Method of chip transferring and device/module having gas guiding structures with suction openings and intake opening to apply predetermined pressure uniformly on back side of transferring substrate
A chip-transferring module, and a device and a method for transferring and bonding chips are provided. The chip-transferring module includes a mounting main body, a light-transmitting member, a first gas guiding structure and a second gas guiding structure. The mounting main body has a first accommodating space and a second accommodating space. The light-transmitting member is disposed in the first accommodating space. The first gas guiding structure is disposed in the mounting main body and has a plurality of suction openings exposed out of the mounting main body. The second gas guiding structure is disposed in the mounting main body and has at least one intake opening communicating with the second accommodating space.
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This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 110103158 filed in Taiwan, R.O.C. on Jan. 28, 2021, the entire contents of which are hereby incorporated by reference.
BACKGROUND OF THE INVENTION 1. Field of the InventionThe present disclosure relates to a chip transferring module, and a device and a method for transferring and bonding chips, and in particular to a chip transferring module, a chip transferring and die bonding device using a chip transferring module, and a chip transferring and die bonding method using a chip transferring module.
2. Description of the Related ArtIn the prior art, a light emitting diode chip may be transferred from a carrier to another carrier by means of picking and placing by a nozzle or pushing by a thimble, and the light emitting diode chip is mounted on a circuit substrate by means of external heating (for example, by a reflow furnace).
BRIEF SUMMARY OF THE INVENTIONA technical problem to be solved by the present invention is to provide a chip transferring module and a device and method for transferring and bonding chips for improving drawbacks of the prior art.
To solve the technical problem above, a chip transferring module is provided by a technical solution of the present invention. The chip transferring module includes a mounting main body, a light-transmitting member, a first gas guiding structure and a second gas guiding structure. The mounting main body has a first accommodating space and a second accommodating space. The light-transmitting member is disposed in the first accommodating space. The first gas guiding structure is disposed in the mounting main body and has a plurality of suction openings exposed out of the mounting main body. The second gas guiding structure is disposed in the mounting main body and has at least one intake opening communicating with the second accommodating space of the mounting main body.
To solve the technical problem above, a device for chip transferring and die bonding is provided. The device includes a substrate mounting module, a chip transferring module and a laser generating module. The substrate mounting module is for mounting a circuit substrate. The chip transferring module is for transferring a plurality of chips onto the circuit substrate. The laser generating module is for fixing the chips on the circuit substrate. The chip transferring module includes a mounting main body, a light-transmitting member, a first gas guiding structure and a second gas guiding structure. The mounting main body has a first accommodating space and a second accommodating space. The light-transmitting member is disposed in the first accommodating space. The first gas guiding structure is disposed in the mounting main body and has a plurality of suction openings exposed out of the mounting main body. The second gas guiding structure is disposed in the mounting main body and has at least one intake opening communicating with the second accommodating space of the mounting main body.
To solve the technical problem above, a method for chip transferring and die bonding is provided according to another technical solution of the present invention. The method includes: providing a transferring substrate having a front side on which a plurality of chips are mounted; moving the transferring substrate to dispose the plurality of chips on a circuit substrate; providing gas with a predetermined pressure to a back side of the transferring substrate to pressure the chips to contact with the circuit substrate tightly through the transferring substrate by the gas; fixing the chips on the circuit substrate; and removing the transferring substrate.
One benefit achieved by the present invention is that, the chip transferring and die bonding device and the chip transferring module thereof of the present invention, by the technical solutions “the mounting main body includes a first accommodating space and a second accommodating space”, “the light-transmitting member is disposed in the first accommodating space of the mounting main body”, “the first gas guiding structure is disposed in the mounting main body, and has a plurality of suction openings exposed out of the mounting main body” and “the second gas guiding structure is disposed in the mounting main body, and has at least one intake opening communicating with the second accommodating space of the mounting main body”, when a transferring substrate mounted with a plurality of chips is adsorbed at the bottom side of the mounting main body through suction of the plurality of suction openings of the first gas guiding structure and seals the second accommodating space, gas with a predetermined pressure is introduced via at least one intake opening of the second gas guiding structure and enters the second accommodating space of the mounting main body, such that the gas with the predetermined pressure uniformly pressures a back side of the transferring substrate.
