Abstract: Anaerobic wastewater treatment systems, devices and methods complete three-phase separation of biogas, liquids and solids (e.g., biomass) using overlapped gas hoods or baffles and one or more conically-shaped settlers having a varying cross-sectional area.

Abstract: The present application discloses a polyhydroxy aromatic intermediate, preparation thereof and use thereof in a polycondensate water-reducer with branched side chains. The polycondensate water-reducer with branched side chains has a branched side chain structure which provides a stronger steric hindrance. The synergistic effect of the branched side chains and the rigid skeleton of the aromatic ring greatly improves the water-reducing ability. Especially under a condition of low water/cement ratio, the improvement in water-reducing ability is more obvious. The branched polyether side chain is more conducive to the formation of a thicker water film layer, which has an obvious viscosity reduction effect. The conformation of the branched polyether side chain is less affected by different ionic environments in the pore solution in cement, and thus has a stronger adaptability to various raw materials.

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

Abstract: This optical laminate is an optical laminate including a plastic film, an adhesion layer, an optical function layer, and an antifouling layer which are laminated in this order. The antifouling layer includes a vapor-deposited film in which an antifouling material is vapor-deposited. A water vapor transmittance is 1.5 g/(m2·1 day) or lower. A hue change ?E value in (SCI) reflected color in consideration of specular reflection light after being brought into contact with a sodium hydroxide aqueous solution having a concentration of 0.1 mol/L at a liquid temperature of 55° C. for four hours is smaller than 10.

Abstract: This optical laminate includes a transparent substrate, an optical functional layer, and an antifouling layer laminated in this order, wherein the optical functional layer is a laminate in which a low refractive index layer and a high refractive index layer are alternately laminated, the antifouling layer is formed of a vapor-deposited film obtained by vapor deposition of an antifouling material, and the residual amount of fluorine atoms in the antifouling layer detected by XRF after 10 minutes of cleaning by irradiation with 40 KHz and 240 W ultrasonic waves in a fluorine-based solvent is 70% or more.

Abstract: In a fracturing control apparatus, a first chemical agent storage tank is connected with a first delivery pump, and a material outlet of the first delivery pump communicates with a first position of a first fracturing fluid conveying pipeline. An outlet of the first fracturing fluid conveying pipeline communicates with an inlet of a fracturing pump, an outlet of the fracturing pump communicates with an inlet of a second fracturing fluid conveying pipeline, and a first flow detector is arranged at a second position of the second fracturing fluid conveying pipeline. The first delivery pump is connected with a first output interface of a controller, and the first flow detector is connected with a first input interface of the controller. The fracturing control apparatus and the control method of the fracturing control apparatus are used for adding chemical agents into fracturing fluids.

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

Abstract: The present disclosure describes a method for detecting the presence of Mycobacterium tuberculosis in a bodily fluid sample. The method utilizes CRISPR effector proteins along with a guide RNA and a reporter molecule, such that when the guide RNA hybridizes with a target nucleotide fragment, the CRISPR effector protein cleaves the reporter molecule, resulting in a detectable signal.

Abstract: An image processing method and apparatus belong to the technical field of communication. The method comprises: acquiring a target image including a shadow; and removing the shadow from the target image based on a target model, to acquire an image after shadow removal, wherein the target model is a model trained based on a target image sample including a shadow and a shadow image sample corresponding to the target image sample, the target image sample is a sample generated based on a captured shadow-free image sample and a preset emulated imaging condition, and the shadow image sample is a sample determined based on the target image sample and the shadow-free image sample.

Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

Abstract: A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

Abstract: In a fracturing control apparatus, a first chemical agent storage tank is connected with a first delivery pump, and a material outlet of the first delivery pump communicates with a first position of a first fracturing fluid conveying pipeline. An outlet of the first fracturing fluid conveying pipeline communicates with an inlet of a fracturing pump, an outlet of the fracturing pump communicates with an inlet of a second fracturing fluid conveying pipeline, and a first flow detector is arranged at a second position of the second fracturing fluid conveying pipeline. The first delivery pump is connected with a first output interface of a controller, and the first flow detector is connected with a first input interface of the controller. The fracturing control apparatus and the control method of the fracturing control apparatus are used for adding chemical agents into fracturing fluids.

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

Abstract: A method for controlling carbide network in a bearing steel wire rod by controlling cooling and rolling, comprises the following steps: rapidly rolling a bar to a wire rod and spinning it into a loose coil, controlling the rolling temperature at 780° C.-880° C.; and the spinning temperature at 750° C.-850° C.; carrying out on-line controlling cooling of continuous loose coils using EDC water bath austempering cooling process, controlling the cooling rate at 2.0° C./s-10° C./s, and controlling the final cooling temperature within 620-630° C.; after EDC water bath austempering cooling, using slow cooling under a cover, and the temperature is controlled to be 400° C.-500° C. when being removed out of the cover; after slow cooling, collecting coils, and cooling in air to the room temperature.

Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm?a?1 mm, and 0.2 mm?c?1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

Abstract: In a fracturing control apparatus, a first chemical agent storage tank is connected with a first delivery pump, and a material outlet of the first delivery pump communicates with a first position of a first fracturing fluid conveying pipeline. An outlet of the first fracturing fluid conveying pipeline communicates with an inlet of a fracturing pump, an outlet of the fracturing pump communicates with an inlet of a second fracturing fluid conveying pipeline, and a first flow detector is arranged at a second position of the second fracturing fluid conveying pipeline. The first delivery pump is connected with a first output interface of a controller, and the first flow detector is connected with a first input interface of the controller. The fracturing control apparatus and the control method of the fracturing control apparatus are used for adding chemical agents into fracturing fluids.

Abstract: The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: Provided is a periscopic camera module, which includes a first reflective element mounted on a first base, an optical lens mounted on a second substrate, a second reflective element mounted on a third substrate, and a photosensitive chip mounted on a fourth substrate. Particularly, the first reflective element is used to reflect the incident light to make it longitudinally turned; the optical lens is used to receive the reflected light which is longitudinally turned and output an imageable light beam; the second reflective element is a second prism, which is adapted to laterally turn the imageable light beam at least once and has a reflecting surface located on a side surface of the second prism; and the photosensitive chip is adapted to receive the imageable light beam laterally turned by the second reflective element. Also provided is a corresponding electronic device.

Abstract: A mounting device for quick and easy mounting of an electronic device includes a mounting rack, a locking mechanism, and a support rack. The locking mechanism includes a movable locking rack, a shaft connected to the locking rack, and a locking ring on the shaft. The support rack includes an engaging element and groove, and when the support rack is moved toward the mounting rack during mounting, the free end of the engaging element passes through the lower side of the locking rack, and pushes against the locking ring. When mounted on the mounting rack, the bottom of the locking ring is in the engaging groove. When the support rack is raised up, the engaging element raises the locking rack to the magnetic part, and the locking rack is magnetically held to the magnetic part.