Patents by Inventor Yutaka Wada

Yutaka Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010029161
    Abstract: A polishing tool can produce a flat and mirror polish surface in an object by pressing and sliding against the surface of the object. The polishing tool has a base section, and a plurality of segments of grinding plate pieces fixed on the base section. The grinding plate pieces are separated by given distance. The grinding plate pieces are preferably bounded to a bounding surface of a base section using an adhesive agent.
    Type: Application
    Filed: June 5, 2001
    Publication date: October 11, 2001
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo
  • Publication number: 20010009843
    Abstract: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.
    Type: Application
    Filed: March 21, 2001
    Publication date: July 26, 2001
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo
  • Patent number: 6261162
    Abstract: A grinding plate has abrasive particles dispersed uniformly. The grinding plate is made by applying ultrasonic vibration when dispersing the abrasive particles in an organic solvent containing a binder material. The grinding plate is fixed on a base section in a wetted state. The grinding plate is divided into a plurality of segments and is fixed to a flat surface of the base section, and the segments are separated by a given distance.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: July 17, 2001
    Assignee: Ebara Corporation
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo
  • Publication number: 20010002359
    Abstract: A polishing apparatus polishes a workpiece to a planar mirror finish stably, which is prevented from being vibrated while polishing is carried out.
    Type: Application
    Filed: January 12, 2001
    Publication date: May 31, 2001
    Inventors: Hisanori Matsuo, Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa
  • Patent number: 6220945
    Abstract: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: April 24, 2001
    Assignee: Ebara Corporation
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo
  • Patent number: 6217411
    Abstract: A polishing apparatus includes a rotatable polishing pad having a polishing surface, a carrier for carrying an article to be polished and a support for stationarily supporting the carrier in such a manner that the article carried by the carrier is engaged with the polishing surface. A universal joint is provided between the carrier and the support. A sensor device senses a friction force generated between the article and the polishing surface as the polishing pad is rotated and imposed on the carrier. A pressing device has a plurality of pushers arranged around the joint to apply pressures to the carrier towards the polishing pad.
    Type: Grant
    Filed: March 26, 1999
    Date of Patent: April 17, 2001
    Assignee: Ebara Corporation
    Inventors: Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa, Hisanori Matsuo
  • Patent number: 6196904
    Abstract: A polishing apparatus polishes a workpiece to a planar mirror finish stably, and is prevented from being vibrated while polishing is carried out. The polishing apparatus has a rotatable holding member for holding the workpiece, and a bearing supporting an outer circumferential surface of the holding member, for suppressing vibrations transmitted to the holder while the workpiece is being polished.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: March 6, 2001
    Assignee: Ebara Corporation
    Inventors: Hisanori Matsuo, Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa
  • Patent number: 6190243
    Abstract: A polishing apparatus comprises a table having a smooth surface, a polishing pad provided on the smooth surface and a carrier for carrying an article to be polished The carrier brings the article into engagement with the pad under a pressure. The carrier and the table with the polishing pad are repeatedly moved relative to each other in a predetermined direction to thereby polish the article. A pressing device is positioned at a position spaced from the carrier is and adapted to be engaged with the polishing surface of the polishing pad. The pressing device includes a plurality of pressing elements which are arranged across an area of the polishing surface which area is to be brought into engagement with the article carried by the carrier and are adapted to individually press successive corresponding portions in the area to arrange the configuration of the surface of the area under corresponding various pressures.
    Type: Grant
    Filed: May 7, 1999
    Date of Patent: February 20, 2001
    Assignee: Ebara Corporation
    Inventors: Yutaka Wada, Hirokuni Hiyama, Kazuto Hirokawa, Hisanori Matsuo
  • Patent number: 6102786
    Abstract: A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.