Another benefit achieved by the present invention is that, in the method for chip transferring and die bonding of the present invention, by the technical solutions “providing a transferring substrate having a front side on which a plurality of chips are mounted”, “moving the transferring substrate to dispose the plurality of chips on a circuit substrate”, “providing gas with a predetermined pressure to a back side of the transferring substrate to pressure the plurality of chips to contact with the circuit substrate tightly through the transferring substrate by the gas”, “fixing the plurality of chips on the circuit substrate”, and “removing the transferring substrate”, when a transferring substrate mounted with a plurality of chips is adsorbed at the bottom side of the mounting main body through suction of the plurality of suction openings of the first gas guiding structure and seals the second accommodating space, gas with a predetermined pressure is introduced via at least one intake opening of the second gas guiding structure and enters the second accommodating space of the mounting main body, such that the gas with the predetermined pressure uniformly pressures a back side of the transferring substrate.
To further understand the features and technical contents of the present invention, the present invention is described in detail with the accompanying drawings below. It should be noted that the drawings provided are for reference and illustration purposes, and are not to be construed as limitations to the present invention.
The implementation related to “chip transferring module and device and method for chip transferring and die bonding” of the present invention are described by way of specific embodiments, and a person skilled in the art would be able to understand the advantages and effects of the present invention on the basis of the disclosure of the present application. The invention may be implemented or applied by other specific embodiments, and changes and modifications may also be made on the basis of different perspectives and applications to various details in the description without departing from the concept and spirit of the present invention. Moreover, it should be noted that the drawings of the present invention are depicted in brief for illustration purposes, and are not drawn to actual scales. Technical contents associated with the present invention are described in detail below, and it should be noted that the disclosure is not to be construed as limitations to the scope of protection of the present invention. In addition, the term “or” used in the literature may include one or more combinations of related enumerated items depending on actual conditions.
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One benefit achieved by the present invention is that, in the chip transferring and die bonding device D and the chip transferring module M2 thereof of the present invention, by the technical solutions “the mounting main body 1 includes a first accommodating space 1001 and a second accommodating space 1002”, “the light-transmitting member 2 is disposed in the first accommodating space 1001 of the mounting main body 1”, “the first gas guiding structure 3 is disposed in the mounting main body 1, and has a plurality of suction openings 3000 exposed out of the mounting main body 1” and “the second gas guiding structure 4 is disposed in the mounting main body 1, and has at least one intake opening 4000 communicating with the second accommodating space 1002 of the mounting main body 1”, when a transferring substrate S mounted with a plurality of chips C is adsorbed at the bottom side of the mounting main body 1 through suction of the plurality of suction openings 3000 of the first gas guiding structure 3 and seals the second accommodating space 1002, gas with a predetermined pressure is introduced via at least one intake opening 4000 of the second gas guiding structure 4 and enters the second accommodating space 1002 of the mounting main body 1, such that the gas with the predetermined pressure uniformly pressures a back side S1002 of the transferring substrate S. Thus, the plurality of chips C can tightly contact with the circuit substrate P by “the transferring plate S uniformly pressured by the gas”, thereby enhancing the electrical connection between the chips C and the circuit substrate P.
Another benefit achieved by the present invention is that, in the method for chip transferring and die bonding of the present invention, by the technical solutions “providing a transferring substrate S having a front side S1001 on which a plurality of chips C are mounted”, “moving the transferring substrate S to dispose the plurality of chips C on a circuit substrate P”, “providing gas with a predetermined pressure to a back side S1002 of the transferring substrate S to pressure the plurality of chips C to contact with the circuit substrate P tightly through the transferring substrate S by the gas”, “fixing the plurality of chips C on the circuit substrate P”, and “removing the transferring substrate S”, when a transferring substrate S mounted with a plurality of chips C is adsorbed at the bottom side of the mounting main body 1 through suction of the plurality of suction openings 3000 of the first gas guiding structure 3 and seals the second accommodating space 1002, gas with a predetermined pressure is introduced via at least one intake opening 4000 of the second gas guiding structure 4 and enters the second accommodating space 1002 of the mounting main body 1, such that the gas with the predetermined pressure uniformly pressures a back side S1002 of the transferring substrate S. Thus, the plurality of chips C can tightly contact with the circuit substrate P by “the transferring plate S uniformly pressured by the gas”, thereby enhancing the electrical connection between the chips C and the circuit substrate P.
The disclosure above are merely preferred feasible embodiments of the present invention and is not to be construed as limitations to the scope of claims of the present invention. It should be noted that all equivalent technical variations made to the description and the drawings of the present invention are to be encompassed within the scope of claims of the present invention.
