Abstract: A mounting device for quick and easy mounting of an electronic device includes a mounting rack, a locking mechanism, and a support rack. The locking mechanism includes a movable locking rack, a shaft connected to the locking rack, and a locking ring on the shaft. The support rack includes an engaging element and groove, and when the support rack is moved toward the mounting rack during mounting, the free end of the engaging element passes through the lower side of the locking rack, and pushes against the locking ring. When mounted on the mounting rack, the bottom of the locking ring is in the engaging groove. When the support rack is raised up, the engaging element raises the locking rack to the magnetic part, and the locking rack is magnetically held to the magnetic part.

Abstract: A mounting device for quick and easy mounting of an electronic device includes a mounting rack, a locking mechanism, and a support rack. The locking mechanism includes a movable locking rack, a shaft connected to the locking rack, and a locking ring on the shaft. The support rack includes an engaging element and groove, and when the support rack is moved toward the mounting rack during mounting, the free end of the engaging element passes through the lower side of the locking rack, and pushes against the locking ring. When mounted on the mounting rack, the bottom of the locking ring is in the engaging groove. When the support rack is raised up, the engaging element raises the locking rack to the magnetic part, and the locking rack is magnetically held to the magnetic part.

Abstract: A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

Abstract: The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board.

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

Abstract: A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip.

Abstract: Disclosed is a periscopic camera module, including: a first reflective element including a first reflective surface and used to reflect incident light and make the incident light longitudinally turn; an optical lens used to receive the light reflected by the first reflective element and output an imageable light beam to an image space; a second reflective element including at least one second reflective surface and adapted to make the imageable light beam transversely turn at least once; and a photosensitive chip adapted to receive the transversely turned imageable light beam, wherein at least one of all optical surfaces of the first reflective element and the second reflective element is provided with a light blocking structure, and the light blocking structure is arranged at an edge region of the at least one optical surface; and the optical surface includes a reflective surface, an incident surface, or an eixt surface.

Abstract: Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.

Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm?a?1 mm, and 0.2 mm?c?1.5 a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

Abstract: Disclosed are a molded circuit board and a camera module, and a manufacturing method thereof and an electronic device comprising the same. The molded circuit board includes a circuit board main body and a molded structure. The circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked in a manner of being spaced apart.

Abstract: Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.

Abstract: The present application relates to a photosensitive assembly, a camera module and manufacturing methods therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component disposed on the circuit board, and a molded body integrally formed on the circuit board. The molded body has at least one slot formed therein in a recessed manner, and the slot is located outside the photosensitive chip. In this way, the magnitude of stress that the molded body acts on the photosensitive chip is reduced by means of the slot being disposed in the molded body, so as to effectively reduce the amount of deformation of the photosensitive chip due to the stress.

Abstract: Wastewater containing organic matter may be treated using a multi-zone apparatus. In a first zone, organic matter in the wastewater may, among other things, be converted to at least volatile fatty acids (VFAs) and, thereafter, a portion of the treated wastewater may flow to a second zone that may, among other things, convert the VFAs to methane.

Abstract: A display panel includes a data line, a pixel driving circuit, a light-emitting device and a voltage compensation circuit. The voltage compensation circuit includes a sampling and conditioning unit configured to obtain a driving current output by the pixel driving circuit and to output a control signal according to the driving current; a first switch unit including a control terminal, an input terminal and an output terminal, the control terminal of the first switch unit being connected to an output terminal of the sampling and conditioning unit, and the input terminal of the first switch unit being connected to the output terminal of the pixel driving circuit; a compensation unit including an input terminal and an output terminal, the input terminal of the compensation unit being connected to the output terminal of the first switch unit, and the output terminal of the compensation unit being connected to the data line.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: Disclosed is a hollow sulfide microsphere with enriched sulfur vacancies, which is prepared by a method comprising the steps of: dissolving cobalt nitrate and nickel nitrate in a mixed solution of N, N-dimethylformamide and acetone with an equal volume; then adding a chelating agent thereto, subjecting a resulting mixture to a solvothermal reaction to obtain a coordination polymer microsphere; dissolving the coordination polymer microsphere and a sulfurization agent in an organic solvent, and reacting to obtain a hollow sulfide microsphere; and subjecting the hollow sulfide microsphere to reduction treatment with sodium borohydride, centrifuging, washing and drying to obtain the hollow sulfide microsphere with enriched sulfur vacancies having a particle size of 1-2.5 ?m, a shell thickness of 15-30 nm and a specific capacity of the material of 763.4 C g?1 (current density is 1 A g?1).

Abstract: A saturation clustering-based method for positioning bone marrow white blood cells: first, pre-processing a bone marrow white blood cell image to eliminate partial noise points and simultaneously smooth the image; using K-means clustering to cluster saturation channels of the bone marrow white blood cell image, and select the type of the white blood cells according to a decision tree algorithm; next, eliminating irrelevant areas in a binary image of the white blood cells by means of a morphology processing algorithm, and simultaneously filling in point holes in the white blood cells; and finally, positioning the white blood cells. The present method is simple and effective, and is suitable for a wide range of applications compared to existing threshold-based algorithms, while rendering a final result more accurate by integrating the decision tree algorithm.

Abstract: An adjustable camera module and an assembly test method therefor. The assembly test method for the adjustable camera module comprises: measuring a static tilt amount between the optical lens sheet group and the photosensitive assembly by performing a defocus curve test on the adjustable camera module; analyzing a static adjusting electric quantity of each adjustment coil of an adjustment coil group according to the static tilt amount; and burning the static adjusting electric quantity required by each adjustment coil so as to reduce process requirements.