Abstract: An apparatus includes first and second compute-in-memory (CIM) arrays. The first CIM array is configured to store weights corresponding to a filter tensor, to receive a first set of activations corresponding to a first receptive field of an input, and to process the first set of activations with the weights to generate a corresponding first tensor of output values. The second CIM array is configured to store a first copy of the weights corresponding to the filter tensor and to receive a second set of activations corresponding to a second receptive field of the input. The second CIM array is also configured to process the second set of activations with the first copy of the weights to generate a corresponding second tensor of output values. The first and second compute-in-memory arrays are configured to process the first and second receptive fields in parallel.

Abstract: A method performs XNOR-equivalent operations by adjusting column thresholds of a compute-in-memory array of an artificial neural network. The method includes adjusting an activation threshold generated for each column of the compute-in-memory array based on a function of a weight value and an activation value. The method also includes calculating a conversion bias current reference based on an input value from an input vector to the compute-in-memory array, the compute-in-memory array being programmed with a set of weights. The adjusted activation threshold and the conversion bias current reference are used as a threshold for determining the output values of the compute-in-memory array.

Abstract: In one embodiment, an electronic device includes a compute-in-memory (CIM) array that includes a plurality of columns. Each column includes a plurality of CIM cells connected to a corresponding read bitline, a plurality of offset cells configured to provide a programmable offset value for the column, and an analog-to-digital converter (ADC) having the corresponding bitline as a first input and configured to receive the programmable offset value. Each CIM cell is configured to store a corresponding weight.

Abstract: Digital compute-in-memory (DCIM) bit cell circuit layouts and DCIM array circuits for multiple operations per column are disclosed. A DCIM bit cell array circuit including DCIM bit cell circuits comprising exemplary DCIM bit cell circuit layouts disposed in columns is configured to evaluate the results of multiple multiply operations per clock cycle. The DCIM bit cell circuits in the DCIM bit cell circuit layouts each couples to one of a plurality of column output lines in a column. In this regard, in each cycle of a system clock, each of the plurality of column output lines receives a result of a multiply operation of a DCIM bit cell circuit coupled to the column output line. The DCIM bit cell array circuit includes digital sense amplifiers coupled to each of the plurality of column output lines to reliably evaluate a result of a plurality of multiply operations per cycle.

Abstract: Certain aspects provide a circuit for in-memory computation. The circuit generally includes an in-memory computation array having a plurality of computation circuits, each of the computation circuits being configured to perform a dot product computation. In certain aspects, each of the computation circuits includes a memory cell, a capacitive element, a precharge transistor coupled between an output of the memory cell and the capacitive element, and a read transistor coupled between a read bit line (RBL) and the capacitive element.

Abstract: Certain aspects provide a circuit for in-memory computation. The circuit generally includes a first memory cell, and a first computation circuit. The first computation circuit may include a first switch having a control input coupled to an output of the first memory cell, a second switch coupled between a node of the first computation circuit and the first switch, a control input of the second switch being coupled to a discharge word-line (DCWL), a capacitive element coupled between the node and a reference potential node, a third switch coupled between the node and a read bit-line (RBL), and a fourth switch coupled between the node and an activation (ACT) line.

Abstract: A bit cell circuit of a most-significant bit (MSB) of a multi-bit product generated in an array of bit cells in a compute-in-memory (CIM) array circuit is configured to receive a higher supply voltage than a supply voltage provided to a bit cell circuit of another bit cell corresponding to another bit of the multi-bit product. A bit cell circuit receiving a higher supply voltage increases a voltage difference between increments of an accumulated voltage, which can increase accuracy of an analog-to-digital converter determining a pop-count. A bit cell circuit of the MSB in the CIM array circuit receives the higher supply voltage to increase accuracy of the MSB which increases accuracy of the CIM array circuit output. A capacitance of a capacitor in the bit cell circuit of the MSB is smaller to avoid an increase in energy consumption due to the higher voltage.

Abstract: Certain aspects provide methods and apparatus for multiplication of digital signals. In accordance with certain aspects, a multiplication circuit may be used to multiply a portion of a first digital input signal with a portion of a second digital input signal via a first multiplier circuit to generate a first multiplication signal, and multiply another portion of the first digital input signal with another portion of the second digital input signal via a second multiplier circuit to generate a second multiplication signal. A third multiplier circuit and multiple adder circuits may be used to generate an output of the multiplication circuit based on the first and second multiplication signals.

Abstract: A compute-in-memory bitcell is provided that includes a pair of cross-coupled inverters for storing a stored bit. The compute-in-memory bitcell includes a logic gate for multiplying the stored bit with an input vector bit. An output node for the logic gate connects to a second plate of a capacitor. A first plate of the capacitor connects to a read bit line. A write driver controls a power supply voltage to the cross-coupled inverters, the first switch, and the second switch to capacitively write the stored bit to the pair of cross-coupled inverters.

Abstract: Compute-in-memory (CIM) bit cell array circuits include CIM bit cell circuits for multiply-accumulate operations. The CIM bit cell circuits include a memory bit cell circuit for storing a weight data in true and complement form. The CIM bit cell circuits include a true pass-gate circuit and a complement pass-gate circuit for generating a binary product of the weight data and an activation input on a product node. An RWL circuit couples the product node to a ground voltage for initialization. The CIM bit cell circuits also include a plurality of consecutive gates each coupled to at least one of the memory bit cell circuit, the true pass-gate circuit, the complement pass-gate circuit, and the RWL circuit. Each of the CIM bit cell circuits in the CIM bit cell array circuit is disposed in an orientation of a CIM bit cell circuit layout including the RWL circuit.

