11, 2015Publication date: June 8, 2017Applicant: HItachi Automotive Systems, Ltd.Inventors: Takashi KUME, Takahiro SHIMURA, Akira MATSUSHITA, Shinichi FUJINO, Yusuke TAKAGI
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Patent number: 9497873Abstract: Sealing force between a metal case and a power semiconductor module is improved. In a power semiconductor module 3, peripheral side surfaces of power semiconductor devices 31U and 31L and conductor plates 33 to 36 are integrated by being covered with a first sealing resin 6. An oxide layer (rough surface layer) 46 is formed on an inner surface of a metal case 40. A fluid resin material is injected into a space S between the oxide layer 46 provided to the metal case 40 and a power semiconductor module 30, and then a second sealing resin 52 is formed. The second sealing resin 52 fills dents of the oxide layer 46, and therefore sealing force improves.Type: GrantFiled: July 10, 2013Date of Patent: November 15, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Yusuke Takagi, Akira Matsushita, Hideto Yoshinari, Nobutake Tsuyuno
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Patent number: 9476366Abstract: There are provided a variable compression-ratio mechanism (20) capable of varying an engine compression ratio in accordance with a rotational position of a control shaft (24); a speed reducer (44) configured to reduce in speed a rotational power of an actuator and transmit the speed-reduced rotational power to the control shaft (24); and a speed-reducer accommodating case (43) accommodating the speed reducer (44). An input shaft of the speed reducer (44) which is connected to the actuator has a shaft center line extending along a horizontal direction, and at least a part of the input shaft is kept under a lubricating oil retained in the speed-reducer accommodating case (43). The input shaft of the speed reducer (44) is swung by a predetermined swing angle to avoid inadequate lubrication of the input shaft of the speed reducer (44), during an operating state where the engine compression ratio is maintained constant.Type: GrantFiled: June 3, 2013Date of Patent: October 25, 2016Assignee: NISSAN MOTOR CO., LTD.Inventors: Yoshiaki Tanaka, Ryosuke Hiyoshi, Yusuke Takagi, Katsutoshi Nakamura
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Publication number: 20160308456Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.Type: ApplicationFiled: June 28, 2016Publication date: October 20, 2016Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
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Patent number: 9422872Abstract: It is an object to increase the reliability and durability by minimizing mixing/entry of foreign matter (contaminants) into a speed reducer. The speed reducer is provided for reducing rotation of an actuator of a variable compression ratio mechanism and for transmitting the reduced rotation to a control shaft of the variable compression ratio mechanism. The actuator and the speed reducer are attached to a sidewall of an engine main body with a housing therebetween. An oil filter, which removes contaminants from within lubricating oil, is attached to the housing with an oil-passage-forming body therebetween. A portion of the lubricating oil supplied from the oil filter immediately after having been filter-purified is supplied via a bypass oil passage, formed in the oil-passage-forming body and the housing, into a speed-reducer accommodation chamber of the housing.Type: GrantFiled: October 9, 2012Date of Patent: August 23, 2016Assignee: NISSAN MOTOR CO., LTD.Inventors: Ryosuke Hiyoshi, Yoshiaki Tanaka, Yusuke Takagi
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Patent number: 9407163Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.Type: GrantFiled: December 17, 2014Date of Patent: August 2, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
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Patent number: D759589Type: GrantFiled: March 18, 2015Date of Patent: June 21, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takahiro Shimura, Yusuke Takagi, Akira Matsushita, Yosei Hara
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Patent number: D769189Type: GrantFiled: June 29, 2015Date of Patent: October 18, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takahiro Shimura, Yusuke Takagi, Akira Matsushita, Yosei Hara