Abstract: The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.

Abstract: A display substrate is provided. The display substrate includes a base substrate; a pixel definition structure on the base substrate; a plurality of light emitting elements respectively in a plurality of first apertures; and a reflective layer at least partially in a respective one of the plurality of first apertures and configured to reflect light laterally emitted from a respective one of the plurality of light emitting elements to exit from a light emitting surface of the respective one of the plurality of light emitting elements. The pixel definition structure includes a first pixel definition layer on the base substrate, and a second pixel definition layer on a side of the first pixel definition layer away from the base substrate. Lateral sides of the first pixel definition layer and the second pixel definition layer have different slope angles with respect to a main surface of the base substrate.

Abstract: An array substrate includes a flexible base substrate; a buffer layer on the flexible base substrate and continuously extending from a display area into a peripheral area, including a first portion substantially extending throughout the display area and a second portion in the peripheral area, the first portion and the second portion being parts of an integral layer, an organic insulating layer substantially extending throughout but limited in the display area and on a side of the buffer layer away from the flexible base substrate; an inorganic insulating layer limited in the peripheral area and on a side of the buffer layer away from the flexible base substrate; a planarization layer on a side of the organic insulating layer away from the buffer layer, and a plurality of light emitting elements on a side of the planarization layer away from the organic insulating layer.

Abstract: A display panel is provided with a plurality of sub-pixel areas and includes: a base substrate, a light emitting structure including a plurality of light emitting devices corresponding to the sub-pixel areas, an encapsulating layer, and a pixel defining layer. The pixel defining layer includes: a plurality of openings; at least two sub-pixel defining layers, and a quantum dot color film layer. Each of the sub-pixel defining layers is provided with a pixel separator. The pixel separators fence each of the plurality of openings, and define the plurality of sub-pixel areas. In the at least two sub-pixel defining layers, the sectional shape of the pixel separator in the sub-pixel defining layer which is farthest away from the encapsulating layer includes a regular trapezoid. The quantum dot color film layer includes a plurality of quantum dot color films arranged in the corresponding openings.

Abstract: A display panel includes a base; a plurality of display units disposed on a surface of the base, every two adjacent display units being provided with a gap therebetween; and a connection unit disposed in the gap and connected to the every two adjacent display units. The connection unit includes a first organic layer, a conductive layer and a second organic layer that are sequentially stacked. The first organic layer and the second organic layer are each configured to block stress causing the connection unit to deform.

Abstract: The present application discloses a display panel and a preparation method thereof. The display panel includes a base substrate provided with a circuit area and a light-emitting area; a driving circuit located in the circuit area of the base substrate; an organic insulating layer covering the light-emitting area of the base substrate; a light-emitting element embedded in the organic insulating layer, where an overlap area between the orthographic projection of the light-emitting element on the base substrate and the orthographic projection of the driving circuit on the base substrate is 0; and a first lapping electrode located on the side, facing away from the base substrate, of the light-emitting element, where the light-emitting element is electrically connected to the driving circuit through the first lapping electrode.

Abstract: An array substrate includes a flexible base substrate; a buffer layer on the flexible base substrate and continuously extending from a display area into a peripheral area, including a first portion substantially extending throughout the display area and a second portion in the peripheral area, the first portion and the second portion being parts of an integral layer, an organic insulating layer substantially extending throughout but limited in the display area and on a side of the buffer layer away from the flexible base substrate; an inorganic insulating layer limited in the peripheral area and on a side of the buffer layer away from the flexible base substrate; a planarization layer on a side of the organic insulating layer away from the buffer layer, and a plurality of light emitting elements on a side of the planarization layer away from the organic insulating layer.

Abstract: The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.

Abstract: The present disclosure can provide a transparent display panel, a preparation method thereof and a display device. The transparent display panel includes a bearing layer disposed between a base substrate and a liquid crystal layer and including a plurality of concave structures, and a plurality of reflecting structures located between the bearing layer and the liquid crystal layer, where an orthographic projection of the concave structure on the base substrate covers an orthographic projection of one or more reflecting structures on the base substrate.

Abstract: Devices and techniques for variable width superblock addressing are described herein. A superblock width, specified in number of planes, is obtained. A superblock entry is created in a translation table of a NAND device. Here, the superblock entry may include a set of blocks, from the NAND device, that have the same block indexes across multiple die of the NAND device. The number of unique block indexes are equal to the number of planes and in different planes. A request, received from a requesting entityp, is performed using the superblock entry. Performing the request includes providing a single instruction to multiple die of the NAND device and multiple data segments. Here, a data segment corresponds to a block in the set of blocks specified by a tuple of block index and die. A result of the request is then returned to the requesting entity.

Abstract: The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.

