Abstract: An apparatus includes an array of bit cells that include a first row of bit cells and a second row of bit cells. The apparatus also includes a first global read word line configured to be selectively coupled to the first row of bit cells and to the second row of bit cells. The apparatus further includes a second global read word line configured to be selectively coupled to the first row of bit cells and to the second row of bit cells. The apparatus also includes a global write word line configured to be selectively coupled to the first row of bit cells and to the second row of bit cells. The first global read word line, the second global read word line, and the global write word line are located in a common metal layer.

Abstract: A volatile and one-time program (OTP) compatible asymmetric memory cell may include a first pull-up transistor having a first threshold voltage. The asymmetric memory cell may also include a second pull-up transistor having a second threshold voltage that differs from the first threshold voltage. The asymmetric memory cell may further include a switch coupled to a well of the first pull-up transistor and the second pull-up transistor to alternate between a program voltage (Vpg) and a power supply voltage. The asymmetric memory cell may also include a peripheral switching circuit to control programming of the asymmetric memory cell.

Abstract: An OTP memory array includes a plurality of differential P-channel metal oxide semiconductor (PMOS) OTP memory cells programmable and readable in predetermined states of program and read operations, and is capable of providing sufficient margins against global process variations and temperature variations while being compatible with standard logic fin-shaped field effect transistor (FinFET) processes to obviate the need for additional masks and costs associated with additional masks.

Abstract: A semiconductor device for a one-time programmable (OTP) memory according to some examples of the disclosure includes a gate, a dielectric region below the gate, a source terminal below the dielectric region and offset to one side, a drain terminal below the dielectric region and offset to an opposite side from the source terminal, a drain side charge trap in the dielectric region capable of programming the semiconductor device, and a source side charge trap in the dielectric region opposite the drain side charge trap and capable of programming the semiconductor device.

Abstract: A method of operation of a static random access memory (SRAM) storage element includes programming a value to the SRAM storage element prior to a power-down event. The method further includes, in response to a power-on event at the SRAM storage element after the power-down event, increasing a supply voltage of the SRAM storage element and sensing a state of the SRAM storage element to determine the value programmed to the SRAM storage element prior to the power-down event. In a particular example, an apparatus includes the SRAM storage element and control circuitry coupled to the SRAM storage element. The control circuitry may be configured to program the value to the SRAM storage element, to increase the supply voltage, and to sense the state of the SRAM storage element to determine the value programmed to the SRAM storage element prior to the power-down event.

Abstract: An apparatus includes a static random-access memory and circuitry configured to initiate a corrective action associated with the static random-access memory. The corrective action may be initiated based on a number of static random-access memory cells that have a particular state responsive to a power-up of the static random-access memory.

Abstract: Aspects disclosed include static random access memory (SRAM) arrays having substantially constant operational yields across multiple modes of operation. In one aspect, a method of designing SRAM arrays with multiple modes operation is provided. The method includes determining performance characteristics associated with each mode of operation. SRAM bit cells configured to operate in each mode of operation are provided to the SRAM array. SRAM bit cells are biased to operate in a mode of operation using dynamic adaptive assist techniques, wherein the SRAM bit cells achieve a substantially constant operational yield across the modes. The SRAM bit cells have a corresponding type, wherein the number of SRAM bit cell types in the method is less than the number of modes of operation. Thus, each SRAM array may achieve a particular mode of operation without requiring a separate SRAM bit cell type for each mode, thereby reducing costs.

Abstract: An apparatus includes a first metal layer coupled to a bit cell. The apparatus also includes a third metal layer including a write word line that is coupled to the bit cell. The apparatus further includes a second metal layer between the first metal layer and the third metal layer. The second metal layer includes two read word lines coupled to the bit cell.

Abstract: Systems and methods are directed to an integrated circuit comprising a reduced height M1 metal line formed of an exemplary material with lower mean free path than Copper, for local routing of on-chip circuit elements of the integrated circuit, wherein the height of the reduced height M1 metal line is lower than a minimum allowed or allowable height of a conventional M1 metal line formed of Copper. The exemplary materials for forming the reduced height M1 metal line include Tungsten (W), Molybdenum (Mo), and Ruthenium (Ru), wherein these exemplary materials also exhibit lower capacitance and lower RC delays than Copper, while providing high electromigration reliability.

Abstract: Aspects disclosed in the detailed description include high-k (HK)/metal gate (MG) (HK/MG) multi-time programmable (MTP) switching devices, and related systems and methods. One type of HK/MG MTP switching device is an MTP metal-oxide semiconductor (MOS) field-effect transistor (MOSFET). When the MTP MOSFET is programmed, a charge trap may build up in the MTP MOSFET due to a switching electrical current induced by a switching voltage. The charge trap reduces the switching window and endurance of the MTP MOSFET, thus reducing reliability in accessing the information stored in the MTP MOSFET. In this regard, an HK/MG MTP switching device comprising the MTP MOSFET is configured to eliminate the switching electrical current when the MTP MOSFET is programmed. By eliminating the switching electrical current, it is possible to avoid a charge trap in the MTP MOSFET, thus restoring the switching window and endurance of the MTP MOSFET for reliable information access.