Abstract: Certain aspects provide methods and apparatus for binary computation. An example circuit for such computation generally includes a memory cell having at least one of a bit-line or a complementary bit-line; a computation circuit coupled to a computation input node of the circuit and the bit-line or the complementary bit-line; and an adder coupled to the computation circuit, wherein the computation circuit comprises a first n-type metal-oxide-semiconductor (NMOS) transistor coupled to the memory cell, and a first p-type metal-oxide-semiconductor (PMOS) transistor coupled to the memory cell, drains of the first NMOS and PMOS transistors being coupled to the adder, wherein a source of the first PMOS transistor is coupled to a reference potential node, and wherein a source of the first NMOS transistor is coupled to the computation input node.

Abstract: Certain aspects of the present disclosure provide a circuit for in-memory computation.

Abstract: A bit cell circuit of a most-significant bit (MSB) of a multi-bit product generated in an array of bit cells in a compute-in-memory (CIM) array circuit is configured to receive a higher supply voltage than a supply voltage provided to a bit cell circuit of another bit cell corresponding to another bit of the multi-bit product. A bit cell circuit receiving a higher supply voltage increases a voltage difference between increments of an accumulated voltage, which can increase accuracy of an analog-to-digital converter determining a pop-count. A bit cell circuit of the MSB in the CIM array circuit receives the higher supply voltage to increase accuracy of the MSB which increases accuracy of the CIM array circuit output. A capacitance of a capacitor in the bit cell circuit of the MSB is smaller to avoid an increase in energy consumption due to the higher voltage.

Abstract: In one embodiment, an electronic device includes a compute-in-memory (CIM) array that includes a plurality of columns. Each column includes a plurality of CIM cells connected to a corresponding read bitline, a plurality of offset cells configured to provide a programmable offset value for the column, and an analog-to-digital converter (ADC) having the corresponding bitline as a first input and configured to receive the programmable offset value. Each CIM cell is configured to store a corresponding weight.

Abstract: Certain aspects provide methods and apparatus for binary computation. An example circuit for such computation generally includes a memory cell having at least one of a bit-line or a complementary bit-line; a computation circuit coupled to a computation input node of the circuit and the bit-line or the complementary bit-line; and an adder coupled to the computation circuit, wherein the computation circuit comprises a first n-type metal-oxide-semiconductor (NMOS) transistor coupled to the memory cell, and a first p-type metal-oxide-semiconductor (PMOS) transistor coupled to the memory cell, drains of the first NMOS and PMOS transistors being coupled to the adder, wherein a source of the first PMOS transistor is coupled to a reference potential node, and wherein a source of the first NMOS transistor is coupled to the computation input node.

Abstract: Certain aspects provide methods and apparatus for multiplication of digital signals. In accordance with certain aspects, a multiplication circuit may be used to multiply a portion of a first digital input signal with a portion of a second digital input signal via a first multiplier circuit to generate a first multiplication signal, and multiply another portion of the first digital input signal with another portion of the second digital input signal via a second multiplier circuit to generate a second multiplication signal. A third multiplier circuit and multiple adder circuits may be used to generate an output of the multiplication circuit based on the first and second multiplication signals.

Abstract: Certain aspects provide a circuit for in-memory computation. The circuit generally includes a first memory cell, and a first computation circuit. The first computation circuit may include a first switch having a control input coupled to an output of the first memory cell, a second switch coupled between a node of the first computation circuit and the first switch, a control input of the second switch being coupled to a discharge word-line (DCWL), a capacitive element coupled between the node and a reference potential node, a third switch coupled between the node and a read bit-line (RBL), and a fourth switch coupled between the node and an activation (ACT) line.

Abstract: Certain aspects provide a circuit for in-memory computation. The circuit generally includes an in-memory computation array having a plurality of computation circuits, each of the computation circuits being configured to perform a dot product computation. In certain aspects, each of the computation circuits includes a memory cell, a capacitive element, a precharge transistor coupled between an output of the memory cell and the capacitive element, and a read transistor coupled between a read bit line (RBL) and the capacitive element.

Abstract: A charge sharing Compute In Memory (CIM) may comprise an XNOR bit cell with an internal capacitor between the XNOR output node and a system voltage. Alternatively, a charge sharing CIM may comprise an XNOR bit cell with an internal capacitor between the XNOR output node and a read bit line. Alternatively, a charge sharing CIM may comprise an XNOR bit cell with an internal cap between XNOR and read bit line with a separate write bit line and write bit line bar.

Abstract: A memory circuit that includes a memory bitcell. The memory bitcell includes a six-transistor circuit configuration, a first transistor coupled to the six-transistor circuit configuration, a second transistor coupled to the first transistor, a third transistor coupled to the second transistor, and a capacitor coupled to the second transistor and the third transistor. The memory circuit includes a read word line coupled to the third transistor, a read bit line coupled to the third transistor, and an activation line coupled to the second transistor. The memory bitcell may be configured to operate as a NAND memory bitcell. The memory bitcell may be configured to operate as a NOR memory bitcell.