Patents by Inventor Yusuke Takagi
Yusuke Takagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140369014Abstract: A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.Type: ApplicationFiled: August 22, 2012Publication date: December 18, 2014Applicant: YAZAKI CORPORATIONInventor: Yusuke Takagi
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Patent number: 8888168Abstract: There is provided a front vehicle body structure. The structure includes a front-side frame which is disposed on each side of a power unit in a vehicle width direction, and extends in a fore-and-aft direction; and a load-transfer member disposed outside in the width direction, near a front-end of the front-side frame, a rear end of the load-transfer member being fixed to a certain position of a outer lateral side of the front-side frame in the width direction, the certain position being located forwardly of a center of the power unit in the fore-and-aft direction, a front-end of the load-transfer member being disposed forwardly and outwardly of the rear end. A load to the front-end of the load-transfer member in a rearward direction of the vehicle causes a vicinity area of the fixed position to be displaced in a direction in which the vicinity area approaches the power unit.Type: GrantFiled: March 15, 2013Date of Patent: November 18, 2014Assignee: Fuji Jukogyo Kabushiki KaishaInventors: Mitsumasa Kuwabara, Hiroyuki Matsuda, Yutaka Miyata, Yusuke Takagi, Tomohiro Hosokawa
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Publication number: 20140334109Abstract: An electronic component module includes a wiring board on which at least one electronic component is mounted, an outer layer portion that is made of prepreg and covers the wiring board so that all of the at least one mounted electronic component is not exposed, and a terminal portion that is exposed from the outer layer portion to the outside and is configured to electrically connected to a mating connection member.Type: ApplicationFiled: November 22, 2012Publication date: November 13, 2014Applicant: YAZAKI CORPORATIONInventor: Yusuke Takagi
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Publication number: 20140290625Abstract: It is an object to increase the reliability and durability by minimizing mixing/entry of foreign matter (contaminants) into a speed reducer. The speed reducer is provided for reducing rotation of an actuator of a variable compression ratio mechanism and for transmitting the reduced rotation to a control shaft of the variable compression ratio mechanism. The actuator and the speed reducer are attached to a sidewall of an engine main body with a housing therebetween. An oil filter, which removes contaminants from within lubricating oil, is attached to the housing with an oil-passage-forming body therebetween. A portion of the lubricating oil supplied from the oil filter immediately after having been filter-purified is supplied via a bypass oil passage, formed in the oil-passage-forming body and the housing, into a speed-reducer accommodation chamber of the housing.Type: ApplicationFiled: October 9, 2012Publication date: October 2, 2014Inventors: Ryosuke Hiyoshi, Yoshiaki Tanaka, Yusuke Takagi
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Patent number: 8847374Abstract: A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes.Type: GrantFiled: September 5, 2011Date of Patent: September 30, 2014Assignee: Hitachi Automotive Systems, Ltd.Inventors: Eiichi Ide, Shinji Hiramitsu, Hiroshi Hozoji, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama, Akira Matsushita, Yusuke Takagi
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Patent number: 8726858Abstract: A variable compression ratio internal combustion engine basically has a main engine body and a variable compression ratio mechanism. A housing is attached to an outside wall of the main engine body to support an actuator. The variable compression ratio mechanism varies an engine compression ratio according to a rotational position of a first control shaft by the actuator. A second control shaft links the actuator to the first control shaft. A bearing includes a pair of split bearing bodies that rotatably holds and supports the second control shaft on the housing. The split bearing body that is farther from the main engine body has higher in rigidity than the housing. The bearing is fixed to the side wall of the main engine body by fixing bolts that pass through both of the split bearing bodies and thread into the side wall of the main engine body.Type: GrantFiled: April 3, 2013Date of Patent: May 20, 2014Assignee: Nissan Motor Co., Ltd.Inventors: Ryosuke Hiyoshi, Yoshiaki Tanaka, Yusuke Takagi
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Patent number: 8659130Abstract: A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate.Type: GrantFiled: April 26, 2011Date of Patent: February 25, 2014Assignee: Hitachi Automotive Systems, Ltd.Inventors: Yusuke Takagi, Kaoru Uchiyama, Tokihito Suwa, Kinya Nakatsu, Takeshi Tokuyama, Shinji Hiramitsu
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Publication number: 20130320709Abstract: There is provided a front vehicle body structure. The structure includes a front-side frame which is disposed on each side of a power unit in a vehicle width direction, and extends in a fore-and-aft direction; and a load-transfer member disposed outside in the width direction, near a front-end of the front-side frame, a rear end of the load-transfer member being fixed to a certain position of a outer lateral side of the front-side frame in the width direction, the certain position being located forwardly of a center of the power unit in the fore-and-aft direction, a front-end of the load-transfer member being disposed forwardly and outwardly of the rear end. A load to the front-end of the load-transfer member in a rearward direction of the vehicle causes a vicinity area of the fixed position to be displaced in a direction in which the vicinity area approaches the power unit.Type: ApplicationFiled: March 15, 2013Publication date: December 5, 2013Applicant: Fuji Jukogyo Kabushiki KaishaInventors: Mitsumasa KUWABARA, Hiroyuki MATSUDA, Yutaka MIYATA, Yusuke TAKAGI, Tomohiro HOSOKAWA
