Abstract: Treatments are provided to strengthen adhesion of an optical filter layer in a photovoltaic (PV) module to an encapsulant layer, or generally, between inorganic materials and organic polymers. The embodiments disclosed herein can provide five or more times the adhesive forces of untreated encapsulant-filter interfaces. As a result, the system can enhance long-term reliability of PV modules by reducing interface surface charges and dangling bonds and reducing gaps and cracks, thereby preventing moisture, impurities, and particles from entering the interface. The treated optical filter layer can result in a surface modification. In some embodiments, treating the optical filter layer includes applying a chemical treatment such as an acid or alkaline wash, and/or ultrasonic cleaning.

Abstract: Treatments are provided to strengthen adhesion of an optical filter layer in a photovoltaic (PV) module to an encapsulant layer, or generally, between inorganic materials and organic polymers. The embodiments disclosed herein can provide five or more times the adhesive forces of untreated encapsulant-filter interfaces. As a result, the system can enhance long-term reliability of PV modules by reducing interface surface charges and dangling bonds and reducing gaps and cracks, thereby preventing moisture, impurities, and particles from entering the interface. The treated optical filter layer can result in a surface modification. In some embodiments, treating the optical filter layer includes applying a chemical treatment such as an acid or alkaline wash, and/or ultrasonic cleaning.

Abstract: A system for fabricating a photovoltaic module is provided. During operation, the system can obtain a plurality of photovoltaic structures. A respective photovoltaic structure can include first and second metallic grids on first and second surfaces, respectively. The system can then encapsulates the photovoltaic structures between a first cover and a second cover using an encapsulant having a moisture vapor transmission rate (MVTR) less than a predetermined value, thereby preventing oxidation and corrosion of the metallic grids during the service life of the photovoltaic module.

Abstract: A system for fabricating a solar string is provided. The system obtains multiple photovoltaic structures. A photovoltaic structure comprises first and second metallic grids on first and second surfaces. The system applies, over the first and second grids, an organic coating, which covers a top surface of a first edge busbar of the first metallic grid and a top surface of a second edge busbar of the second metallic grid. The system removes portions of the organic coating to expose a portion of the top surface of the first edge busbar and a corresponding portion of the top surface of the second edge busbar, deposits conductive paste on the first edge busbar at locations where the organic coating is removed, and cascades the plurality of photovoltaic structures into a string by overlapping the first edge busbar of the photovoltaic structure with the second edge busbar of an adjacent photovoltaic structure.

Abstract: A system and method for fabricating a photovoltaic structure is provided. During fabrication, the system can apply a wax coating on at least one surface of a multilayer photovoltaic structure, the surface of the multilayer photovoltaic structure being electrically conductive. The system can then pattern the wax coating using one or more laser beams. The patterned wax coating includes a plurality of openings that expose portions of the electrically conductive surface of the multilayer photovoltaic structure.

Abstract: Systems and methods for fabricating a photovoltaic structure are provided. During fabrication, a patterned mask is formed on a first surface of a multilayer body of the photovoltaic structure, with openings of the mask corresponding to grid line locations of a first grid. Subsequently, a core layer of the first grid is deposited in the openings of the patterned mask, and a protective layer is deposited on an exposed surface of the core layer. The patterned mask is then removed to expose the sidewalls of the core layer. Heat is applied to the protective layer such that the protective layer reflows to cover both the exposed surface and sidewalls of the core layer.

Abstract: A wafer-holding apparatus for electroplating of a solar cell wafer is provided. The wafer has chamfered corners and comprises a plurality of busbar areas, wherein at least one busbar area is near an edge of the wafer. The wafer-holding apparatus includes a plurality of wafer-holding mechanisms for maintaining contact with a wafer. One of the plurality of wafer-holding mechanisms can be longer than at least one other wafer-holding mechanism, thereby facilitating secure contact with the busbar area near the edge of the wafer, which is shorter than other busbar areas on the wafer due to the chamfered corners.

Abstract: One embodiment can provide a photovoltaic structure. The photovoltaic structure can include a multilayer structure, which can include a base layer, a surface-field layer positioned on a first side of the base layer, and an emitter layer positioned on a second side of the base layer. The photovoltaic structure can further include a first metallic grid positioned on a first surface of the multilayer structure and a first organic coating covering at least sidewalls of the first metallic grid.

Abstract: Disclosed herein are systems, methods, and apparatus for forming low emissivity panels. A first dielectric layer is disposed over a substrate and includes a bi-metal oxide having tin and bismuth or niobium. A seed layer is disposed directly on the first dielectric layer. A reflective layer including silver is disposed directly on the seed layer. A barrier layer is disposed above the reflective layer. The barrier layer includes one of a nickel chromium titanium aluminum alloy or a nickel chromium titanium aluminum oxide. The nickel chromium titanium aluminum alloy or the nickel chromium titanium aluminum oxide includes between about 5% and about 10% by weight nickel, between about 25% and about 30% by weight chromium, between about 30% and about 35% by weight titanium, and between about 30% and about 35% by weight aluminum.