    Type: Grant
    Filed: January 21, 1999
    Date of Patent: August 15, 2000
    Assignee: Ebara Corporation
    Inventors: Masayoshi Hirose, Yoshimi Sasaki, Akira Ogata, Seiji Ishikawa, Tamami Takahashi, Hirokuni Hiyama, Yutaka Wada
  • Patent number: 6015337
    Abstract: A polishing apparatus for polishing for example a semiconductor wafer to a high degree of flatness includes a turntable to the upper surface of which is affixed a polishing cloth and a top ring. A surface of the workpiece interposed between the polishing cloth on the turntable and the top ring is polished by pressing the workpiece against the polishing cloth with a predetermined pressure and moving the turntable and the top ring relative to each other. The turntable includes a set of annular small tables each of which is smaller than the diameter of the workpiece and determined on the basis of an area of effect on the workpiece.
    Type: Grant
    Filed: July 14, 1997
    Date of Patent: January 18, 2000
    Assignee: Ebara Corporation
    Inventors: Hirokuni Hiyama, Yutaka Wada
  • Patent number: 6005183
    Abstract: A device is provided which comprises a solar cell section formed in a plate and a storage battery section. The solar cell section includes one or more solar cells which generate electrical power when they receive light. The storage battery section is lying under the solar cell section and comprises one or more storage battery cells separated by bulkheads. Each of the storage battery cells comprises two chambers containing electrolytic solutions and a membrane dividing the chambers, whereby ions solved in the solutions undergo a change in valences, while maintaining their status as solved ions. Holes are extending through the bulkheads to exchange the electrolytic solutions in the storage battery cells, thereby the concentration of the cells can be maintained to be substantially uniform.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: December 21, 1999
    Assignee: Ebara Corporation
    Inventors: Yuichi Akai, Naoaki Ogure, Yutaka Wada
  • Patent number: 5888126
    Abstract: A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.
    Type: Grant
    Filed: January 24, 1996
    Date of Patent: March 30, 1999
    Assignee: Ebara Corporation
    Inventors: Masayoshi Hirose, Yoshimi Sasaki, Akira Ogata, Seiji Ishikawa, Tamami Takahashi, Hirokuni Hiyama, Yutaka Wada
  • Patent number: 5882244
    Abstract: A polishing apparatus makes it possible to accurately detect the temperature of a workpiece during polishing and to perform polishing end point determination on the basis of this detected temperature. The polishing apparatus polishes irregularities in a surface of a workpiece such as for example a semiconductor wafer to a flat and mirror-like finish. A top ring holding a semiconductor wafer is provided with a temperature sensor. Frictional heat generated in the semiconductor wafer by polishing is detected by the temperature sensor, and a polishing end point is determined on the basis of the detected temperature.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: March 16, 1999
    Assignee: Ebara Corporation
    Inventors: Hirokuni Hiyama, Yutaka Wada, Tamami Takahashi
  • Patent number: 5838447
    Abstract: A polishing apparatus polishes a workpiece such as a semiconductor wafer while detecting a thickness or a flatness of a surface layer of the workpiece on a real-time basis. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and such workpiece against the polishing cloth. The polishing apparatus also has a thickness detector for detecting the thickness of a surface layer of the workpiece supported by the top ring while the workpiece is being polished without exposing the workpiece. The thickness detector includes a sensor mounted in the turntable and including at least one light-emitting element for emitting light toward the surface layer of the workpiece and at least one light-detecting element for detecting light reflected from the surface layer of the workpiece.
    Type: Grant
    Filed: July 19, 1996
    Date of Patent: November 17, 1998
    Assignee: Ebara Corporation
    Inventors: Hirokuni Hiyama, Yutaka Wada
  • Patent number: 5786367
    Abstract: The present invention provides novel cyclic amide derivatives having activity for protecting against the ultraviolet rays, activity for scavenging active oxygen species and activity for inhibiting the formation of lipid peroxides, which is represented by the following general formula (1): ##STR1## wherein R.sup.2 is a hydroxyl group, a lower alkenyloxy group, a phenyl-lower alkenyloxy group, a cycloalkenyloxy group, a tetrahydropyranyloxy group, a pyridyloxy group, or a lower alkanoyloxy group which may have carboxyl group(s).
    Type: Grant
    Filed: March 5, 1996
    Date of Patent: July 28, 1998
    Assignee: Otsuka Pharmaceutical Co., Ltd.
