Abstract: A sound generator provided in the present disclosure includes a frame, a magnetic circuit unit, and a first vibration unit and a second vibration unit arranged on two sides of the magnetic circuit unit. The magnetic circuit unit includes a first central magnetic yoke in the middle, a central magnet fixed to the first central magnetic yoke, a magnetic component arranged around the central magnet and fixed to the frame, and a connecting portion connecting the first central magnetic yoke to the magnetic component. The central magnet includes a first magnet portion fixed to the first central magnetic yoke and a second magnet portion fixed to the side of the first magnet portion away from the first central magnetic yoke, a projection area of the first magnet portion along a vibrating direction is greater than a projection area of the second magnet portion along the vibrating direction.

Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly.

Abstract: The present disclosure describes a method for detecting the presence of Mycobacterium tuberculosis in a bodily fluid sample. The method utilizes CRISPR effector proteins along with a guide RNA and a reporter molecule, such that when the guide RNA hybridizes with a target nucleotide fragment, the CRISPR effector protein cleaves the reporter molecule, resulting in a detectable signal.

Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Abstract: Disclosed are a camera module, a blocking-type photosensitive assembly, a manufacturing method thereof, and an electronic device. The camera module includes a blocking-type photosensitive assembly and at least one motor camera lens assembly arranged on the blocking-type photosensitive assembly. The blocking-type photosensitive assembly includes a molded photosensitive assembly and a blocking structure arranged on the molded photosensitive assembly. A blocking surface of the blocking structure is higher than an upper surface of a filter element, and at least a part of the projection of the blocking surface of the blocking structure on the molded photosensitive assembly overlaps with the projection of an optical lens of the motor camera lens assembly on the molded photosensitive assembly to block the optical lens from directly contacting the filter element.

Abstract: A method for generating electric substation load transfer control parameters includes adjusting elements in a fundamental scale matrix according to a condition change of a power grid, wherein the fundamental scale matrix is constructed based on the topology structure of the power grid, and the elements in the fundamental scale matrix represent switch information and risk values of paths between nodes of the power grid, wherein the switch information represents number of switching times required for connecting two nodes of the power grid; and performing operations on the adjusted fundamental scale matrix to generate switch information and risk values of paths for electric substation load transfer control, as electric substation load transfer control parameters.

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

Abstract: This application provides techniques of generating comment videos. The techniques comprise receiving a selection of a target text video template, wherein the target text video template is associated with synthesis material, and wherein the synthesis material comprises a video track; determining at least one target comment corresponding to the target text video template; segmenting the at least one target comment and obtaining at least one comment segment comprised in each of the at least one target comment; and generating a corresponding comment video by adding the at least one comment segment of each target comment to the synthesis material.

Abstract: The technology of this application relates to a pose determining method. The method includes obtaining a first image, when first pose information determined based on the first image meets a pose anomaly condition, displaying prompt information for indicating to photograph a target object, and obtaining, by using the target object in the target image captured by a user based on the prompt, second pose information that does not meet the pose anomaly condition. When high-precision pose information cannot be determined, pose positioning is implemented by using the target object in a scenario. In addition, in a process of determining pose information of a terminal device, prompt information for indicating the user to photograph the target object is displayed, and the user is indicated to photograph the target object, thereby avoiding that the user does not know how to operate or scan an invalid target object.

Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

Abstract: This production method for an optical laminate is a production method for an optical laminate having a plastic film, an adhesion layer, an optical function layer and an antifouling layer laminated in order and includes an adhesion layer formation step of forming an adhesion layer, an optical function layer formation step of forming an optical function layer, a surface treatment step of treating a surface of the optical function layer so that a change rate of surface roughness represented by the prescribed formula (1) is 5% to 35% or a change rate of an average length of elements represented by the prescribed formula (2) is 7% to 70%, and an antifouling layer formation step of forming an antifouling layer on the optical function layer having a treated surface.

Abstract: This optical laminate 101 is an optical laminate including a plastic film 11, an adhesion layer 13, an optical function layer 14 and an antifouling layer 15 laminated in order, in which the antifouling layer 15 is made of a vapor-deposited film obtained by 5 vapor deposition of an antifouling material, a film thickness of the antifouling layer 15 is 2.5 nm or more, a water vapor transmission rate is 1.5 g/(m2·1 day) or less, and a hue change ?E value of reflected color in consideration of specular light (SCI) after contacting a sodium hydroxide aqueous solution having a liquid temperature of 55° C. and a concentration of 0.1 mol/L for four hours is less than 10.

Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

Abstract: This method of manufacturing an optical laminate comprising a transparent substrate, an adhesion layer, an optical functional layer, and an antifouling layer laminated in this order, includes an adhesion layer forming step of forming the adhesion layer, an optical functional layer forming step of forming the optical functional layer, a surface treatment step of treating the surface of the optical functional layer so that the rate of change in surface roughness represented by formula (1) is 1˜25%, and an antifouling layer forming step of forming the antifouling layer on the surface-treated optical functional layer; Rate of change of surface roughness (%)=((Ra2/Ra1)?1)×100 (%) Formula (1) (Formula (1), where Ra1 represents the surface roughness (Ra) of the optical functional layer before the surface thereof is treated, and Ra2 represents the surface roughness (Ra) of the optical functional layer after the surface thereof is treated.).

Abstract: Provided is a determination method of differential protection suitable for an electricity transmission line with multi-terminal T-connection.

Abstract: A microcapsule type polycarboxylate superplasticizer and a preparation method thereof. The microcapsule type polycarboxylate superplasticizer is a polycarboxylic acid aqueous solution encapsulated by a closed capsule, and the closed capsule is an organic/inorganic composite shell layer of calcium ion gel of sodium alginate or gelatin, and calcium carbonate. The organic/inorganic composite shell layer is obtained through diffusion-interface reaction of sodium alginate or gelatin, calcium salt and urea under the catalysis of urease. The microcapsule type polycarboxylate superplasticizer meets requirement of long-term and stable slump retaining of concrete in some special engineering. The preparation method has simple processes, free of organic solvent, and has high encapsulating efficiency.

Abstract: This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.