Abstract: A heat sink assembly includes a base and a mounting apparatus. The base defines a stepped hole. A step is formed in the stepped hole. A cutout is defined on an edge of the base and communicates with the stepped hole. The mounting apparatus includes a bolt and a spring. The bolt defines a groove at a portion of the bolt to form an engaging portion thereof. The engaging portion passes through the cutout. The step engages in the groove of the bolt. The spring is retained around the bolt, received in the stepped hole, and abuts against the step to retain the bolt in the stepped hole.

Abstract: A method for controlling a fan speed is disclosed. The fan cools a CPU in a computer. The method includes defining a CPU-max-temp value of a CPU, such that the first fan speed is linearly enhanced with the increase of a real temperature value of the CPU, when the real temperature value of the CPU is lower than the CPU-max-temp value, and changing the CPU-max-temp value to a higher CPU-max-temp value in a basic input output system. A second fan speed is linearly enhanced with an increase of the real temperature value, when the real temperature value is lower than the higher CPU-max-temp value. The second fan speed is less than the first fan speed at the real temperature value.

Abstract: A heat dissipation device includes a heat sink (10) and a fan (30). The heat sink includes a plurality of fins (15), and a guiding portion (184) is formed in the fins. The fan is secured to the heat sink. An airflow (F) is generated by the fan for flowing through the heat sink. When the airflow meets with the guiding portion, the airflow is deflected. The deflected airflow is guided to flow across heat-generating elements.

Abstract: A heat sink includes a dissipating heat element and a thermal conducting element securely mounted on the dissipating heat element. The dissipating heat element has a base and a plurality of fins extending from the base. The base defines a cavity therein. The thermal conducting element has an inserting portion inserting in the cavity of the dissipating heat element, and a contacting portion for being in contact with an electronic device to thereby conduct heat generated by the electronic device to the dissipating heat element. A cross-sectional area of the contacting portion of the thermal conducting element is larger than that of the inserting portion of the thermal conducting element.

Abstract: A thermal device for cooling a heat generating source is provided, including a first portion and a second portion which is formed from the first portion, the area of the bottom of the second portion is smaller than the area of the bottom of the first portion, and the area of the bottom of the second portion accords with a contact surface area of the heat generating source.

Abstract: A heat dissipation device includes a heat sink (10) and a fan (30). The heat sink includes a plurality of fins (15), and a guiding portion (184) is formed in the fins. The fan is secured to the heat sink. An airflow (F) is generated by the fan for flowing through the heat sink. When the airflow meets with the guiding portion, the airflow is deflected. The deflected airflow is guided to flow across heat-generating elements.