    Inventors: Yasuo Oshiro, Tatsuyoshi Tanaka, Takao Nishi, Keiichi Kuwahara, Shigeki Fujisawa, Keiko Takasu, Yutaka Wada
  • Patent number: 5559939
    Abstract: Each of formula constituent elements represented in real mathematical notation is written by a user via an input device on a display screen. While confirming positions of graphic elements indicative of each of the respective inputted constituent elements with respect to the display screen, the user forms a desired formula. On the basis of types of the inputted constituent elements and their positions on the display screen, an arithmetic relationship between the formula constituent elements is automatically obtained by a computer. A computer program to solve this formula is automatically produced by the computer based on the resultant arithmetic relationship. The solutions of the formula are displayed on the display screen as numeral values and graphic representations.
    Type: Grant
    Filed: February 10, 1995
    Date of Patent: September 24, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Yutaka Wada, Yukihiro Oda, Tunemasa Miyo, Yasuhiro Noguchi, Kazuo Takei
  • Patent number: 5481654
    Abstract: A printing mode setting portion outputs energizing time data corresponding to a selected printing mode when selecting the printing mode according to operation of the operation unit. Based on the energizing time data, the energizing time period of a head energizing signal which is output from a head driving portion to a driving coil of a dot printer head is controlled by the energizing time control portion 6. When printing mode having a high dot density is selected, printing energy is reduced and the energizing time period is refined for the driving coil 8, thus making it made possible to lower the noise level.
    Type: Grant
    Filed: August 3, 1992
    Date of Patent: January 2, 1996
    Assignee: Kabushiki Kaisha Tec
    Inventors: Narumi Kikuchi, Tsuyoshi Matsushita, Yutaka Wada
  • Patent number: 5367239
    Abstract: Disclosed is a method for driving a printer carrier. One power source is connected via a constant current circuit to the carrier motor. Data storing means stores the current command data corresponding to the acceleration, constant speed printing and deceleration of the carrier motor. According to the method, the current command data from the data storing means is latched in synchronism with a clock signal. The latched data is converted to a current reference voltage. The output current of the constant current drive circuit is varied in accordance with the current reference voltage. Changing the current command data as desired makes it possible to adjust freely the torque of the carrier motor for acceleration and deceleration on a constant voltage from one power source.
    Type: Grant
    Filed: April 10, 1992
    Date of Patent: November 22, 1994
    Assignee: Tokyo Electric Co., Ltd.
    Inventors: Tsuyoshi Matsushita, Eiichi Furuya, Narumi Kikuchi, Katsuya Endo, Yutaka Wada
  • Patent number: 5322228
    Abstract: A method, for screening an optical fiber, and an apparatus for carrying out the method, in which two sucking nozzles and a tape sticking device are provided to automatically perform processing of the end portions of the optical fiber; and an automatic fiber transporting/mounting device is provided to transport the succeeding portion of the optical fiber to the winding roll and mount, it on the winding roll; dancer rolls are provided in the longitudinal direction of an arm; and supporting rolls are movable between the path line of the optical fiber and a position removed from the path line.
    Type: Grant
    Filed: May 18, 1992
    Date of Patent: June 21, 1994
    Assignee: Sumitomo Electric Industries, Inc.
    Inventors: Katsuya Nagayama, Toshifumi Hosoya, Yutaka Wada, Ichiro Yoshimura, Yasuo Matsuda, Yuji Kobayashi
  • Patent number: 4984180
    Abstract: Graphic data of design objects designated by an input device are retrieved from a design object data memory and displayed on a display device. A restrictive item applied to the design object displayed on the display device and redesignated by the input device is read from the design object data memory. Specification data of the designated design objects are also read from the design object data memory. A condition part of the design reference is made based on the redesignated design object and the selected specification data, and an end portion of the design reference is made based on the redesignated design object, the selected restrictive item and a reference value entered by the input device. The design reference including the condition part and the end portion is displayed on the display device and stored into a design reference memory.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: January 8, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Yutaka Wada, Yasuhiro Kobayashi, Toru Mitsuta