Abstract: A defect inspection method and device for irradiating a linear region on a surface-patterned sample mounted on a table, with illumination light from an inclined direction to the sample, next detecting in each of a plurality of directions an image of the light scattered from the sample irradiated with the illumination light, then processing signals obtained by the detection of the images of the scattered light, and thereby detecting a defect present on the sample; wherein the step of detecting the scattered light image in the plural directions is performed through oval shaped lenses in which elevation angles of the optical axes thereof are different from each other, within one plane perpendicular to a plane formed by the normal to the surface of the table on which to mount the sample and the longitudinal direction of the linear region irradiated with the irradiation light.

Abstract: In optical dark field defect inspection, the present invention provides including: condensing laser emitted from a light source in a line shape; reflecting the laser, with a mirror; irradiating the reflected laser via an objective lens to a sample placed on a table from a vertical direction; condensing reflected scattered light from the sample with the objective lens; shielding diffraction light occurred from a periodical pattern formed on the sample, in the reflected scattered light from the sample and scattered light occurred from the mirror, with a spatial filter; receiving the reflected scattered light from the sample, not shielded with the spatial filter, with an imaging lens, and forming an image of the reflected scattered light; detecting the image of the reflected scattered light; and processing a detection signal obtained by detecting the image of the reflected scattered light and detecting a defect on the sample.

Abstract: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.

Abstract: detect a fine defect in reviewing To review a fine defect detected by another inspection apparatus, there is disclosed a method for reviewing a defect including a light capturing step that illuminates a sample with light under plural optical conditions, while varying only at least one of illumination conditions, sample conditions, or detection conditions, and detects plural lights scattering from the sample; a signal obtaining step that obtains plural signals based on the lights detected; and a processing step that discriminates a defect from noise according to a waveform characteristic quantity, an image characteristic quantity, or a value characteristic quantity created using the signals and derives the coordinates of defect.

Abstract: A defect inspection device inspecting a sample includes a movable table on which the sample as an inspection object and a pattern chip are mounted, an illumination light irradiation unit which irradiates a surface of the sample or a surface of the pattern chip with linearly-formed illumination light, a detection optical system section where a plurality of detection optical systems are disposed at a plurality of positions above the table and which detect images of scattered light generated from the sample, and a signal processing unit which processes detected signals to detect a defect of the sample surface, and a plurality of repeating patterns for generating the scattered light according to positions of the objective lenses of the plurality of detection optical systems of the detection optical system section when the linearly-formed illumination light is irradiated by the illumination light irradiation unit are periodically formed in the pattern chip.

Abstract: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

Abstract: To detect a bridge defect between lines of a line pattern formed on a sample at pitches narrower than the wavelength of inspection light, a defect inspection device is configured to comprise: a light source which emits laser; a vertical illumination unit which applies the laser to the sample from a vertical direction via an objective lens by converting the laser into linearly polarized light by using a polarization conversion unit in a state polarized in a direction orthogonal to the longitudinal direction of the line pattern; an oblique illumination unit which applies the laser to the sample from an oblique direction; a detection optical unit including an optical filter which selectively transmits a scattered light component from the defect by converting the polarization state of the reflected/scattered light; and a signal processing unit which detects the defect on the sample by processing a detection signal.

Abstract: A defect-inspection device includes an irradiation unit having an objective-pupil-optical unit that allows illumination light linearly condensed by a first light-condensing unit to pass through, and an objective lens that allows the illumination light having passed through the objective-pupil-optical unit to pass through; an irradiation-position-control unit that controls a passing position of the illumination light in the objective-pupil-optical unit disposed at a pupil surface of the objective lens; a detection unit having a second light-condensing unit that condenses light irradiated by the irradiation unit and generated from a sample, a specular-reflection light-blocking unit that blocks specular-reflection light from the sample and light components generated near the pupil surface among the light beams condensed by the second light-condensing unit, and an image-forming unit that images the light that is condensed by the second light-condensing unit and is not blocked by the specular-reflection light-bloc

Abstract: When multiple kinds of bacterial colonies are present in a petri dish and, for example, a drug tolerance is to be measured, harvesting of mixed colonies of different types of bacteria makes it impossible to accurately determine the drug tolerance. Also, it is required to improve the throughput of a device for harvesting a bacterial colony. From images illuminated from multiple directions, isolating bacterial colonies are automatically extracted. Next, the image feature amounts are calculated from the multiple images that are illuminated from multiple directions and colonies are grouped depending on the feature amounts. Then, bacterial colonies to be harvested are determined based on the results of the grouping.

