Abstract: The present disclosure provides a three-dimensional (3D) memory. The 3D memory may include a stack structure including gate layers and dielectric layers disposed alternately. The stack structure may include a step structure including a plurality of staircase structures disposed in a first direction and having different heights in a second direction. The 3D memory may include a plurality of first stops disposed in the first direction and located on the plurality of steps of at least one of the staircase structures, with each of the plurality of first stops disposed on the corresponding step of the plurality of steps. The 3D memory may include a protection layer covering the step structure and the first stops. The 3D memory may include a plurality of contact posts each extending through the protection layer and the first stop and being connected with the gate layer in the step corresponding to the first stop.

Abstract: According to one aspect of the present disclosure, a three-dimensional memory is provided. The three-dimensional memory may include a stack structure comprising a gate layer and a dielectric layer disposed alternately and comprising a plurality of steps. The three-dimensional memory may include an etch stop layer disposed on the plurality of steps. The three-dimensional memory may include a protective layer covering the stack structure and the etch stop layer. The three-dimensional memory may include a plurality of connection pillars. Each of the connection pillars penetrates through the protective layer and the etch stop layer on a corresponding step and is connected with the gate layer of the corresponding step.

Abstract: The present disclosure provides a method for forming a three-dimensional memory device. The method includes disposing an alternating dielectric stack on a substrate in a first direction perpendicular to the substrate; and forming a staircase structure and a dividing wall in the alternating dielectric stack. The staircase structure and the dividing wall extend in a second direction parallel to the substrate, and the dividing wall is adjacent to the staircase structure. The method also includes forming, sequentially on the staircase structure, a first barrier layer and a second barrier layer different from the first barrier layer. The method further includes forming a gate line slit (GLS) opening in the dividing wall. The GLS opening penetrates through the alternating dielectric stack in the first direction and is distant from the second barrier layer in a third direction that is parallel to the substrate and is perpendicular to the second direction.

Abstract: In a semiconductor device, a stack of alternating gate layers and insulating layers is formed. Channel structures are formed in an array region of the stack. A first staircase is formed at a first section of the stack. A second staircase is formed at a second section of the stack. A dummy staircase is formed at the first section and disposed between the first staircase and the second staircase. The dummy staircase includes dummy group stair steps descending in a second direction parallel to a plane defined by any one of the gate layers and the insulating layers, and dummy division stair steps descending in a third direction and a fourth direction parallel to the plane and perpendicular to the second direction. The third direction and the fourth direction are opposite to each other.

Abstract: A semiconductor device includes a first bottom select gate (BSG) staircase, a first array region, a connection region, a second array region, and a second BSG staircase that are formed in a stack and disposed sequentially along a first direction of a substrate. The stack is formed of word line layers and insulating layers that are alternatingly disposed over the substrate. The first BSG staircase is formed in a first group of the word line layers, and the insulating layers and the second BSG staircase are formed in a second group of the word line layers and the insulating layers. The connection region includes a first top select gate (TSG) staircase positioned along the first array region, and a second TSG staircase positioned along the second array region. The first TSG staircase is formed in a third group of the word line layers, and the insulating layers and the second TSG staircase are formed in a fourth group of the word line layers and the insulating layers.

Abstract: A composite plate includes a first plate (5); a second plate (16); and a first side surface of the first plate (5) including striations. A first side surface of the second plate (16) and the first side surface of the first plate (5) are rolled to connect, and wherein adjacent striations (14) have a pitch of 0.005 mm to 0.03 mm account for more than 90% of all the striations (14).

Abstract: A semiconductor device includes an insulating layer, a conductive layer stacking with the insulating layer, a spacer structure through the conductive layer and in contact with the insulating layer, a contact structure in the spacer structure and extending vertically through the insulating layer, and a channel structure including a semiconductor channel, a portion of the semiconductor channel being in contact with the conductive layer. The contact structure includes a first contact portion and a second contact portion in contact with each other.

Abstract: The present invention provides a composite plate, a composite plate roughening device, and a method for manufacturing a composite plate, and relates to the technical field of metal plate materials. The composite plate includes a first plate and a second plate, wherein a first side surface of the first plate is provided with striations, the first side surface of the second plate and the first side surface of the first plate are rolled to connect, and the striations of which adjacent ones have a pitch of 0.005 mm to 0.03 mm account for more than 90% of all the striations.

Abstract: A method for substantially increasing the level of Veillonella in human gut is described. The method involves taking a type of human milk oligosaccharide, i.e., 2?-Fucosyllactose, orally to increase the level of Veillonella in the human gut. The daily supplementing dosage of 2?-Fucosyllactose is between 2.0 to 4.5 g. The supplementing period is between 20 days and 60 days.

Abstract: In a method for fabricating a semiconductor device, an initial stack of sacrificial word line layers and insulating layers is formed over a substrate of the semiconductor device. The sacrificial word line layers and the insulating layers are disposed over the substrate alternately. A first staircase is formed in a first staircase region of a connection region of the initial stack. A second staircase is formed in a second staircase region of the connection region of the initial stack. The connection region of the initial stack includes a separation region between the first and second staircases, and the connection region is positioned between array regions of the initial stack at opposing sides of the initial stack.