Abstract: Systems and methods for fabricating a photovoltaic structure are provided. During fabrication, a patterned mask is formed on a first surface of a multilayer body of the photovoltaic structure, with openings of the mask corresponding to grid line locations of a first grid. Subsequently, a core layer of the first grid is deposited in the openings of the patterned mask, and a protective layer is deposited on an exposed surface of the core layer. The patterned mask is then removed to expose the sidewalls of the core layer. Heat is applied to the protective layer such that the protective layer reflows to cover both the exposed surface and sidewalls of the core layer.

Abstract: Embodiments of the invention generally relate to methods and compositions for forming conformal coatings on textured substrates. More specifically, embodiments of the invention generally relate to sol-gel processes and sol-gel compositions for forming low refractive index conformal coatings on textured transparent substrates. In one embodiment a method of forming a conformal coating on a textured glass substrate is provided. The method comprises coating the textured glass substrate with a sol-gel composition comprising a solidifier. It is believed that use of the solidifier expedites the sol-gel transition point of the sol-gel composition leading to more conformal deposition of coatings on textured substrates.

Abstract: Embodiments provided herein describe methods for forming cadmium-manganese-telluride (CMT), such as for use in photovoltaic devices. A substrate including a material with a zinc blend crystalline structure is provided. CMT is formed above the substrate. During the formation of the CMT, cation-rich processing conditions are maintained. The resulting CMT may be more readily provided with p-type dopants when compared to conventionally-formed CMT.

Abstract: Coated articles are disclosed. The coated articles include a doped or alloyed silver layer sandwiched between two layers of transparent conductive oxide such as indium tin oxide (ITO). The doped silver or silver alloy layer can be thin, such as between 1. 5 to 20 nm and thus can be transparent. The doped silver or silver alloy can provide improved ductility property, allowing the conductive stack to be bendable. The transparent conductive oxide layers can also be thin, allowing the conductive stack can have improved ductility property.

Abstract: Embodiments provided herein describe low-e panels and methods for forming low-e panels. A transparent substrate is provided. A reflective layer is formed above the transparent substrate. An over-coating layer is formed above the reflective layer. The over-coating layer includes first, second, and third sub-layers. The second sub-layer is between the first and third sub-layers, and the first and third sub-layers include the same material.

Abstract: Low emissivity coated panels can be fabricated using a base layer having a low refractive index layer on a high refractive index layer. The low refractive index layer can have refractive index less than 1.5, and can include MgF2, CaF2, SiO2, or BO. The high refractive index layer can have refractive index greater than 2.3, and can include TiOx, NbOx, or BiOx. The multilayer base structure can allow color tuning with enhanced transmission, for example, as compared to similar structures having single layer base layer.

Abstract: Embodiments provided herein describe a low-e panel and a method for forming a low-e panel. A transparent substrate is provided. A metal oxide layer is formed over the transparent substrate. The metal oxide layer includes a first element, a second element, and a third element. A reflective layer is formed over the transparent substrate. The first element may include tin or zinc. The second element and the third element may each include tin, zinc, antimony, silicon, strontium, titanium, niobium, zirconium, magnesium, aluminum, yttrium, lanthanum, hafnium, or bismuth. The metal oxide layer may also include nitrogen.

Abstract: Methods and compositions for forming porous low refractive index coatings on substrates are provided. The method comprises coating a substrate with a sol-formulation comprising silica based nanoparticles and an alkyltrialkoxysilane based binder. Use of the alkyltrialkoxysilane based binder results in a porous low refractive index coating having bimodal pore distribution including mesopores formed from particle packing and micropores formed from the burning off of organics including the alkyl chain covalently bonded to the silicon. The mass ratio of binder to particles may vary from 0.1 to 20. Porous coatings formed according to the embodiments described herein demonstrate good optical properties (e.g. a low refractive index) while maintaining good mechanical durability due to the presence of a high amount of binder and a close pore structure.

Abstract: The present disclosure includes a texture formulation that includes an aliphatic diol, an alkaline compound and water which provides a consistent textured region across a silicon surface suitable for solar cell applications. The current invention describes silicon texturing formulations that include at least one high boiling point additive. The high boiling point additive may be a derivative compound of propylene glycol or a derivative compound of ethylene glycol. Processes for texturing a crystalline silicon substrate using these formulations are also described. Additionally, a combinatorial method of optimizing the textured surface of a crystalline silicon substrate is described.

Abstract: Embodiments provided herein describe methods for forming cadmium-manganese-telluride (CMT), such as for use in photovoltaic devices. A substrate including a material with a zinc blende crystalline structure is provided. CMT is formed above the substrate. During the formation of the CMT, cation-rich processing conditions are maintained. The resulting CMT may be more readily provided with p-type dopants when compared to conventionally-formed CMT.

Abstract: Embodiments provided herein describe a low-e panel and a method for forming a low-e panel. A transparent substrate is provided. A metal oxide layer is formed over the transparent substrate. The metal oxide layer includes a first element, a second element, and a third element. A reflective layer is formed over the transparent substrate. The first element may include tin or zinc. The second element and the third element may each include tin, zinc, antimony, silicon, strontium, titanium, niobium, zirconium, magnesium, aluminum, yttrium, lanthanum, hafnium, or bismuth. The metal oxide layer may also include nitrogen.