Abstract: A cooling device includes a cooler. The cooler includes a base, a plurality of cooling fins secured to the base, and a heat pipe inserting through the cooling fins. Each cooling fin includes a fin body and a pressed portion extending from the fin body. The fin body includes a hole area, which defines a receiving hole. A portion of the heat pipe extends through the receiving hole; the pressed portion includes at least one guiding portion, which is configured to guide air to flow towards the hole area from the fin body.

Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.

Abstract: A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.

Abstract: A fan control system for a fan on a motherboard includes an I/O controller installed on the motherboard and a control circuit electrically connected to the I/O controller. The fan includes a motor and a rotation speed detecting chip. The I/O controller outputs a rotation speed control signal and a pulse width modulation (PWM) signal. The rotation speed detecting chip detects a rotation speed of the fan, and outputs a rotation speed feedback signal according to the rotation speed of the fan. The I/O controller receives the rotation speed feedback signal, and adjusts a duty cycle of the PWM signal accordingly to change the rotation speed of the fan. The control circuit receives the rotation speed control signal, and outputs a fan driving signal accordingly. The motor receives the fan driving signal, and drives the fan to rotate in a direction according to the fan driving signal.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

Abstract: An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.

Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.

Abstract: An exemplary data storage device cage includes a main body and an electrical connector positioned on the main body. The main body includes a rectangular flat plate and two side plates respectively extending upward from opposite edges of the flat plate. The flat plate has at least a pair of tabs opposite to each other. The at least two tabs are respectively contiguous with but offset inward from the two side plates and positioned to cooperatively hold a data storage device therebetween. The electrical connector is positioned between the two side plates for electrically connecting the data storage device to an external device.

Abstract: A fan speed control circuit includes a first fan, a second fan, a first temperature sensor, a second temperature sensor, a PWM regulator, and a driving module. The first temperature sensor senses a temperature of the first component to generate a first temperature signal. The second temperature sensor senses a temperature of a second component to generate a second temperature signal. The PWM regulator is connected to the first temperature sensor and the second temperature sensor. The PWM regulator generates a first PWM signal according to the first temperature signal and generates a second PWM signal according to the second temperature signal. The driving module is connected to the PWM regulator. The driving module generates a first driving voltage provided to the first fan according to the first PWM signal. The driving module also generates a second driving voltage provided to the second fan according to the second PWM signal.

Abstract: A mounting assembly includes a circuit board, a securing member and a heat dissipating device. A retainer is located on the circuit board. The securing member includes a positioning portion and a claw connected to the positioning portion. The heat dissipating device includes a base attached to the circuit board and a number of fins perpendicularly located on the base. The number of fins defines a number of first air paths and a number of second air paths substantially perpendicular to the number of first air paths. The positioning portion is received in at least one of the number of first air paths and at least one of the number of second air paths, and the claw is engaged with the retainer.

Abstract: An exemplary data storage device cage includes a main body and an electrical connector positioned on the main body. The main body includes a rectangular flat plate and two side plates respectively extending upward from opposite edges of the flat plate. The flat plate has at least a pair of tabs opposite to each other. The at least two tabs are respectively contiguous with but offset inward from the two side plates and positioned to cooperatively hold a data storage device therebetween. The electrical connector is positioned between the two side plates for electrically connecting the data storage device to an external device.

Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.

Abstract: A heat dissipation apparatus includes a heat dissipating device, a fan and an air guiding duct. The heat dissipating device includes a heat conduction core, a plurality of fins, and a pair of securing fin assemblies. The pair of securing fin assemblies includes a first securing fin, and a first securing hole defined in the first securing fin. The fan includes a bottom panel and a plurality of fan blades. The bottom panel defines a fixing hole. The air guiding duct is hollow and defines an air guiding opening communicating with the plurality of fan blades. The first securing hole is aligned with the fixing hole, a fixing member is engaged in the first securing hole and the fixing hole, and the fan is secured to the heat dissipating device.

Abstract: A heat dissipating module supporting apparatus includes a bracket, a heat conducting member, and a latch member. The bracket includes a securing portion. The securing portion defines a holding hole. The heat conducting member is engaged in the holding hole and comprises a body. The body comprises a first touching surface and a second touching surface opposite to the first touching surface. The first touching surface is configured to abut a heat dissipating module, and the second touching surface is configured to abut a heat generating part. The latch member secures the body to the securing portion and is removable from the securing portion to disengage the body from securing portion.

Abstract: An installation member includes at least two installation portions located on the installation member, each defining an installation hole, at least two resilient members, at least two blocking members, and at least two fasteners. Each fastener comprises a head and a shank. The head defines a receiving groove for preventing a hand tool from disengaging from the head during rotating the fastener. The shank is received the installation hole. Each resilient member is fit on the shank and elastically engaged between the head and the installation portion. Each blocking member is secured on the shank and abuts against a nearest end of the installation portion.

Abstract: A heat dissipating system includes an enclosure, which includes a rear plate and a side plate. A heat sink is mounted on the side plate. A power supply unit is mounted on the rear plate. A first fan is mounted in an inner room of the power supply unit. The power supply unit includes a bottom wall which defines a plurality of first vent holes and a rear wall which defines a plurality of second vent holes. The first fan is aligned to the plurality of second vent holes. The bottom wall is located above the heat sink. The first fan is adapted to rotate to drive air flowing in the power supply unit via the plurality of first vent holes from the heat sink, and following out of the power supply unit via the plurality of second vent holes.

Abstract: A cooling device for cooling an electronic component is disclosed. The cooling device comprises a cooler comprising a base, a plurality of first fins and a plurality of second fins. The plurality of first fins extends substantially perpendicular from the base, and the plurality of second fins are secured to the base. Each of the plurality of second fins is between adjacent two of the plurality of first fins. Each of the plurality of second fins comprises a plurality of body portions and a plurality of connecting pieces. Each of the plurality of connecting pieces connects adjacent two of the plurality of body portions.

Abstract: A heat sink apparatus includes a fin module, a base, a first heat pipe, and a second heat pipe. The base includes an upper surface and a lower surface. The first heat pipe includes a first connection portion having a first end and a second end. The first end is connected to a first receiving portion. The second end is connected to a first body. The first receiving portion is in contact with the upper surface. The first body extends through the fin module in a first direction. The second heat pipe includes a second connection portion having a first end connected to a second receiving portion and a second end connected to a second body. The second receiving portion is in contact with the upper surface. The second body extends through the fin module in a second direction substantially opposite to the first direction.

Abstract: A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.

Abstract: A heat dissipation system includes a base plate, a side plate perpendicularly to the base plate, a motherboard attached on the base plate, a first fan, and a second fan fixed on the side plate facing to the heat sink. The motherboard has a first heat source and a second heat source mounted thereon, a heat sink positioned on the first heat source, and a fan bracket mounted on the heat sink. The first fan is positioned on the fan bracket. A rotating axis of the first fan is perpendicular to that of the second fan.