METHOD OF FORMING A DEVICE SEPARATION REGION

Abstract

An object of the present invention is to improve a margin for the formation of a trench device separation region at photolitho.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] This invention relates to a method of manufacturing a semiconductor device, and particularly to the formation of an embedded portion such as a device separation region or the like.

[0003] 2. Description of the Related Art

[0004] Attention has been focused on a device separation technique using trenches as a technique for forming device separation regions employed in a semiconductor device.

[0005] A conventional process for forming device separation regions using trenches has been disclosed in Japanese Patent Application Laid-Open No. Hei 9-102539.

[0006] In the conventional device separation region forming method, resists are left above portions where the trenches are defined, regardless of the widths of device separation regions to be formed. A silicon oxide film has been etched with the resists as masks.

[0007] With advances in miniaturization of a semiconductor element or chip, leaving resists on trenches extremely narrow in width is becoming extremely difficult.

[0008] The formation of resist patterns over a silicon oxide film encounters difficulties in accurately aligning masks over the pre-formed trenches in regions above the trenches narrow in width. There is a possibility that when a displacement in alignment occurs even slightly, the resists and trenches will be shifted in position from each other on the trenches extremely narrow in width.

SUMMARY OF THE INVENTION

[0009] An object of the present invention is to solve the above-described problems.

[0010] According to one aspect of this invention, for achieving the above object, there is provided a method for forming a device separation region, comprising the following steps:

[0011] a step for forming a plurality of trenches each serving as the device separation region over a semiconductor substrate;

[0012] a step for forming an insulating film over the plurality of trenches and the semiconductor substrate;

[0013] a step for forming resists over the insulating film;

[0014] a step for leaving only the resists formed above the trenches each having a width larger than a predetermined width, of the plurality of trenches;

[0015] a step for removing the insulating film by etching with the remaining resists as masks; and

[0016] a step for removing the remaining insulating film by chemical machine polishing after the removal of the remaining resists and forming the trenches buried by the insulating film.

[0017] Typical ones of various inventions of the present application have been shown in brief. However, the various inventions of the present application and specific configurations of these inventions will be understood from the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] While the specification concludes with claims particularly pointing out and distinctly claiming the subject matter which is regarded as the invention, it is believed that the invention, the objects and features of the invention and further objects, features and advantages thereof will be better understood from the following description taken in connection with the accompanying drawings in which:

[0019] FIG. 1 is a process diagram showing process steps employed in a method for forming a device separation region, according to a first embodiment of the present invention; and

[0020] FIG. 2 is a process diagram illustrating process steps employed in a method for forming a device separation region, according to a second embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Preferred embodiments of the present invention will hereinafter be described in detail with reference to the accompanying drawings.

[0022] (First Embodiment)

[0023] FIG. 1 is a diagram showing a method for forming buried or embedded portions, according to a first embodiment of the present invention. The first embodiment of the present invention will be described below with reference to FIG. 1.

[0024] A PAD oxide film 15 having a thickness of about 2000 Å is formed over a semiconductor substrate 11 by CVD. Thereafter, an SiN film 16 having thicknesses ranging from about 500 Å to 5000 Å is formed thereon by CVD in the same manner as described above. Afterwards, a resist is applied over the entire surface of the SiN film 16 and resists 14 are patterned by using a mask having patterns for trench forming portions (see FIG. 1-A).

[0025] With the resists 14 as masks, the SiN film 16 and the PAD oxide film 15 are plasma-etched to open portions for forming trenches.

[0026] Thereafter, the silicon substrate 11 is etched to form trench portions or trenches 12. The trenches formed at this time range from 2500 Å to 5000 Å in depth and have shapes with slight tapered or cone angles ranging from about 70° to 90° as angles in the vicinity of the surface of the silicon substrate 11. Namely, each trench 12 is formed such that the width of an opening thereof is slightly wider than that of the bottom. Thus, the tapered angles are formed in the trenches 12 to sufficiently embed the oxide film up to the neighborhood of the bottoms of the trenches 12 in the subsequent oxide-film embedding process step.

[0027] Thereafter, a buried oxide film 13 having a thickness of about 10000 Å is formed over the entire surface of the wafer. According to this process step, the oxide film 13 is embedded in the trenches 12 (see FIG. 1-B).

[0028] Resists 14′ are formed only over their corresponding trenches each having a width of 0.8 &mgr;m or more by using masks different from the above-described masks (see FIG. 1-C).

[0029] Thereafter, the buried oxide film 13 is removed by etching up to the neighborhood of the surface of the SiN film 16 (see FIG. 1-D) with the resists 14′ as the masks.

[0030] After its etching, the resists 14′, which remain on the trenches each having the width of 0.8&mgr; or more, are removed (see FIG. 1-E).

[0031] The buried oxide film 13, which is left over each trench large in width, is polished up to the surface of the SiN film 16 by chemical machine polishing (CMP). Thereafter, a trench device separation forming process is finished (see FIG. 1-F).

