THERMAL DEVICE FOR HEAT GENERATING SOURCE
A thermal device for cooling a heat generating source is provided, including a first portion and a second portion which is formed from the first portion, the area of the bottom of the second portion is smaller than the area of the bottom of the first portion, and the area of the bottom of the second portion accords with a contact surface area of the heat generating source.
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The present invention relates to thermal devices, and particularly to a thermal device for dissipating heat from or cooling off a heat generating source.
DESCRIPTION OF RELATED ARTComputers may not work properly when the temperature of their central processing units (CPUs) rises above 64° C. To prevent overheating of a CPU a thermal device is often attached to the CPU for heat dissipation.
What is needed, therefore, is a lower cost thermal device which still provides good heat sink performance.
SUMMARY OF THE INVENTIONA thermal device for dissipating heat from a heat generating source is provided. The thermal device includes a first portion, and a second portion formed on the bottom of the first portion. An area of a bottom of the second portion is smaller than an area of a bottom of the first portion, and the area of the bottom of the second portion accords with an area of a contacting surface of the heat generating source.
Other advantages and novel features will be drawn from the following detailed description of a preferred embodiment with attached drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
Referring to
As shown in
As shown in
Referring to
As shown in
In comparing the conventional thermal device 1 of
In comparing the conventional thermal device 1 with the thermal device 2 of the preferred embodiment under same testing conditions, (ambient temperature of 35° C., rotation speed of a cooling fan 3800 round/min, BTX style layout) we have the results:
It is evident that the cooling performance of the thermal device 2 of the preferred embodiment is comparable to the thermal device 1.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of a preferred embodiments, together with details of the structure and function of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims
1. A thermal device for a heat generating package, comprising:
- a plurality of fins; and
- a base having a first portion and a second portion, the first portion supporting the plurality of fins, and the second portion formed from a bottom of the first portion, the area of a contacting surface of the second portion being less than that of the bottom of the first portion, and according with that of a contacting surface of the heat generating package.
2. The thermal device as claimed in claim 1, further comprising at least a heat pipe extending from the base to the fins.
3. The thermal device as claimed in claim 2, wherein a portion of the heat pipe is exposed where the second portion does not cover the bottom of the first portion.
4. The thermal device as claimed in claim 2, wherein a hole is defined in the base for receiving the heat pipe, a top longitudinal portion of the hole is defined in the first portion, and a bottom longitudinal portion of the hole is defined in the second portion.
5. The thermal device as claimed in claim 1, wherein both the first portion and the second portion are slab-shaped metal blocks.
6. The thermal device as claimed in claim 1, wherein the second portion protrudes from the first portion.
7. The thermal device as claimed in claim 2, wherein the heat pipe is U-shaped.
8. A thermal device for cooling a heat generating source comprising:
- a base with a cross section having a top dimension wider than a bottom dimension, the area of a contacting surface of the base according with a contacting surface of the heat generating source;
- a plurality of fins extending from the base, and
- at least a heat pipe extending from the base to the fins.
9. The thermal device as claimed in claim 8, wherein the base includes a slab-shaped first portion and a slab-shaped second portion, the area of bottom of the second portion being smaller than the area of the bottom of the first portion.
10. The thermal device as claimed in claim 12, wherein a hole is defined in the base for receiving the heat pipe, a top longitudinal portion of the hole is defined in the first portion, and a bottom longitudinal portion of the hole is defined in the second portion.
11. The thermal device as claimed in claim 8, wherein the second portion protrudes from the first portion.
12. The thermal device as claimed in claim 8, wherein the heat pipe is U-shaped.
Type: Application
Filed: May 29, 2006
Publication Date: Jun 21, 2007
Applicant: HON HAI PRECISION INDUSTRY CO., LTD. (Tu-Cheng)
Inventors: Ning-Yu Wang (Shenzhen), Zhi-Jiang Yao (Shenzhen)
Application Number: 11/308,941
International Classification: F28F 1/00 (20060101);