Abstract: A semiconductor device includes a conductive layer formed on the surface of a post-passivation interconnect (PPI) structure by an immersion tin process. A polymer layer is formed on the conductive layer and patterned with an opening to expose a portion of the conductive layer. A solder bump is then formed in the opening of the polymer layer to electrically connect to the PPI structure.

Abstract: Provided are methods and compositions for inducing cells of the inner ear (for example, cochlear and utricular hair cells) to reenter to cell cycle and to proliferate. More particularly, the invention relates to the use of agents that increase c-myc activity and/or Notch activity for inducing cell cycle reentry and proliferation of cochlear or utricular hair cells and/or cochlear or utricular supporting cells. The methods and compositions can be used to promote the proliferation of hair cells and/or supporting cells to treat a subject at risk of or affected with, hearing loss or a subject at risk of or affected with vestibular dysfunction.

Abstract: An integrated circuit device includes a Cu pillar and a solder layer overlying the Cu pillar. A Co-containing metallization layer is formed to cover the Cu pillar and the solder layer, and then a thermally reflow process is performed to form a solder bump and drive the Co element into the solder bump. Next, an oxidation process is performed to form a cobalt oxide layer on the sidewall surface of the Cu pillar.

Abstract: The invention provides a multifunctional baby walker, which comprises a tray frame, a chassis frame, a supporting frame and roller wheels. The chassis frame comprises two side brackets respectively located at two sides of the baby walker and a front bracket for connecting front ends of the two side brackets. A lower portion of the supporting frame substantially is connected to the middle of the front bracket, the supporting frame has an accommodating space and a handle provided at an upper portion thereof. The baby walker also comprises a seat pocket assembly which comprises a front support rod, a seat pocket slidably connected to the front support rod along the extending direction of the front support rod, and rear support rods at two sides of the baby walker with rear ends respectively rotatably connected to rear portions of the side brackets. The rotation axis of the front support rod relative to the front bracket extends horizontally.

Abstract: A portable and reusable installation platform for easing the installation or maintenance of an air conditioner on a vertical wall includes at least one support base upon which at least part of the air conditioner is positioned during the installation or maintenance thereof. At least one connector extends from the first end of the support base and is configured to releasably engage the wall. At least one support leg extends downwardly from the support base and is configured to abut the wall to support the weight of the air conditioner placed upon the support base.

Abstract: The invention provides a multifunctional baby walker, which comprises a tray frame, a chassis frame, a supporting frame and roller wheels. The chassis frame comprises two side brackets respectively located at two sides of the baby walker and a front bracket for connecting front ends of the two side brackets. A lower portion of the supporting frame substantially is connected to the middle of the front bracket, the supporting frame has an accommodating space and a handle provided at an upper portion thereof. The baby walker also comprises a seat pocket assembly which comprises a front support rod, a seat pocket slidably connected to the front support rod along the extending direction of the front support rod, and rear support rods at two sides of the baby walker with rear ends respectively rotatably connected to rear portions of the side brackets. The rotation axis of the front support rod relative to the front bracket extends horizontally.

Abstract: A method of forming an integrated circuit device comprises forming a metal pillar over a semiconductor substrate. The method also comprises forming a solder layer over the metal pillar. The method further comprises forming a metallization layer comprising a cobalt (Co) element, the metallization layer covering the metal pillar and the solder layer. The method additionally comprises thermally reflowing the solder layer to form a solder bump, driving the Co element of the metallization layer into the solder bump. The method also comprises oxidizing the metallization layer to form a metal oxide layer on a sidewall surface of the metal pillar.

Abstract: A method includes forming a polymer layer over a metal pad, forming an opening in the polymer layer to expose a portion of the metal pad, and forming an under-bump-metallurgy (UBM). The UBM includes a portion extending into the opening to electrically couple to the metal pad.