Claims
1. A chip transferring module for mounting a transferring substrate with a plurality of chips, comprising:
- a mounting main body with a first accommodating space and a second accommodating space;
- a light-transmitting member disposed in the first accommodating space;
- a first gas guiding structure disposed in the mounting main body and having a plurality of suction openings exposed out of the mounting main body; and
- a second gas guiding structure disposed in the mounting main body and having at least one intake opening communicating with the second accommodating space.
2. The chip transferring module according to claim 1, wherein the first accommodating space and the second accommodating space are respectively formed on a top side and a bottom side of the mounting main body, and the first accommodating space and the second accommodating space are separated by the light-transmitting member from communicating with each other;
- wherein the first gas guiding structure has a plurality of first gas guiding passages respectively communicating with the plurality of suction openings, and the plurality of first gas guiding passages communicate with a gas extraction apparatus;
- wherein the second gas guiding structure has at least one second gas guiding passage communicating with the at least one intake opening, and the at least one second gas guiding passage communicates with a gas supplying apparatus.
3. The chip transferring module according to claim 1, further comprising a gas leakproof structure, wherein the gas leakproof structure comprises a first gas leakproof ring disposed in the first accommodating space and a second gas leakproof ring disposed on a bottom side of the mounting main body;
- wherein the first gas leakproof structure is disposed between the mounting main body and the light-transmitting member for preventing gas in the second accommodating space from leaking into the first accommodating space;
- wherein the second gas leakproof ring is partially exposed out of the bottom side of the mounting main body.
4. The chip transferring module according to claim 1, further comprising at least one top side platen and a plurality of screws, wherein the top side platen is secured in the first accommodating space through the plurality of screws for abutting against and exerting a predetermined pressure to the light-transmitting member;
- wherein the light-transmitting member has an exposed portion corresponding to the second accommodating space, and the top side platen provides a penetrating opening corresponding to the exposed portion.
5. The chip transferring module according to claim 1, wherein the first gas guiding structure comprises a plurality of suction nozzles exposed out of a bottom portion of the mounting main body, and the plurality of suction openings are respectively disposed on the plurality of suction nozzles.
6. A method of chip transferring and die bonding, comprising:
- providing a transferring substrate having a front side on which a plurality of chips are mounted;
- moving the transferring substrate to dispose the plurality of chips on a circuit substrate;
- providing gas with a predetermined pressure to a back side of the transferring substrate for pressuring the plurality of chips to contact with the circuit substrate tightly through the transferring substrate by the gas;
- fixing the plurality of chips on the circuit substrate; and
- removing the transferring substrate.
7. The method according to claim 6, wherein the transferring substrate is adsorbed through suction of a first gas guiding structure of a chip transferring module, and the gas is provided to the back side of the transferring substrate through guiding of a second gas guiding structure of the chip transferring module.
8. The method according to claim 7, wherein the plurality of chips are fixed on the circuit substrate through illumination of a light source generated by a laser generating module, and the transferring substrate is detached from the plurality of chips fixed on the circuit substrate through mounting of the chip transferring module.
9. A device for chip transferring and die bonding, comprising:
- a substrate mounting module for mounting a circuit substrate;
- a chip transferring module for transferring a plurality of chips onto the circuit substrate; and
- a laser generating module for fixing the plurality of chips on the circuit substrate;
- wherein the chip transferring module comprises: a mounting main body with a first accommodating space and a second accommodating space; a light-transmitting member disposed in the first accommodating space; a first gas guiding structure disposed in the mounting main body and having a plurality of suction openings exposed out of the mounting main body; and a second gas guiding structure disposed in the mounting main body and having at least one intake opening communicating with the second accommodating space.
10. The device according to claim 9, further comprising a gas extraction apparatus and a gas supplying apparatus, wherein the first gas guiding structure has a plurality of first gas guiding passages respectively communicating with the plurality of suction openings, and the plurality of first gas guiding passages communicate with the gas extraction apparatus;
- wherein the second gas guiding structure has at least one second gas guiding passage communicating with the at least one intake opening, and the at least one second gas guiding passage communicates with the gas supplying apparatus.
11018041 | May 25, 2021 | Liao |
WO-2018061896 | April 2018 | WO |
WO-2019188105 | October 2019 | WO |
Type: Grant
Filed: Nov 30, 2021
Date of Patent: Oct 1, 2024
Patent Publication Number: 20220238358
Assignee: Micraft System Plus Co., Ltd. (Taoyuan)
Inventors: Chien-Shou Liao (Taichung), Shao-Wei Huang (Taichung), Ching-Ju Lin (Taichung)
Primary Examiner: Ermias T Woldegeorgis
Application Number: 17/537,517