[0032] According to the device separation region forming method of the present invention, such additional masks as to avoid the resists 14′ from being left on the trenches narrow in width are created. Thus, although it is necessary to create the additional masks, a margin for mask misalignment or the like increases.

[0033] Further, the resists 14′ are respectively left on the trenches broad in width and the buried oxide films 13 are etched with the resists 14′ as the masks. When the buried oxide film 13 is etched without having to use any mask, the buried oxide film 13 on each trench broad in width is excessively etched so that the sufficient thickness of the oxide film cannot be maintained in the vicinity of the center of each trench. This state varies depending on to which thickness the buried oxide film 13 should be formed. According to the experiences of the present inventors, when a buried oxide film on a trench having such a width as to exceed about 80 percent of the thickness of the buried oxide film 13 is removed by etching, it has been confirmed that the buried oxide film located in the neighborhood of the center of the trench would take an excessively etched-shape. Thus, according to the present invention, the buried oxide film 13 on each trench having the width of 0.8 &mgr;m or more is polished and removed by using CMP. As a result, there is no fear of the buried oxide film on each wide trench being excessively etched in the vicinity of the center thereof.

[0034] (Second Embodiment)

[0035] FIG. 2 is a diagram showing a method for forming embedded portions, according to a second embodiment of the present invention. The second embodiment is similar to the first embodiment in process steps up to a process step for removing buried oxide films 23 by etching (see FIGS. 2-A through 2-D).

[0036] After the etching thereof, resists 24′ left on trenches each having a width of 0.8 &mgr;m or more are removed (see FIG. 2-E).

[0037] In the embodiment of the present invention, no resists serving as masks with respect to etching exist on trenches narrow in width. In this case, concave portions might be formed in the central portions of the trenches as shown in FIG. 2-E although they are extremely small. Therefore, a CVD oxide film 27 of about several tens of Å is formed over the entire surface of a substrate in the second embodiment after the removal of the resists 24′ (see FIG. 2-F).

[0038] Owing to this process step, there is no danger of the concave portions being formed even on the trenches in which the resists 24′ serving as the masks did not exist. Thereafter, the remaining buried oxide films 23 are polished to the surface of an SiN film by Chemical Machine Polishing (CMP), followed by completion of a process step for forming trench device separation (see FIG. 2-G).

[0039] According to the device separation region forming method of the second embodiment of the present invention, since the CVD oxide film 27 of about several tens of A is formed over the entire surface of the substrate after the removal of the resists 24′ in addition to the effects described in the first embodiment, there is no possibility of the concave portions being formed even on the trenches with no resists 24′ serving as the masks.

[0040] While the present invention has been described with reference to the illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications of the illustrative embodiments, as well as other embodiments of the invention, will be apparent to those skilled in the art on reference to this description. It is therefore contemplated that the appended claims will cover any such modifications or embodiments as fall within the true scope of the invention.

Claims

1. A method for forming a device separation region, comprising the following steps:

a step for forming a plurality of trenches each serving as the device separation region in a semiconductor substrate;

a step for forming an insulating film over said plurality of trenches and said semiconductor substrate;

a step for forming resists over said insulating film;

a step for leaving only the resists formed above the trenches each having a width larger than a predetermined width, of said plurality of trenches;

a step for removing said insulating film by etching with said remaining resists as masks; and

a step for removing the remaining insulating film by chemical machine polishing after the removal of said remaining resists and forming the trenches buried by said insulating film.

2. The method according to

claim 1, wherein said predetermined width is a thickness corresponding to 80 percent of the thickness of said insulating film.

3. The method according to

claim 1, wherein said insulating film is an oxide film.

4. The method according to

claim 1, wherein said each trench has an opening wider than the bottom thereof.

5. The method according to

claim 1, wherein said trench is shaped in tapered form.

6. The method according to

claim 5, wherein the tapered shape of said each trench has tapered angles ranging from above 70° to less than 90° with respect to the surface of said semiconductor substrate.

7. A method for forming a device separation region, comprising the following the steps:

a step for forming a plurality of trenches each serving as the device separation region in a semiconductor substrate;

a step for forming a first insulating film over said plurality of trenches and said semiconductor substrate;

a step for forming resists on said first insulating film;

a step for leaving only the resists formed above the trenches each having a width larger than a predetermined width, of said plurality of trenches;

a step for removing said first insulating film by etching with said remaining resists as masks;

a step for forming a second insulating film over the entire surface of said semiconductor substrate; and

a step for removing said first and second insulating films by chemical machine polishing and forming the trenches buried by said insulating films.

8. The method according to

claim 7, wherein said predetermined width is a thickness corresponding to 80 percent of the thickness of said each insulating film.

9. The method according to

claim 7, wherein said insulating films are respectively an oxide film.

10. The method according to

claim 7, wherein said each trench has an opening wider than the bottom thereof.

11. The method according to

claim 7, wherein said trench is shaped in tapered form.

12. The method according to

claim 11, wherein the tapered shape of said each trench has tapered angles ranging from above 70° to less than 90° with respect to the surface of said semiconductor substrate.