Abstract: A method of performing overlay error correction includes forming a photoresist layer over a substrate and exposing a first set of apertures to incident radiation. The method also includes determining an overlay error associated with the first set of apertures and determining an overlay correction as a function of the determined overlay error. The method further includes exposing a data area and a second set of apertures. The data area and the second set of apertures are exposed based, in part, on the determined overlay correction. Moreover, the method includes verifying the determined overlay correction.

Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.

Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.

Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.

Abstract: A method of manufacturing bonded substrate structures. The method includes providing a first substrate comprising a first surface region and processing the first surface region to form a first pattern region using a first photolithographic stepper characterized by a first tolerance criteria for alignment. The method also includes providing a second substrate comprising a second surface region and processing the second surface region through at least one masking process to form a second pattern region using a second photolithographic stepper characterized by a second tolerance criteria for alignment.

Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300 ° C. to maintain a state of the planarizing material.

Abstract: The invention discloses a method for implementing link state passing-through in network, for informing the peer of link fault, including: the service device detecting whether there is a link fault in the network; in case of link fault, the service device transferring link fault information to peer service device with a control frame; in response to the control frame containing link fault information, the peer service device disconnecting the user's link and performing corresponding processes; the user at the faulty peer communicating with peer user through the spare network; when the link recovers to normal, the service device at the recovery peer sending a control frame containing link fault recovery information to peer service device to reestablish communication between the users on the link. The invention is capable of reducing extra overhead under normal network conditions as much as possible.

Abstract: A method of performing overlay error correction includes forming a photoresist layer over a substrate and exposing a first set of apertures to incident radiation. The method also includes determining an overlay error associated with the first set of apertures and determining an overlay correction as a function of the determined overlay error. The method further includes exposing a data area and a second set of apertures. The data area and the second set of apertures are exposed based, in part, on the determined overlay correction. Moreover, the method includes verifying the determined overlay correction.

Abstract: An optical deflection device for a display application includes a semiconductor substrate comprising an upper surface region defining an upper surface plane. The optical deflection device also includes one or more electrode devices provided overlying the upper surface region and a hinge device including a silicon material and coupled to the upper surface region at a predetermined height above the upper surface plane. The optical deflection device further comprises a plurality of landing pads including a silicon material and coupled to the upper surface region at the predetermined height from the upper surface plane and a mirror structure. The mirror structure includes a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion.

Abstract: A system for accessing and transmitting data frames of different types in a digital transmission network, including: at least one user-network interface; at least one network-network interface; at least one mapping/demapping device; a virtual interface device coupled with the at least one user-network interface and with the at least one network-network interface via the at least one mapping/demapping device; and a control device coupled with the virtual interface device; the control device including: a data processing and dispatching device including: at least one inter-device interface; a data processing and dispatching unit coupled with the inter-device interface; a processing flow database, storing a plurality of processing flows, coupled with the data processing and dispatching unit; and a control interface unit coupled with the processing flow database and the data processing and dispatching unit so as to control a virtual private processing unit and a rule database to process the data frames.

Abstract: A system accessing and transmitting different data frames in a digital transmission network, for accessing and transmitting different data frames, said system comprises: at least a user-network interface (UNI), which is used to couple with the subscriber's network; and/or at least a network-network interface (NNI), which is used to couple with said digital transmission network to transfer data; and a data converting device, coupled with said UNIs and said NNIs, which is used to convert data formats between said UNIs or data formats between said NNIs or data formats between said UNIs and said NNIs; said data converting device comprises a virtual bridge device and an interface device, said virtual bridge device switches data between said UNIs and said NNIs, and said virtual bridge device detects control messages, and transmits the control messages to control system of the device to process via the control interface unit; and data frames of message except control messages are switched, so as to overcome the limi

Abstract: An optical deflection device for a display application. The optical deflection device includes a semiconductor substrate including an upper surface region and one or more electrode devices provided overlying the upper surface region. The optical deflection device also includes a hinge device including a silicon material and coupled to the upper surface region. The optical deflection device further includes a spacing defined between the upper surface region and the hinge device and a mirror structure including a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion and overlying the hinge device.

Abstract: A system accessing and transmitting different data frames in a digital transmission network for accessing and transmitting different data frames, including: at least a user-network interface (UNI), which is used to couple with the user's network; at least a network-network interface (NNI), which is used to couple with the digital transmission network to transfer data; a data converting device, which is coupled with the UNIs and the NNIs to convert data formats between the UNIs, data formats between the NNIs, or data formats between the NNIs and the UNIs; wherein the data converting device includes a virtual interface device, the virtual interface device includes: at least two device interfaces, a virtual interface processing unit, a rule database, a control interface unit and an inter-device interface, so as to improve access ability of the device.

Abstract: A method for processing data through a system for accessing and transmitting different data frames in a digital transmission network includes the following steps: the virtual interface device classifying the data frames, and the virtual interface device outputting the data frames to device interfaces. The system includes a user-network interface (UNI), which is used to connect to a user's network, a network-network interface (NNI), which is used to connect to said digital transmission network to transfer data, a mapping/demapping device, a virtual interface device, which couples with the UNI and couples with the NNI via the mapping/demapping device, and a control device, which couples with the virtual interface device to control it to access and transmit the data frames.

Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.

Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.

Abstract: A method of forming a package for a MEMS structure coupled to a substrate includes depositing an encapsulant material on the substrate and patterning the encapsulant material to form a plurality of encapsulated structures. The method also includes depositing a first capping layer on the substrate and forming one or more release hole patterns in the first capping layer. The method further includes removing the encapsulant material and depositing a second capping layer.

Abstract: A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.

Abstract: A system accessing and transmitting data frames includes: at least one subscriber network interface, and/or at least one inter-network interface, and a data converting device coupled with the subscriber network interface and the inter-network interface. The data converting device includes: a virtual private device, an interface device, and a processing device. The virtual private device is configured for exchanging data frames between the subscriber network interface and the inter-network interface via interface device.

Abstract: A method for forming a patterned amorphous carbon layer in a semiconductor stack, including forming an amorphous carbon layer on a substrate and forming a silicon containing photoresist layer on top of the amorphous carbon layer. Thereafter, the method includes developing a pattern transferred into the resist layer with a photolithographic process and etching through the amorphous carbon layer in at least one region defined by the pattern in the resist layer, wherein a resist layer hard mask is formed in an outer portion of the photoresist layer during etching.