Abstract: A semiconductor device includes a conductive layer formed on the surface of a post-passivation interconnect (PPI) structure by an immersion tin process. A polymer layer is formed on the conductive layer and patterned with an opening to expose a portion of the conductive layer. A solder bump is then formed in the opening of the polymer layer to electrically connect to the PPI structure.

Abstract: A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.

Abstract: A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump.

Abstract: In one embodiment, a technique is disclosed for calculating a relative pump speed factor for attaining a prescribed hydraulic head or for pumping a prescribed amount of flow. A hydraulic model of a water distribution or collection system is defined to include link elements and node elements. At least one of the node elements represents a fixed-flow variable speed pump (VSP) that delivers a desired amount of flow, a variable speed pump battery (VSPB) that represents multiple VSPs operating in parallel with each other, a VSP with a tank located on the VSP's discharge side, or a VSP with a tank located on the VSP's suction side.

Abstract: An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer.

Abstract: Described are methods and compositions for increasing islet-1 (Isl1) activity (e.g., biological activity) and or expression (e.g., transcription and/or translation) in a biological cell and or in a subject.

Abstract: The disclosure relates to fabrication of to a metal pillar. An exemplary method of fabricating a semiconductor device comprises the steps of providing a substrate having a contact pad; forming a passivation layer extending over the substrate having an opening over the contact pad; forming a metal pillar over the contact pad and a portion of the passivation layer; forming a solder layer over the metal pillar; and causing sidewalls of the metal pillar to react with an organic compound to form a self-assembled monolayer or self-assembled multi-layers of the organic compound on the sidewalls of the metal pillar.

Abstract: A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump.

Abstract: The disclosure relates to fabrication of to a metal pillar. An exemplary method of fabricating a semiconductor device comprises the steps of providing a substrate having a contact pad; forming a passivation layer extending over the substrate having an opening over the contact pad; forming a metal pillar over the contact pad and a portion of the passivation layer; forming a solder layer over the metal pillar; and causing sidewalls of the metal pillar to react with an organic compound to form a self-assembled monolayer or self-assembled multi-layers of the organic compound on the sidewalls of the metal pillar.

Abstract: A computer software program provides an algorithm that solves for unknown demands (and junction pressures) within a modeling system that uses a generalized, unified loop-node formulation. The program can be used to calculate the available demand (i.e., the amount of water that is to be supplied) according to the nodal pressure. Both nodal heads and flows are simultaneously solved using a gradient algorithm, which allows, in accordance with the present invention, the model to simulate situations where a change in pressure affects the quantity of water used. Criticality analyses for segments of a system in such pressure dependent scenarios can also be performed using the software program of the present invention.

Abstract: An integrated circuit device includes a Cu pillar and a solder layer overlying the Cu pillar. A Co-containing metallization layer is formed to cover the Cu pillar and the solder layer, and then a thermally reflow process is performed to form a solder bump and drive the Co element into the solder bump. Next, an oxidation process is performed to form a cobalt oxide layer on the sidewall surface of the Cu pillar.

Abstract: A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump.

Abstract: An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer.

Abstract: A method, device, and communications system for performing weighted processing on a downlink signal are provided. The method includes: acquiring a first CIR from a BS to a relay station and a second CIR from the relay station to a MS; determining a pre-coding weight and a relay weight according to the first CIR and the second CIR; and respectively sending the pre-coding weight and the relay weight to the BS and the relay station, so that the BS is enabled to perform weighted processing on a downlink signal according to the pre-coding weight to obtain a downlink pre-coding weighted signal and send the downlink pre-coding weighted signal to the relay station, and the relay station is enabled to perform weighted processing on the downlink pre-coding weighted signal received by the relay station according to the relay weight to obtain a downlink relay weighted signal and send the downlink relay weighted signal to the MS.

Abstract: An uplink signal weighted processing method is disclosed. A first channel impulse response from a Mobile Station (MS) to a relay station, and a second channel impulse response from the relay station to a Base Station (BS) are acquired. A relay weight and a demodulation weight are determined according to the first channel impulse response and the second channel impulse response. The relay weight is sent to the relay station and the demodulation weight is sent to the BS, so as to enable the relay station to perform weighted processing on an MS uplink signal received by the relay station according to the relay weight to obtain an uplink relay weighted signal and to send the uplink relay weighted signal to the BS, and so as to enable the BS to perform demodulation weighted processing on the uplink relay weighted signal received by the BS according to the demodulation weight to obtain an uplink estimation signal corresponding to the MS uplink signal.

Abstract: A thin film type common mode noise filter and its fabrication method are disclosed. There are several electric insulation layers, coil lead layers and main coil layers are formed on an insulation substrate by means of processes of Lithography, Physical Vapor Deposition, etching or other chemical process. After that the structure is covered with an electric insulation gluing layer and a magnetic material layer so as to form a thin film type common mode noise filter with a low production cost but an improved filtering characteristic of the common mode noise.

Abstract: A micro-sized power source. A piezoelectric power generator, capable of harvesting energy from environmental vibration with lower level frequency, including a dielectric frame loosely containing a piezoelectric panel. The piezoelectric panel includes an electrode and a piezoelectric layer formed over an electrode and dielectric layer and an end mass formed on the piezoelectric layer. The end mass provides weight to cause the piezoelectric panel to move (vibrate) within the frame and causes the generation of electrical power.

Abstract: A color sequential method for displaying images is suitable for applying in a display with pixels. Each of frames is formed by displaying a first sub-frame, a second sub-frame and a third sub-frame within a displaying time by the pixels. By calculating differences in gray levels between neighboring pixels, variations are gained. Then, a first just noticeable difference is provided, and the pixels having the variations larger than the first just noticeable difference are detected. Next, times of displaying the first, the second and the third sub-frames in the pixels are raised within the displaying time.

Abstract: A water distribution model calibration technique is provided that allows a user to design a calibration model by selecting several input parameters desired to be used for the calibration of a model that allows an engineer to collect a complete set of data to represent the overall system conditions at any given time of day. For example, several parameters may be chosen including link status, the pipe roughness coefficient, junction demand, and pipe and valve operational status. Trial solutions of the model calibration are generated by a genetic algorithm program. A hydraulic network solver program then simulates each trial solution. A calibration module runs a calibration evaluation program to evaluate how closely the model simulation is to the observed data.

Abstract: The present invention relates to a wave-filtering device with an adjustable frequency bandwidth installed in an output unit of an integrated system. The wave-filtering device is used for receiving a first output signal comprising an alternating current signal and a direct current bias voltage, and comprises a direct current bias voltage detector for receiving the first output signal and obtaining a control voltage according to the direct current bias voltage. A low-pass wave filter is electrically connected to the direct current bias voltage detector and receives the control voltage so as to adjust the frequency bandwidth. The low-pass wave filter is used for receiving the first output signal and obtaining a second output signal to be the output of the wave-filtering device with adjustable frequency bandwidth. The low-pass wave filter comprises a variable resistance the value of which varies in accordance with the value of the control voltage.