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Publication number: 20130306036Abstract: A variable compression ratio internal combustion engine basically has a main engine body and a variable compression ratio mechanism. A housing is attached to an outside wall of the main engine body to support an actuator. The variable compression ratio mechanism varies an engine compression ratio according to a rotational position of a first control shaft by the actuator. A second control shaft links the actuator to the first control shaft. A bearing includes a pair of split bearing bodies that rotatably holds and supports the second control shaft on the housing. The split bearing body that is farther from the main engine body has higher in rigidity than the housing. The bearing is fixed to the side wall of the main engine body by fixing bolts that pass through both of the split bearing bodies and thread into the side wall of the main engine body.Type: ApplicationFiled: April 3, 2013Publication date: November 21, 2013Applicant: Nissan Motor Co., Ltd.Inventors: Ryosuke HIYOSHI, Yoshiaki TANAKA, Yusuke TAKAGI
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Publication number: 20130263816Abstract: A multi-link internal combustion engine generally includes a cylinder block, an oil pan mounted to the undersurface of the cylinder block to define a crank chamber, the oil pan being formed with a shallow bottom portion and a deep bottom portion for storing oil. The multi-link internal combustion engine further includes a multi-link, piston-crank mechanism disposed in the crank chamber, a pivotal link member of the piston-crank mechanism pivotal about a pivotal fulcrum located on the side of oil pan; and an oil guide wall provided on the shallow bottom portion in the crank chamber for guiding the oil displaced due to the movement of the pivotal link member to the side of deep bottom portion.Type: ApplicationFiled: April 3, 2013Publication date: October 10, 2013Applicant: Nissan Motor Co., Ltd.Inventors: Yusuke Takagi, Yoshiaki Tanaka, Katsutoshi Nakamura
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Patent number: 8521202Abstract: A mobile station device, which communicates with a base station device, includes a control signal generator that initiates or terminates a cell search based on a reception quality value of a radio wave transmitted from the base station device, and a moving speed of the mobile station device.Type: GrantFiled: November 26, 2008Date of Patent: August 27, 2013Assignee: Sharp Kabushiki KaishaInventors: Shusaku Fukumoto, Keiji Hikoso, Yusuke Takagi
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Publication number: 20130175678Abstract: A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes.Type: ApplicationFiled: September 5, 2011Publication date: July 11, 2013Applicant: Hitachi Automotive Systems, Ltd.Inventors: Eiichi Ide, Shinji Hiramitsu, Hiroshi Hozoji, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama, Akira Matsushita, Yusuke Takagi
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Publication number: 20130062751Abstract: A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate.Type: ApplicationFiled: April 26, 2011Publication date: March 14, 2013Inventors: Yusuke Takagi, Kaoru Uchiyama, Tokihito Suwa, Kinya Nakatsu, Takeshi Tokuyama, Shinji Hiramitsu
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Publication number: 20120320645Abstract: A power converter which has a power module allowing supply and cutoff of main current, and a driver module controlling supply and cutoff of the main current allowed by the power module includes: a high potential side semiconductor device which allows supply and cutoff of the main current on the high potential side of the power module; a low potential side semiconductor device which allows supply and cutoff of the main current on the low potential side of the power module, and is connected with the high potential side semiconductor device in series; plural power module side wirings connected with respective electrodes contained in the high potential side semiconductor device and the low potential side semiconductor device, and disposed adjacent to each other substantially on the same plane as the power module in the order of applied potentials with a connection end between the plural power module side wirings and the driver module located along the end of the power module; plural driver module side wirings proType: ApplicationFiled: August 19, 2010Publication date: December 20, 2012Applicant: Hitachi Automotive Systems, Ltd.Inventors: Shinichi Fujino, Yusuke Takagi, Takuma Hakuto
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Publication number: 20120211266Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.Type: ApplicationFiled: February 16, 2012Publication date: August 23, 2012Applicant: Yazaki CorporationInventors: Akira Harao, Mototatsu Matsunaga, Yusuke Takagi, Akinori Saneto
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Publication number: 20110310585Abstract: A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.Type: ApplicationFiled: June 20, 2011Publication date: December 22, 2011Applicant: Hitachi Automotive Systems, Ltd.Inventors: Tokihito SUWA, Yujiro Kaneko, Yusuke Takagi, Shinichi Fujino, Takahiro Shimura
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Publication number: 20110299265Abstract: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.Type: ApplicationFiled: October 30, 2009Publication date: December 8, 2011Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
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Publication number: 20100261496Abstract: A mobile station device, which communicates with a base station device, includes a control signal generator that initiates or terminates a cell search based on a reception quality value of a radio wave transmitted from the base station device, and a moving speed of the mobile station device.Type: ApplicationFiled: November 26, 2008Publication date: October 14, 2010Inventors: Shusaku Fukumoto, Keiji Hikoso, Yusuke Takagi
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Patent number: D651170Type: GrantFiled: January 27, 2010Date of Patent: December 27, 2011Assignee: Hitachi Automotive Systems, Ltd.Inventors: Masashi Yura, Shinichi Fujino, Yusuke Takagi, Toshiya Satoh, Kinya Nakatsu, Takeshi Tokuyama
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Patent number: D651565Type: GrantFiled: January 27, 2010Date of Patent: January 3, 2012Assignee: Hitachi Automotive Systems, Ltd.Inventors: Masashi Yura, Shinichi Fujino, Yusuke Takagi, Toshiya Satoh, Kinya Nakatsu, Takeshi Tokuyama