Abstract: A method of operation of a memory device includes, for each operating frequency of multiple operating frequencies, determining a target voltage level of a supply voltage. For example, a first target voltage level for a first operating frequency of the multiple operating frequencies is determined. The method includes accessing first data from the memory device while the memory device is operating at the first operating frequency and is powered by the supply voltage having a first voltage level. The method includes determining a first number of errors associated with the first data. The method further includes, in response to the first number of errors satisfying a threshold, adjusting the supply voltage to a second voltage level that is greater than the first voltage level.

Abstract: A method of forming fins of different materials includes providing a substrate with a layer of a first material having a top surface, masking a first portion of the substrate leaving a second portion of the substrate exposed, etching a first opening at the second portion, forming a body of a second material in the opening to a level of the top surface of the layer of the first material, removing the mask, and forming fins of the first material at the first portion and forming fins of the second material at the second portion. A finFET device having fins formed of at least two different materials is also disclosed.

Abstract: A semiconductor device includes a gate and a first active contact adjacent to the gate. Such a device further includes a first stacked contact electrically coupled to the first active contact, including a first isolation layer on sidewalls electrically isolating the first stacked contact from the gate. The device also includes a first via electrically coupled to the gate and landing on the first stacked contact. The first via electrically couples the first stacked contact and the first active contact to the gate to ground the gate.

Abstract: A method includes measuring a temperature of a sensor associated with a memory array. The method also includes calculating, at a voltage regulating device, an operating voltage based on the temperature and based on fabrication data associated with the memory array. The method further includes regulating, at the voltage regulating device, a voltage provided to the memory array based on the operating voltage.

Abstract: A method of operation of a static random access memory (SRAM) storage element includes programming a value to the SRAM storage element prior to a power-down event. The method further includes, in response to a power-on event at the SRAM storage element after the power-down event, increasing a supply voltage of the SRAM storage element and sensing a state of the SRAM storage element to determine the value programmed to the SRAM storage element prior to the power-down event. In a particular example, an apparatus includes the SRAM storage element and control circuitry coupled to the SRAM storage element. The control circuitry may be configured to program the value to the SRAM storage element, to increase the supply voltage, and to sense the state of the SRAM storage element to determine the value programmed to the SRAM storage element prior to the power-down event.

Abstract: Aspects disclosed include static random access memory (SRAM) arrays having substantially constant operational yields across multiple modes of operation. In one aspect, a method of designing SRAM arrays with multiple modes operation is provided. The method includes determining performance characteristics associated with each mode of operation. SRAM bit cells configured to operate in each mode of operation are provided to the SRAM array. SRAM bit cells are biased to operate in a mode of operation using dynamic adaptive assist techniques, wherein the SRAM bit cells achieve a substantially constant operational yield across the modes. The SRAM bit cells have a corresponding type, wherein the number of SRAM bit cell types in the method is less than the number of modes of operation. Thus, each SRAM array may achieve a particular mode of operation without requiring a separate SRAM bit cell type for each mode, thereby reducing costs.

Abstract: Static random access memory (SRAM) bit cells with wordlines on separate metal layers for increased performance are disclosed. In one aspect, an SRAM bit cell is disclosed employing a write wordline in a second metal layer, a first read wordline in a third metal layer, and a second read wordline in a fourth metal layer. Employing wordlines in separate metal layers allows wordlines to have increased widths, which decrease wordline resistance, decrease access time, and increase performance of the SRAM bit cell. To employ wordlines in separate metal layers, multiple tracks in a first metal layer are employed. To couple read wordlines to the tracks to communicate with SRAM bit cell transistors, landing pads are disposed on corresponding tracks disposed in the first metal layer. Landing pads corresponding to the write wordline are placed on corresponding tracks disposed in the first metal layer.

Abstract: Static random access memory (SRAM) bit cells with wordline landing pads split across boundary edges of the SRAM bit cells are disclosed. In one aspect, an SRAM bit cell is disclosed employing write wordline in second metal layer, first read wordline in third metal layer, and second read wordline in fourth metal layer. Employing wordlines in separate metal layers allows wordlines to have wider widths, which decrease wordline resistance, decrease access time, and increase performance of SRAM bit cell. To employ wordlines in separate metal layers, multiple tracks in first metal layer are employed. To couple read wordlines to the tracks to communicate with SRAM bit cell transistors, landing pads are disposed on corresponding tracks inside and outside of a boundary edge of the SRAM bit cell. Landing pads corresponding to the write wordline are placed on corresponding tracks within the boundary edge of the SRAM bit cell.

Abstract: Non-volatile memory devices and logic devices are fabricated using processes compatible with high dielectric constant/metal gate (HK/MG) processes for increased cell density and larger scale integration.

Abstract: Systems and methods are directed to an integrated circuit comprising a reduced height M1 metal line formed of an exemplary material with lower mean free path than Copper, for local routing of on-chip circuit elements of the integrated circuit, wherein the height of the reduced height M1 metal line is lower than a minimum allowed or allowable height of a conventional M1 metal line formed of Copper. The exemplary materials for forming the reduced height M1 metal line include Tungsten (W), Molybdenum (Mo), and Ruthenium (Ru), wherein these exemplary materials also exhibit lower capacitance and lower RC delays than Copper, while providing high electromigration reliability.