Abstract: A sensor apparatus includes: a sensor panel that includes an input operation surface and is configured to detect positional coordinates of a detection object that comes into contact with the input operation surface; a casing; and a pressure-sensitive sensor that includes a first electrode fixed on the sensor panel side, a second electrode fixed on the casing side, and an elastic member that is provided between the sensor panel and the casing and elastically supports the sensor panel with respect to the casing, includes, between the first electrode and the second electrode, a first area formed with a first capacitance and a second area formed with a second capacitance larger than the first capacitance, and is configured to detect a pressing force input to the input operation surface as a change in a capacitance between the first electrode and the second electrode.

Abstract: Recording and reproducing characteristics and data saving reliability are secured in a write-once two-layer recording medium. A second recording layer from a side irradiated with light for recording and reproduction includes organic dye shown by a general formula of a chemical formula 3 described below (in the formula, R1 and R2 are alkyl groups of carbon number 1 to 4; Y1, Y2 respectively are organic groups independently; and X is Cl04, BF4, PF6, SbF6), and organic dye shown by a general formula of a chemical formula 4 described below (in the formula, R1, R4 are alkyl groups of carbon number 1 to 4; R2, R3 are alkyl groups of carbon number 1 to 4 or groups forming 3 to 6 membered rings by being coupled; Y1, Y2 respectively are organic groups independently; and X is Cl04, BF4, PF6, SbF6), to secure durability.

Abstract: An optical recording medium includes: an inorganic recording layer; and a protective layer including a composite oxide containing an indium oxide provided on at least one surface of the inorganic recording layer, wherein the composite oxide is represented by the formula [(In2O3)1-X(A)X], wherein A is cerium oxide or gallium oxide and X satisfies a range of 0.15?X?0.75.

Abstract: Disclosed is to provide with an optical recording medium of a write-once type in which an excellent recording characteristic can be obtained over low speed recording to high speed recording.

Abstract: A sensor apparatus includes a first member, a second member, and a detection mechanism. The second member is relatively movable in a first direction with respect to the first member. The detection mechanism includes an elastic member arranged between the first member and the second member, a support that is provided between the first member and the elastic member and forms an air layer between the first member and the elastic member, the air layer having a thickness changed by an elastic deformation of the elastic member, and an electrode pair that forms a plurality of capacitances including a capacitance component changed in accordance with a change of the thickness of the air layer. The detection mechanism outputs a detection signal on a movement amount of the second member in the first direction based on a change of a combined capacitance of the electrode pair.

Abstract: A sensor apparatus includes: a display cover including an operation area that is pressed by an operator and a circumferential area located on the circumference of the operation area; a frame including an opening covered by the operation area and a fixing portion that fixes the circumferential area; a touch panel that is supported by the display cover to be positioned at the opening and detects a position at which the operator comes into contact with the operation area; and a pressure-sensitive sensor that is provided between the display cover and the frame, includes a first electrode and a second electrode opposed to the first electrode, and detects a pressing force with respect to the operation area based on a change of a capacitance between the first electrode and the second electrode that corresponds to a deflection amount of the display cover.

Abstract: The present invention provides a steel plate quality assurance system and facilities thereof, wherein the steel plate quality assurance system measures, with a steel plate manufacturing line including a finishing mill of a steel plate manufacturing line, and accelerated cooling equipment disposed on the downstream side of the finishing mill in the advancing direction of the steel plate manufacturing line, temperature of at least the whole area of the upper surface of a steel plate, or the whole area of the lower surface of a steel plate to perform quality assurance, and includes temperature measurement means; temperature analysis means; and mechanical property determining means.

Abstract: A write-once optical recording medium includes an inorganic recording layer and a protective layer provided on at least one surface of the inorganic recording layer. This protective layer contains indium oxide and tin oxide as main components.

Abstract: A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

Abstract: Recording and reproducing characteristics and data saving reliability are secured in a write-once two-layer recording medium. A second recording layer from a side irradiated with light for recording and reproduction includes organic dye shown by a general formula of a chemical formula 3 described below (in the formula, R1 and R2 are alkyl groups of carbon number 1 to 4; Y1, Y2 respectively are organic groups independently; and X is ClO4, BF4, PF6, SbF6), and organic dye shown by a general formula of a chemical formula 4 described below (in the formula, R1, R4 are alkyl groups of carbon number 1 to 4; R2, R3 are alkyl groups of carbon number 1 to 4 or groups forming 3 to 6 membered rings by being coupled; Y1, Y2 respectively are organic groups independently; and X is ClO4, BF4, PF6, SbF6), to secure durability.

Abstract: An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 ?m.

Abstract: A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table.

Abstract: A flattening method can flatly process a surface of a metal film as an interconnect material over the entire film surface at a sufficiently high processing rate even when the metal film has initial surface irregularities. The flattening method for processing and flattening a surface of a metal film formed on a workpiece and having initial surface irregularities, including: coating only recessed portions of the initial surface irregularities of the metal film with a solid or pasty coating material; and processing the surface of the metal film by electrolytic processing using no abrasive.

Abstract: An optical recording medium comprises a transmission substrate and a recording layer formed on the transmission substrate, the recording layer containing at least a dye material expressed by a general formula shown at the following chemical formula (in the chemical formula 1, R1 represents alkyl group having carbon numbers 1 to 4, R2, R3 represent alkyl group having carbon numbers 1 to 4, benzyl group or groups combined to form 3 to 6 rings, Y1 and Y2 independently represent organic groups and X represent ClO4, BF4, PF6, SbF6) and a dye material expressed by a general formula represented by the following chemical formula 2(in the chemical formula 2, R1 and R2 represent alkyl groups having carbon numbers 1 to 4, benzyl groups or groups combined to form 3 to 6 rings, Y1, Y2 independently represent organic groups and X represent ClO4, BF4, PF6, SbF6): In a write once type optical recording medium such as DVD?R and DVD+R, satisfactory recording characteristics can be obtained from low-speed recording to high-

Abstract: A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table.

Abstract: A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table.

Abstract: A polishing method polishes a substrate so as to remove an interconnect metal film and a barrier film formed on portions other than interconnect recesses. The method includes performing a first polishing process of polishing a surface of the substrate After performing the first polishing process, the surface of the substrate is cleaned. After cleaning, a second polishing process is performed for further polishing the surface of the substrate. At least one of performing the first polishing process and performing the second polishing process includes performing electrolytic polishing.

Abstract: A first dielectric layer 3, a multilayer magnetic film 10 in which a first magnetic layer 4 having perpendicular magnetic anisotropy at room temperature, a second magnetic layer 5 having inplane magnetic anisotropy at room temperature, and a third magnetic layer 6 having perpendicular magnetic anisotropy at room temperature are sequentially laminated, a second dielectric layer 7, a reflective layer 8, and a protective layer 9 are sequentially laminated onto one principal plane of a disk substrate 2 on which a land and a groove exist, thereby forming a magnetooptic disk 1. Saturation magnetization of the second magnetic layer 5 is set to a range from 8.80×10?2 to 1.76×10?1 Wb/m2. A gas pressure upon film creation of the second magnetic layer is set to a range from 0.6 to 3.0 Pa. A content ratio of Co in the third magnetic layer 6 is set to a range from 15 to 17 atom %.

Abstract: A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

Abstract: The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.