Abstract: A method, device, and communications system for performing weighted processing on a downlink signal are provided. The method includes: acquiring a first CIR from a BS to a relay station and a second CIR from the relay station to a MS; determining a pre-coding weight and a relay weight according to the first CIR and the second CIR; and respectively sending the pre-coding weight and the relay weight to the BS and the relay station, so that the BS is enabled to perform weighted processing on a downlink signal according to the pre-coding weight to obtain a downlink pre-coding weighted signal and send the downlink pre-coding weighted signal to the relay station, and the relay station is enabled to perform weighted processing on the downlink pre-coding weighted signal received by the relay station according to the relay weight to obtain a downlink relay weighted signal and send the downlink relay weighted signal to the MS.

Abstract: Apparatus useful for allowing the flow of liquid down through a pluming fixture to a destination below it and limiting or preventing the backflow of gas from the destination up into the pluming fixture includes a frame and a disc pivotably connected thereto. The disc is biased in a closed position and pivotably moveable into an open position upon the application of sufficient forces acting on the upper surface thereof caused by fluid from the plumbing fixture.

Abstract: A method and system for performing a criticality analysis of a water distribution network is provided. The method and system provides for segmentation of the system which allows a user to determine the set of elements that comprise segments, which in turn are the smallest portion of a water distribution system that can be isolated by valving. Isolating valves are included as elements in the set of elements that are used by an associated hydraulic solver engine to segment the water distribution network. Once the network has been segmented, a criticality analysis is performed whereby a hydraulic simulation is run for an outage of one or more segments, and the shortfall in demand supplied to other segments is calculated. The system provides for a linking of the ability to automatically identify segments with a hydraulic analysis model to enable a user not only to identify segments, but to rank their importance based on a variety of user defined metrics.

Abstract: In one embodiment, a hydraulic simulation model corresponding to a real-world hydraulic network is loaded in a hydraulic modeling and simulation application executing on a computer system. The hydraulic simulation model represents leakages as pressure dependent emitter flow at selected nodes (leakage nodes). Optimization criteria include a specified maximum of possible leakage nodes. A genetic algorithm (GA) generates trial solutions for an optimization, each trial solution representing locations for leakage nodes and corresponding emitter coefficients. A hydraulic analysis is performed for the trial solutions to generated model-simulated results. The model-simulated results are compared to field-observed data for the real-world hydraulic network to generate goodness-of-fit values. The process is repeated until a particular goodness-of-fit value is achieved or a maximum number of iterations is reached.

Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.

Abstract: An uplink signal weighted processing method is disclosed. A first channel impulse response from a Mobile Station (MS) to a relay station, and a second channel impulse response from the relay station to a Base Station (BS) are acquired. A relay weight and a demodulation weight are determined according to the first channel impulse response and the second channel impulse response. The relay weight is sent to the relay station and the demodulation weight is sent to the BS, so as to enable the relay station to perform weighted processing on an MS uplink signal received by the relay station according to the relay weight to obtain an uplink relay weighted signal and to send the uplink relay weighted signal to the BS, and so as to enable the BS to perform demodulation weighted processing on the uplink relay weighted signal received by the BS according to the demodulation weight to obtain an uplink estimation signal corresponding to the MS uplink signal.

Abstract: A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.

Abstract: A method includes forming a polymer layer over a metal pad, forming an opening in the polymer layer to expose a portion of the metal pad, and forming an under-bump-metallurgy (UBM). The UBM includes a portion extending into the opening to electrically couple to the metal pad.

Abstract: A semiconductor device includes a conductive layer formed on the surface of a post-passivation interconnect (PPI) structure by an immersion tin process. A polymer layer is formed on the conductive layer and patterned with an opening to expose a portion of the conductive layer. A solder bump is then formed in the opening of the polymer layer to electrically connect to the PPI structure.

Abstract: A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.

Abstract: A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump.

Abstract: In one embodiment, a technique is disclosed for calculating a relative pump speed factor for attaining a prescribed hydraulic head or for pumping a prescribed amount of flow. A hydraulic model of a water distribution or collection system is defined to include link elements and node elements. At least one of the node elements represents a fixed-flow variable speed pump (VSP) that delivers a desired amount of flow, a variable speed pump battery (VSPB) that represents multiple VSPs operating in parallel with each other, a VSP with a tank located on the VSP's discharge side, or a VSP with a tank located on the VSP's suction side.