Abstract: A three-dimensional (3D) memory device includes a memory stack including interleaved conductive layers and dielectric layers over a first side of a second semiconductor layer, channel structures extending vertically through the memory stack and into the second semiconductor layer, source contacts in contact with a second side of the second semiconductor layer opposite to the first side; and a backside interconnect layer over the second side of the second semiconductor layer and including interlayer dielectric (ILD) layers and a source line mesh on the ILD layers. The source contacts are distributed on a side of the source line mesh. The source contacts extend through the ILD layers and into the second semiconductor layer.

Abstract: A memory device includes a stack structure and a first beam structure. The memory device includes array regions and an intermediate region arranged between the array regions in a first lateral direction. The stack structure includes a first block and a second block arranged in a second lateral direction. Each of the first block and the second block includes a wall-structure region. In the intermediate region, the wall-structure regions of the first block and the second block are separated by a staircase structure. The first beam structure is located in the intermediate region and extends along the second lateral direction. The first beam structure is connected to the wall-structure regions of the first block and the second block. The first beam structure includes first dielectric layers and electrode layers that are alternately stacked.

Abstract: In certain aspects, a method for forming a three-dimensional (3D) memory device is provided. A stack structure including interleaved first dielectric layers and second dielectric layers is formed. A plurality of channel structures are formed in a first region of the stack structure. A staircase structure is formed in a second region of the stack structure. A first portion of each of the second dielectric layers is replaced with a conductive layer, such that the conductive layer is partially separated between the staircase structure and the plurality of channel structures by a remainder of the second dielectric layer.

Abstract: In a method for fabricating a semiconductor device, an initial stack is formed. The initial stack is formed of sacrificial layers and insulating layers that are alternatingly disposed over a substrate, and includes a first connection region, a first array region, and a second connection region that are disposed sequentially. A first initial staircase is formed in the first connection region and formed in a first group of sacrificial layers and insulating layers. A first top select gate staircase is formed in the second connection region, and formed in a second group of sacrificial layers and insulating layers. An etching process is subsequently performed in the first connection region to shift the first initial staircase toward the substrate along a vertical direction perpendicular to the substrate so as to form a first bottom select gate staircase.

Abstract: The present disclosure provides a method for forming a three-dimensional memory device. The method includes disposing an alternating dielectric stack on a substrate in a first direction perpendicular to the substrate; and forming a staircase structure and a dividing wall in the alternating dielectric stack. The staircase structure and the dividing wall extend in a second direction parallel to the substrate, and the dividing wall is adjacent to the staircase structure. The method also includes forming, sequentially on the staircase structure, a first barrier layer and a second barrier layer different from the first barrier layer. The method further includes forming a gate line slit (GLS) opening in the dividing wall. The GLS opening penetrates through the alternating dielectric stack in the first direction and is distant from the second barrier layer in a third direction that is parallel to the substrate and is perpendicular to the second direction.

Abstract: A method for making a metal material composite includes: contacting a first surface of a first plate with a second surface of a second plate; placing the first plate and the second plate in a recess in a circumferential direction of a first roller such that a third surface of the second plate contacts a bottom wall of the recess in a circumferential, the third surface being opposite the second surface, the first plate having a greater hardness than the second plate; and controlling a first roller and a second roller to rotate, thereby rolling to combine the first plate and the second plate into a composite plate, where a fourth surface of the first plate contacts a surface of the second roller and the fourth surface is opposite the first surface during the rolling.

Abstract: The present invention relates to the technical field of material processing and provides a method for making a metal material composite, including: contacting a first surface of a first plate with a second surface of a second plate; placing the first plate and the second plate in a recess in a circumferential direction of a first roller such that a third surface of the second plate contacts a bottom wall of the recess in a circumferential, the third surface being opposite the second surface, the first plate having a greater hardness than the second plate; and controlling a first roller and a second roller to rotate, thereby rolling to combine the first plate and the second plate into a composite plate, where a fourth surface of the first plate contacts a surface of the second roller and the fourth surface is opposite the first surface during the rolling.

Abstract: The present invention provides a composite plate, a composite plate roughening device, and a method for manufacturing a composite plate, and relates to the technical field of metal plate materials. The composite plate includes a first plate and a second plate, wherein a first side surface of the first plate is provided with striations, the first side surface of the second plate and the first side surface of the first plate are rolled to connect, and the striations of which adjacent ones have a pitch of 0.005 mm to 0.03 mm account for more than 90% of all the striations.

Abstract: A method of memory device fabrication includes, providing a structure that includes first layers including word lines interleaved respectively with first dielectric layers, second layers including second dielectric layers interleaved respectively with the first dielectric layers, wherein the second layers are adjacent to the first layers, forming vertical recesses each of which extend to a surface of a respective one of the second dielectric layers in a first direction through the second layers, etching a respective lateral recess to expose a surface of a respective one of the word lines, and filling each respective lateral recess with at least one conductive material, such that the at least one conductive material in the respective lateral recess is in contact with the respective one of the word lines through the exposed surface.

Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate, a memory stack including interleaved conductive layers and dielectric layers above the substrate, a plurality of channel structures each extending vertically through the memory stack, a semiconductor layer above and in contact with the plurality of channel structures, a plurality of source contacts above the memory stack and in contact with the semiconductor layer, a plurality of contacts through the semiconductor layer, and a backside interconnect layer above the semiconductor layer including a source line mesh in a plan view. The plurality of source contacts are distributed below and in contact with the source line mesh. A first set of the plurality of contacts are distributed below and in contact with the source line mesh.