Abstract: A transducer, a method of manufacturing a transducer, and a transducing device are provided. The transducer includes a receiving unit and a transmitting unit. The receiving unit includes a first receiving electrode, a first piezoelectric film, and a second receiving electrode which are sequentially stacked, and the receiving unit is configured to convert a first acoustic wave signal into an electrical signal by using a piezoelectric effect of the first piezoelectric film. The transmitting unit is configured to receive a control signal, which is based on the electrical signal, to transmit a second acoustic wave signal.

Abstract: Devices and techniques for variable width superblock addressing are described herein. A superblock width, specified in number of planes, is obtained. A superblock entry is created in a translation table of a NAND device. Here, the superblock entry may include a set of blocks, from the NAND device, that have the same block indexes across multiple die of the NAND device. The number of unique block indexes are equal to the number of planes and in different planes. A request, received from a requesting entity, is performed using the superblock entry. Performing the request includes providing a single instruction to multiple die of the NAND device and multiple data segments. Here, a data segment corresponds to a block in the set of blocks specified by a tuple of block index and die. A result of the request is then returned to the requesting entity.

Abstract: The disclosure discloses a backboard, a display device, and a method for fabricating the same, and the backboard includes: a backboard body; and a plurality of LED installation mounts arranged in an array on the backboard body, wherein each of the plurality of LED installation mounts includes at least two lead-out electrodes to be connected with LED pins, and a coil structure around each of the at least two lead-out electrodes, wherein the coil structure is configured to produce a magnetic field upon being powered on. The coils can be formed on the backboard body in the backboard to absorb electrodes of LEDs to thereby position them precisely so as to transfer the LEDs in a mass manner with a high good yield ratio, and the lead-out electrodes can be powered on to thereby detect abnormally operating LEDs.

Abstract: A display substrate, a manufacturing method thereof, and a display device are provided, in the field of display technology. The display substrate includes a base substrate, and a thin-film transistor, a light-emitting device, an encapsulation structure, and a conductive film layer sequentially disposed on the base substrate in a direction away from the base substrate. Since the display substrate includes a conductive film layer on a side of the encapsulation structure away from the base substrate, when the protective film layer on the side of the conductive film layer away from the base substrate is peeled off, static electricity generated by the separation of the film layer can be released to the conductive film layer, avoiding electron transition to the active layer of the thin-film transistor in the display substrate to cause offset of the threshold voltage of the thin-film transistor. The display brightness uniformity of the display substrate can be ensured.

Abstract: A display substrate is provided. The display substrate includes a base substrate; a pixel definition structure on the base substrate; a plurality of light emitting elements respectively in a plurality of first apertures; and a reflective layer at least partially in a respective one of the plurality of first apertures and configured to reflect light laterally emitted from a respective one of the plurality of light emitting elements to exit from a light emitting surface of the respective one of the plurality of light emitting elements. The pixel definition structure includes a first pixel definition layer on the base substrate, and a second pixel definition layer on a side of the first pixel definition layer away from the base substrate. Lateral sides of the first pixel definition layer and the second pixel definition layer have different slope angles with respect to a main surface of the base substrate.

Abstract: The present disclosure provides an electrode plate, a microfluidic chip, and a method of manufacturing the electrode plate. In one embodiment, an electrode plate includes: a substrate, an electrode and a surface contact layer stacked in sequence, and a droplet inlet hole passing through the substrate, the electrode and the surface contact layer. The surface contact layer comprises a super-hydrophobic region and a hydrophilic region, and the droplet inlet hole is disposed in the hydrophilic region. The microfluidic chip includes: a first electrode plate formed by the abovementioned electrode plate, and a second electrode plate provided on a side of the first electrode plate close to the surface contact layer. The first electrode plate is provided opposite to the second electrode plate and a liquid channel is formed between the first electrode plate and the second electrode plate.

Abstract: A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed.

Abstract: Devices and techniques for variable width superblock addressing are described herein. A superblock width, specified in number of planes, is obtained. A superblock entry is created in a translation table of a NAND device. Here, the superblock entry may include a set of blocks, from the NAND device, that have the same block indexes across multiple die of the NAND device. The number of unique block indexes are equal to the number of planes and in different planes. A request, received from a requesting entity, is performed using the superblock entry. Performing the request includes providing a single instruction to multiple die of the NAND device and multiple data segments. Here, a data segment corresponds to a block in the set of blocks specified by a tuple of block index and die. A result of the request is then returned to the requesting entity.

Abstract: A piezoelectric device includes: a base having at least one hole, a heat conductive portion disposed in the at least one hole and in contact with a wall of the at least one hole, and at least one piezoelectric sensor disposed on the base. A thermal conductivity of the heat conductive portion is greater than a thermal conductivity of the base. Each piezoelectric sensor includes: a first electrode, a piezoelectric pattern made of a piezoelectric material and a second electrode that are sequentially stacked in a thickness direction of the base.