Abstract: To detect an infinitesimal defect, highly precisely measure the dimensions of the detect, a detect inspection device is configured to comprise: a irradiation unit which irradiate light in a linear region on a surface of a sample; a detection unit which detect light from the linear region; and a signal processing unit which processes a signal obtained by detecting light and detecting a defect. The detection unit includes: an optical assembly which diffuses the light from the sample in one direction and forms an image in a direction orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the light diffused in the one direction and imaged in the direction orthogonal to the one direction, adds output signals of each of the detection pixels aligned in the direction in which the light is diffused, and outputs same.

Abstract: A defect inspection device has: an illumination optical system which irradiates a predetermined region of an inspection target with illumination light; a detection optical system which has a detector provided with a plurality of pixels by which scattered light from the predetermined region of the inspection target due to illumination light from the illumination optical system can be detected; and a signal processing portion which is provided with a correction portion which corrects pixel displacement caused by change in a direction perpendicular to a surface of the inspection target with respect to a detection signal based on the scattered light detected by the detector of the detection optical system, and a defect determination portion which determines a defect on the surface of the inspection target based on the detection signal corrected by the correction portion.

Abstract: To enable the detection of a more minute defect with a defect detection device, the defect inspection device is provided with: an illumination light irradiating section that irradiates illumination light on a linear area of a specimen from an inclined direction; a detection optical system section provided with multiple detection optical systems that comprise objective lenses and two-dimensional detectors, said objective lenses being placed in a direction substantially orthogonal to the length direction of the linear area, being placed in a surface that contains a normal line to the specimen front surface, and condensing scattered light generated from the linear area on the specimen, and said two-dimensional detectors detecting the scattered light condensed by the objective lenses; and a signal processing section that processes a signal detected by the detection optical system section and detects the defect on the specimen.

Abstract: An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.

Abstract: A defect inspection apparatus includes: a seed light generator including a pulse signal generator that generates a pulse signal and a polarization modulator that outputs pulse light of any one of two polarization states orthogonal to each other in synchronization with the pulse signal output from the pulse signal generator; a wavelength converting unit including a branching mechanism that branches the pulse light output by the polarization modulator of the seed light generator using polarization and a converting unit that wavelength-converts the pulse light branched by the branching mechanism into beams of two different wavelengths, respectively; an illumination optical system that illuminates a surface of an inspected target material with the beams of the two different wavelengths converted by the wavelength converting unit; a detection optical system including a detecting unit that detects light generated by the beams of the two different wavelengths illuminated by the illumination optical system; and a sig

Abstract: In order to enable inspections to be conducted at a sampling rate higher than the pulse oscillation frequency of a pulsed laser beam emitted from a laser light source, without damaging samples, a defect inspection method is disclosed, wherein: a single pulse of a pulsed laser beam emitted from the laser light source is split into a plurality of pulses; a sample is irradiated with this pulse-split pulsed laser beam; scattered light produced by the sample due to the irradiation is focused and detected; and defects on the sample are detected by using information obtained by focusing and detecting the scattered light from the sample. Said defect inspection method is configured such that the splitting a single pulse of the pulsed laser beam into a plurality of pulses is controlled in such a manner that the peak values of the split pulses are substantially uniform.

Abstract: A defect inspection method includes: illuminating an area on surface of a specimen as a test object under a specified illumination condition; scanning a specimen to translate and rotate the specimen; detecting scattering lights to separate each of scattering lights scattered in different directions from the illuminated area on the specimen into pixels to be detected according to a scan direction at the scanning a specimen and a direction approximately orthogonal to the scan direction; and processing to perform an addition process on each of scattering lights that are detected at the step and scatter approximately in the same direction from approximately the same area of the specimen, determine presence or absence of a defect based on scattering light treated by the addition process, and compute a size of the determined defect using at least one of the scattering lights corresponding to the determined defect.

Abstract: The X-ray inspection device includes: an X-ray source with a focal spot size greater than the diameter of a defect for irradiating a sample with X-rays; an X-ray TDI detector arranged near the sample and having long pixels in a direction parallel to the scanning direction of the sample for detecting the X-rays emitted by the X-ray source and passing through the sample as an X-ray transmission image; and a defect-detecting unit for detecting defects based on the X-ray transmission image detected by the X-ray TDI detector.

Abstract: A defect inspection method and device for irradiating a linear region on a surface-patterned sample mounted on a planarly movable table, with illumination light from an inclined direction relative to a direction of a line normal to the sample, next detecting in each of a plurality of directions an image of the light scattered from the sample irradiated with the illumination light, then processing signals obtained by the detection of the images of the scattered light, and thereby detecting a defect present on the sample; wherein the step of detecting the scattered light image in the plural directions is performed through elliptical lenses in which elevation angles of the optical axes thereof are different from each other, within one plane perpendicular to a plane formed by the normal to the surface of the table on which to mount the sample and the longitudinal direction of the linear region irradiated with the irradiation light, the elliptical lenses being formed of circular lenses having left and right portio

Abstract: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.

Abstract: Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.